HIGH-PERFORMANCE PRODUCTS ATE
1
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Edge211
Dual Pin
Electronics Driver
Description
Features
Functional Block Diagram
Applications
Revision 5 / October 23, 2001
The Edge211 is a dual trinary driver manufactured in a
wide voltage CMOS process. It is designed for automatic
test equipment and instrumentation where cost, functional
density, and power are all at a premium.
Each tristatable driver is capable of generating 3 levels -
one for a logic high, one for a logic low, and one for either
a termination voltage or a special programming voltage.
The Edge211 is intended to offer an extremely low leakage,
low cost, low power, small footprint, driver solution for
100 MHz and below pin electronics applications.
100 MHz Operation
12V I/O Range
Programmable Output Levels
Flex In digital Inputs (Technology Independent)
Three Level Driver
Extremely Low Leakage Currents (~0 nA)
Small Footprint (32 Pin, 7 mm X 7 mm,
TQFP Package)
Low Cost Automatic Test Equipment
VH0 VTT0 VL0
VH1 VTT1 VL1
DOUT0
DOUT1
DATA0
DATA0*
DATA1
DATA1*
DVR EN0
DVR EN0*
DVR EN1
DVR EN1*
VTT EN0
VTT EN0*
VTT EN1
VTT EN1*
2
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
PIN Description
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3
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
PIN Description (continued)
32 Pin, 7 mm X 7 mm,
TQFP Package
1
25
17
9
DVR EN0
DVR EN0*
D
ATA
0
DA
T
A0*
VEE0
VCC0
VT
T0
VL0
VH0
DOUT0
VCC0
VEE0
VEE1
VCC1
DOUT1
VH1
VTT EN0*
VTT EN0
VCC0
VEE0
VEE1
VCC1
VTT EN1
VTT EN1*
DVR EN1
DVR EN1*
D
ATA
1
DA
T
A1*
VEE1
VCC1
VT
T1
VL1
4
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Circuit Description
Driver Description
The Edge211 supports three distinct programmable driver
levels high, low, and termination, along with high
impedance. There are no restrictions between any of these
three levels in that all three may vary independently over
the entire operating voltage range between VCC and VEE.
Digital Inputs
All digital inputs are wide voltage comparator inputs, and
are therefore technology independent. The Edge211 may
be driven by TTL, ECL, CMOS, or any custom level circuitry.
Figure 1. Driver Digital Inputs
Do NOT leave any driver digital inputs floating.
The DVR EN*, DATA, and VTT EN are digital input pins that
can be used to control the driver output level displayed at
the DOUT pin.
DVR EN, DATA*, and VTT EN* can be connected to a
reference voltage which defines the logic triggering level.
The relationship between the driver control pins and their
corresponding logic levels can be seen in Table 1.
Table 1.
Using the logic levels defined in Table 1, driver functionality
is described in Table 2.
Table 2.
Note that DVR EN* determines whether the driver output
state will be controlled by the VTT EN or the DATA pin.
With DVR EN high (Logic 1), the driver output pin, DOUT,
is controlled by the VTT EN pin and can be toggled between
the voltage value applied at VTT, and a high impedance
state. With DVR En* low (Logic 0), DOUT can be toggled
between the voltage values applied to the VL and VH pins
by using the DATA input pin.
VH, VL, and VTT
VH, VL, and VTT define the logical "1", "0", and
"termination" levels of the driver and can be adjusted
anywhere over the range spanned by VCC to VEE. There
is no restriction between VH, VL, and VTT, in that they can
all vary independently over the entire voltage range
determined by the power supply levels.
The VH, VL, and VTT inputs are unbuffered in that they
also provide the driver output current, so the sources of
these voltages must have ample current drive capability.
While VTT is referred to as the termination voltage, it may
also be used as a very high "programming" level on many
memory devices.
*
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DATA
DATA*
DVR EN*
DVR EN
VTT EN
VTT EN*
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5
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Circuit Description (continued)
Driver Output Protection
The Edge211 is designed to operate in a functional testing
environment where a controlled impedance (typically 50
Ohms) is maintained between the pin electronics and the
DUT. In general, there will be an external resistor at the
driver output which series terminates the transmission line
to the DUT. In this environment, the driver can withstand
a short to any legal DUT voltage for an indefinite amount
of time.
In a low impedance application with no additional output
series resistance, care must be exercised and systems
should be designed to check for this condition and tristate
the driver if a short is detected.
The driver does NOT have on-chip short circuit protection
or limitation circuitry.
6
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Application Information
Power Supplies Decoupling
A .1
F capacitor is recommended between VCC and
VEE.
