28.01.99
by SEMIKRON
SKiiP 432 GB 120 - 207 CTV
Absolute Maximum Ratings
Symbol
Conditions
1)
Values
Units
V
isol
4)
AC, 1min
3000
V
T
op
,T
stg
Operating / stor. temperature
-25...+85
C
IGBT and Inverse Diode
V
CES
1200
V
V
CC
5)
Operating DC link voltage
900
V
I
C
IGBT
400
A
T
j
3)
IGBT + Diode
-40...+150
C
I
F
Diode
400
A
I
FM
Diode, t
p
< 1 ms
800
A
I
FSM
Diode, T
j
= 150 C, 10ms; sin
2880
A
I
2
t (Diode) Diode, T
j
= 150 C, 10ms
41
kAs
2
Driver
V
S1
Stabilized Power Supply
18
V
V
S2
Non-stabilized Power Supply
30
V
f
smax
Switching frequency
20
kHz
dV/dt
Primary to secondary side
75
kV/s
Characteristics
Symbol
Conditions
1)
min.
typ.
max.
Units
IGBT
11)
V
(BR)CES
Driver without supply
V
CES
-
-
V
I
CES
V
GE
= 0,
T
j
= 25 C
V
CE
= V
CES
T
j
= 125 C
-
-
-
20
0,8
-
mA
mA
V
TO
T
j
= 125 C
-
-
1,38
V
r
T
T
j
= 125 C
-
-
5,3
m
V
Cesat
I
C
= 350A,
T
j
= 125 C
-
-
3,2
V
V
Cesat
I
C
= 350A,
T
j
= 25 C
-
-
3,05
V
E
on
+ E
off
V
CC
=600/900V,I
C
=400A
T
j
= 125 C
-
-
120/195
mJ
C
CHC
per SkiiP, AC side
-
2,8
-
nF
L
CE
Top, Bottom
-
7,5
-
nH
Inverse Diode
2)
V
F
= V
EC
I
F
= 350A;
T
j
= 125 C
-
-
2,45
V
V
F
= V
EC
I
F
= 350A;
T
j
= 25 C
-
-
2,55
V
E
on
+ E
off
I
F
= 400A;
T
j
= 125 C
-
-
16
mJ
V
TO
T
j
= 125 C
-
0,91
-
V
r
T
T
j
= 125 C
-
2,9
-
m
Thermal Characteristics
R
thjs
10)
per IGBT
-
-
0,064
C/W
R
thjs
10)
per Diode
-
-
0,188
C/W
R
thsa
6,10)
P16 heatsink; see case S2
-
-
0,044
C/W
Driver
I
S1
Supply current 15V-supply
210+320*f
s
/f
smax
+1,3*I
AC
/A
mA
I
S2
Supply current 24V-supply
160+220*f
s
/f
smax
+1,0*I
AC
/A
mA
t
interlock-driver
Interlock-time
3,3
s
SKiiPPACK protection
I
TRIPSC
Short circuit protection
500
2%
A
I
TRIPLG
Ground fault protection
-
A
T
TRIP
Over-temp. protection
115
5%
C
U
DCTRIP
9)
U
DC
-protection
920
2%
V
Mechanical Data
M1
DC terminals, SI Units
4
-
6
Nm
M2
AC terminals, SI Units
8
-
10
Nm
SKiiPPACK
SK integrated intelligent
Power PACK
halfbridge
SKiiP
432 GB 120 - 207 CTV
7,9)
Preliminary Data
Case S2
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal
thermal
management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
heatsink
= 25 C, unless
otherwise specified
2)
CAL = Controlled Axial Lifetime
Technology (soft and fast)
3)
without driver
4)
Driver input to DC link/ AC
output to heatsink
5)
with Semikron-DC link (low
inductance)
6)
other heatsinks on request
7)
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
8)
AC connection busbars must be
connected by the user; copper
busbars available on request
9)
options available for driver:
U - DC link voltage sense
F Fiber optic connector
10)
"
s
" referenced to temperature
sensor
11)
NPT-technology with homo-
genous current-distribution
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