ChipFind - документация

Электронный компонент: E2801

Скачать:  PDF   ZIP
SEMTECH
APPROVED
PRODUCTS
ZALINK
APPROVED
PRODUCTS
E2801/E2801LF GR-253-Core SMC (SONET minimum clock) and
ITU G.813 Option 2 Minature Surface Mount TCXO
ISSUE 2 ; 13 JUNE 2005
Nominal Frequency, Fo
s
20.0MHz
Supply Voltage
s
3.3V 5%
Input Current
s
< 6mA
Output
s
Type : HCMOS
s
Load : 15pF max
s
Vol : < 0.1 Vs
s
Voh : > 0.9 Vs
s
Duty Cycle @ 50%: 45% to 55%
s
Rise Time, 10% to 90%: <8ns
s
Fall Time, 90% to 10%:<8ns
Holdover Stability < 4.6ppm
Incl.
s
Temperature, -40 to 85C:
s
Supply Voltage, 3.3V 5%
s
Ageing 24 hours: < 0.5ppm, equivalent
to <5.8x10
-12
/sec
Free-Run Accuracy < 20.0ppm ref.Fo
Incl.
s
Calibration @ 25C,
s
Temperature -40 to 85C
s
Supply Voltage 3.3V 5%,
s
Load 15pF 10%
s
Reflow Soldering and Ageing 20 years
Phase Noise
s
10Hz < -85dBc/Hz
s
100Hz <-110dBc/Hz
s
1kHz
<-125dBc/Hz
s
>10kHz <-135dBc/Hz
Tri-state
s
Pad 8 open circuit or >0.6Vs : Output Enabled
s
Pad 8 < 0.2Vs : Output in tri-state mode
s
When in tri-state, the output stage is disabled but the
oscillator
and compensation circuit are still active,
(Current consumption < 1mA)
Marking (laser)
s
Manufacturers ID (CMAC)
s
Manufacturers identifier (xx)
s
Pad 1 / Static Sensitivity Identifier (
)
s
Abbreviated Part Number (2801)
s
Oscillator's Date of Manufacture (YW)
Note: Production parts will be
marked in this format.
Sample marking may vary.
Environmental Specification
s
Storage Temperature Range: -55 to 125C
s
Vibration: IEC 60068-2-6 Test Fc Procedure B4, 10-60Hz
1.5mm displacement, at 98.1 m/s2, 30 minutes in each
of three mutually perpendicular axes at 1 octave per
minute.
s
Shock: IEC 60068-2-27 Test Ea, 980m/s2 acceleration for
6ms duration, 3 shocks in each direction along three
mutually perpendicular axes.
s
Solderability: MIL-STD-202, Method 208, Catergory 3.
Resistance to Soldering heat: 260C / 10 seconds exposure
s
RoHS/Soldering: Parts with the suffix `LF' on the part
number are fully compliant with the European Union
directive 2002/95/EC on the restriction of the use of certain
hazardous substances in electrical and electronic
equipment.
Note: The RoHS compiant parts are suitable for
assembly using both Lead-free solders (see Lead-free
Reflow soldering profile) and Tin/Lead solders (see Tin/Lead
Reflow soldering profile).
CMAC xx
2801 YW
SEMTECH
APPROVED
PRODUCTS
Lead Free Reflow Soldering Profile *
Tin / Lead Reflow Soldering Profile *
100
200
300
50
Time above 217C: 60 to 150 secs
Time 25C to Peak Temp: 480 sec max
3
C
/se
c m
ax
150C to 200C
60 to 180 seconds
Peak Temp
260C C
20 to 40 sec
+0
-5
C
ool
dow
n,
6
C
/s
ec
m
ax
100
200
300
50
Time above 183C: 60 to 150 secs
Time 25C to Peak Temp: 360 sec max
3
C
/se
c m
ax
100C to 150C
60 to 120 seconds
Peak Temp
240C C
10 to 30 sec
+0
-5
C
ool
dow
n,
6
C
/s
ec
m
ax
*Note:
These profiles were used during
the qualification
testing of the product and
therefore represent worst
case conditions. They are not
recommended for use
by the customer in the actual
assembly of these parts
2.
0
m
a
x
0.
6
7.00.15
Pad Connections
1.Do not connect
2.N/C
3.Do not connect
4.GND
5.Output
6.N/C
7.N/C
8.Tri-state Control*
9.Supply, +Vs
10.Do not connect,
or connect to GND
*Leave unconnected if
not required
5.
0
0.
15
2.0
5
6
7
2
1.00.20
4
9 8
3
10
1
2.54
0.
8
2.
54
0.6
1.
50
0
.
2
0
Outline in mm