In addition, solid VCC and VEE planes are recommended
to provide a low inductance path for the power supply
currents. These planes will reduce any inductive supply
drops associated with swtiching currents on the power
supply pins. If solid planes are not possible, then wide
power busses are preferable.
VH, VL, and VTT Decoupling
As the VH, VL, and VTT inputs are unbuffered and must
supply the driver output current, decoupling capacitors
for these inputs are recommended in proportion to the
amount of output current the application requires. In
general, a surge current of 50 mA (5V swings series
terminated with 50
into a 50
transmission line) are
the maximum dynamic output currents the driver should
see. The decoupling capacitors should be able to provide
this current for the duration of the round trip time between
the pin electronics and the DUT, and then recharge
themselves before the next such transition would occur.
Once this condition is satisfied, the VH, VL, and VTT supply
voltages are more responsible for establishing the DC levels
associated with each function and recharging the
capacitors, rather than providing the actual dynamic
currents required to drive the DUT transmission line.
Ideally, VH, VL, and VTT would each have a dedicated
power layer on the PC board for the lowest possible
inductance power supply distribution.
Power Supply Sequencing
The following sequence should be used when powering
up the Edge211.
1.
VCC
2.
VEE
3.
Analog inputs (VH, VL , VTT)
4.
Digital inputs (VTTEN, DVREN, DATA)
Latchup Protection
The Edge211 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences. VCC
must remain greater than or equal to VDD (external supply
for the digital logic) at all times. Both VCC and VDD must
always be positive (above ground), and VEE must always
be negative (at or below ground).
The three diode configuration shown in Figure 2 should
be used on a once-per-board basis.
Figure 2.
Power Supply Protection Scheme
gure 5.
Warning: It is extremely important that the voltage
on any device pin does not exceed the range of VEE
0.5V to VCC +0.5V at any time, either during power
up, normal operation, or during power down. Failure
to adhere to this requirement could result in latchup
of the device, which could be destructive if the system
power supplies are capable of supplying large
amounts of current. Even if the device is not
immediately destroyed, the cumulative damage
caused by the stress of repeated latchup may affect
device reliability.
VCC
VDD
VEE
1N5820 or
Equivalent
External
System
Ground
7
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Package Information
PIN Descriptions
b
D
3
4
4
e
N / 4 TIPS
4 X
E / 2
D / 2
SEE DETAIL "A"
E
0.20
C
A B
D
TOP VIEW
D1
E1
5
7
5
7
4 X
D1 / 2
E1 / 2
0.20
H
A B
D
BOTTOM VIEW
C
OO
8
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Package Information (continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
H
A2
0.05
A1
S
DETAIL "B"
9
;;;
;;;
S
S
D
C
ddd
M
A B
WITH LEAD FINISH
Lead
Cross Section
0.09 / 0.20
0.09 / 0.16
b
b
1
BASE METAL
2
8 PLACES
11 / 13
A
0.10
/ /
C
M
SEE DETAIL "B"
0.05
ccc
H
C
SECTION CC
JEDEC VARIATION
All Dimensions in Millimeters
AC
Min.
Nom.
Max.
Note
A
1.60
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
D
9.00
BSC.
4
D1
7.00
BSC.
7,8
E
9.00
BSC.
4
E1
7.00 BSC.
7,8
L
0.45
0.60
0.75
M
0.15
N
32
e
0.80 BSC.
b
0.30
0.37
0.45
9
b1
0.30
0.35
0.40
ccc
0.10
ddd
0.20
Notes:
1.
All dimensions and tolerances conform to ANSI
Y14.5-1982.
2.
Datum plane -H- located at mold parting line and
coincident with lead, where lead exits plastic
body at bottom of parting line.
3.
Datums A-B and -D- to be determined at
centerline between leads where leads exit
plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold
protrusion.
6.
"N" is the total # of terminals.
7.
These dimensions to be determined at the
datum plane -H-.
8.
Package top dimensions are smaller than
bottom dimensions and top of package will
not overhang bottom of package.
9.
Dimension b does not include dambar
protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the b
dimension at maximum material condition.
Dambar cannot be located on the lower
radius or the foot.
10.
Controlling dimension: millimeter.
11.
Maximum allowable die thickness to be
assembled in this package family is 0.30
millimeters.
12.
This outline conforms to JEDEC publication 95,
registration MO-136, variations AC, AE, and AF.
