10.03.99
by SEMIKRON
SKiiP 632 GB 120 - 315 CTV
Absolute Maximum Ratings
Symbol
Conditions
1)
Values
Units
V
isol
4)
AC, 1min
3000
V
T
op
,T
stg
Operating / stor. temperature
-25...+85
C
IGBT and Inverse Diode
V
CES
1200
V
V
CC
5)
Operating DC link voltage
900
V
I
C
IGBT
600
A
T
j
3)
IGBT + Diode
-40...+150
C
I
F
Diode
600
A
I
FM
Diode, t
p
< 1 ms
1200
A
I
FSM
Diode, T
j
= 150 C, 10ms; sin
4320
A
I
2
t (Diode) Diode, T
j
= 150 C, 10ms
93
kAs
2
Driver
V
S1
Stabilized Power Supply
18
V
V
S2
Non-stabilized Power Supply
30
V
f
smax
Switching frequency
20
kHz
dV/dt
Primary to secondary side
75
kV/s
Characteristics
Symbol
Conditions
1)
min.
typ.
max.
Units
IGBT
11)
V
(BR)CES
Driver without supply
V
CES
-
-
V
I
CES
V
GE
= 0,
T
j
= 25 C
V
CE
= V
CES
T
j
= 125 C
-
-
-
30
1,2
-
mA
mA
V
TO
T
j
= 125 C
-
-
1,38
V
r
T
T
j
= 125 C
-
-
3,5
m
V
Cesat
I
C
= 525A,
T
j
= 125 C
-
-
3,2
V
V
Cesat
I
C
= 525A,
T
j
= 25 C
-
-
3,05
V
E
on
+ E
off
V
CC
=600/900V,I
C
=600A
T
j
= 125 C
-
-
180/293
mJ
C
CHC
per SkiiP, AC side
-
4,2
-
nF
L
CE
Top, Bottom
-
5
-
nH
Inverse Diode
2)
V
F
= V
EC
I
F
= 525A;
T
j
= 125 C
-
-
2,45
V
V
F
= V
EC
I
F
= 525A;
T
j
= 25 C
-
-
2,55
V
E
on
+ E
off
I
F
= 600A;
T
j
= 125 C
-
-
24
mJ
V
TO
T
j
= 125 C
-
0,91
-
V
r
T
T
j
= 125 C
-
1,9
-
m
Thermal Characteristics
R
thjs
10)
per IGBT
-
-
0,043
C/W
R
thjs
10)
per Diode
-
-
0,125
C/W
R
thsa
6,10)
P16 heatsink; see case S3
-
-
0,036
C/W
Driver
I
S1
Supply current 15V-supply
260+450*f
s
/f
smax
+1,3*I
AC
/A
mA
I
S2
Supply current 24V-supply
200+300*f
s
/f
smax
+1,0*I
AC
/A
mA
t
interlock-driver
Interlock-time
3,3
s
SKiiPPACK protection
I
TRIPSC
Short circuit protection
750
2%
A
I
TRIPLG
Ground fault protection
-
A
T
TRIP
Over-temp. protection
115
5%
C
U
DCTRIP
9)
U
DC
-protection
920
2%
V
Mechanical Data
M1
DC terminals, SI Units
4
-
6
Nm
M2
AC terminals, SI Units
8
-
10
Nm
SKiiPPACK
SK integrated intelligent
Power PACK
halfbridge
SKiiP
632 GB 120 - 315 CTV
7,9)
Preliminary Data
Case S3
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal
thermal
management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
heatsink
= 25 C, unless
otherwise specified
2)
CAL = Controlled Axial Lifetime
Technology (soft and fast)
3)
without driver
4)
Driver input to DC link/ AC
output to heatsink
5)
with Semikron-DC link (low
inductance)
6)
other heatsinks on request
7)
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
8)
AC connection busbars must be
connected by the user; copper
busbars available on request
9)
options available for driver:
U - DC link voltage sense
F Fiber optic connector
10)
"
s
" referenced to temperature
sensor
11)
NPT-technology with homo-
genous current-distribution
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