9
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Recommended Operating Conditions
Absolute Maximum Ratings
Parameter
Symbol
Min
Typ
Max
Units
Positive Analog Power Supply
VCC
6
12
V
Negative Analog Power Supply
VEE
-5
-3
V
Total Analog Power Supply
VCC - VEE
9
12
V
Junction
Tj
+125
o
C
Parameter
Symbol
Min
Typ
Max
Units
Total Analog Power Supply
VCC - VEE
0
13
V
Positive Analog Power Supply
VCC
0
13
V
Negative Analog Power Supply
VEE
-6
0
V
Analog Input Voltages
VEE - .5
VCC + .5
V
Digital Inputs
VEE - .5
VCC + .5
V
Ambient Operating Temperature
TA
-55
+125
o
C
Storage Temperature
-65
+150
o
C
Junction Temperature
TJ
+150
o
C
Soldering Temperature
260
o
C
Stresses above listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above
those listed in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
10
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
DC Characteristics
Parameter
Symbol
Min
Typ
Max
Units
Programmable Driver Output Voltages
Driver Output Swing
VH, VL, VTT
VH VL
VH VTT
VTT VLL
VEE
VEE VCC
VEE VCC
VEE VCC
VCC
VCC VEE
VCC VEE
VCC VEE
V
V
V
V
DC Driver Output Current
AC Driver Output Current
Iout DC
Iout AC
50
220
+50
+220
mA
mA
Output Impedance
VH (@ +3.0V) (Note 3)
VTT (@ +1.5V) (Note 3)
VL (@ 0.0V) (Note 3)
Rout HI
Rout VTT
Rout LOW
21.6
22.3
22.3
23.6
24.3
24.3
25.6
26.3
26.3
DUT Pin Capacitance (Driver Off)
Cout
13
pF
High Impedance Leakage Current (Note 1)
Ileak
0
4
nA
VH / VL / VTT Offset Voltage (Note 2)
VOS
100
+100
mV
VH / VL / VTT Gain and Linearity Error (Note 2)
(.5% + 5)
+(.5% + 5)
mV
Power Supply
Positive Supply Current
Negative Supply Current
ICC
IEE
23
23
32
32
mA
mA
Total RMS Supply Current @ 80 MHz
AC + DC Positive Supply Current
AC + DC Negative Supply Current (Note 1)
70
70
mA
mA
Driver Characteristics
Digital Inputs
DATA, DVR EN*, VTT EN
Parameter
Symbol
Min
Typ
Max
Units
Input High Voltage
INPUT - INPUT*
800
mV
Input Low Voltage
INPUT* - INPUT
800
mV
Input Current
IIN
0
1.0
A
Digital Input Voltage Range
INPUT, INPUT*
-2.0*
+5.0
V
Note 1: This parameter is guaranteed by design and characterization. Production testing is performed
against a
250 nA limit.
Note 2: No load conditions.
Note 3: Tester min / max limits set to Typ
2.0
. Tester repeatability = .8
.
* -2V or (VEE + 2.0V), whichever is more positive.
11
2000 Semtech Corp.
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HIGH-PERFORMANCE PRODUCTS ATE
Edge211
AC Characteristics
Parameter
Symbol
Min
Typ
Max
Units
Propagation Delay
DATA IN to DOUT
DVR EN* to DOUT (Active to HiZ) (Note 2)
DVR EN* to DOUT (HiZ to Active) (Note 4)
7
7
7
11
11
11
14
14
15
ns
ns
ns
Minimum Pulse Width (3V Swing)
4
5
ns
Toggle Rate
Fmax
100
MHz
DOUT Output Rise/Fall Times (Note 1)
1V Swing (20% - 80%)
3V Swing (10% - 90%)
5V Swing (10% - 905)
1.0
1.3
1.4
1.6
3.0
4.0
ns
ns
ns
Driver Temperature Coefficient
Tpd/
T
<25
ps /
o
C
Driver Edge to Edge Matching
<500
ps
Tpd vs. Pulse Width (Note 3)
<100
ps
I/O Voltage Spike
-500
500
mV
Overshoot / Undershoot
- (3% + 50)
+ (3% + 50) %Swing + mV
Note 1:
Into 18 cm of 50
transmission line terminated with 1K
and 5 pF with the proper series
termination resistor.
Note 2:
Measured at a voltage change of 500 mV with a 30 mA load. (VH = +5V, VL = 0V)
Note 3:
Tested with an input pulse of 20 ns, 30 ns, and 80 ns. T = 100 ns.
Note 4:
4 mA load current.
12
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Ordering Information
Contact Information
Semtech Corporation
High-Performance Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
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2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS ATE
Edge211
Revision History
Current Revision Date: October 23, 2001
Previous Revision Date: June 27, 2001
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Current Revision Date: June 27, 2001
Previous Revision Date: October 27, 2000
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