22
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
Super-luminosity(AlGaInP)LED Lamp
GL3Z
t
802B0S series
GL3Z
t
802B0S series
Viewing Angle: 80 (2
1/2) 3mm,
Cylinder Type, Colorless
Transparency Super-luminosity
LED Lamps for Outdoor Use
s
Outline Dimensions
+0.5
3.8
3.0
0.4
0.4
(9.4)
(1.0)
1.0
24.5MIN
3.3
4.87
1.6
0.2
0
1
2
2.54NOM
Sunken resin 0.8MAX
Colored transparency
(Tie-bar cut)
Front view
Bottom view
Side view
(Dimension from the center of 3mm)
Pin connections
1
Anode
2
Cathode
Unspecified tolerance:
0.2
*Outline dimensions are reference value.
s
Radiation Diagram
0
0
40
20
60
-20
+20
+40
+60
+80
-40
-60
-80
-30
-50
+10
100
-10
+30
+50
+70
+90
-90
-70
80
Relative luminous intensity(%)
(Unit :
mm
)
GL3ZJ802B0S
GL3ZS802B0S
GL3ZV802B0S
GL3ZE802B0S
Orange
Sunset orange
Amber
Yellow-green
A1GaInP on GaAs
A1GaInP on GaAs
A1GaInP on GaAs
A1GaInP on GaAs
130
130
130
130
50
50
50
50
0.67
0.67
0.67
0.67
1.33
1.33
1.33
1.33
260
260
260
260
100
100
100
100
5
5
5
5
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +100
-40 to +100
-40 to +100
-40 to +100
Model No. Radiation color Radiation material
Power dissipation
P
(mW)
Forward current
I
F
(mA)
Derating factor
(mA/C)
DC
Pulse
Peak forward current
I
FM
*1
(mA)
Operating temperature
T
opr
(C)
Storage temperature
T
stg
(C)
Soldering temperature
T
sol
*2
(C)
Reverse voltage
V
R
(V)
(T
a
=25C)
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 5s or less(At the position of 1.6mm or more from the bottom face of resin package)
s
Absolute Maximum Ratings
GL3ZJ802B0S
GL3ZS802B0S
GL3ZV802B0S
GL3ZE802B0S
TYP
MAX
2.1
2.1
2.1
2.1
2.6
2.6
2.6
2.6
627
609
591
570
618
605
588
570
100
100
100
100
4
4
4
4
60
60
60
60
1
1
1
1
142
143
144
144
15
15
15
15
360
450
330
80
(I
F
=20mA,T
a
=25
C)
Model No.
Lens type
Forward voltage
V
F
(V)
p
(nm)
TYP
d
(nm)
TYP
I
V
(mcd)
TYP
(MH
Z
)
V
R
(V)
I
R
(
A)
MAX
C
t
(pF)
TYP
(nm)
TYP
Peak emission
wavelength
Spectrum radiation
bandwidth
Reverse current
Page for
characteristics
diagrams
Terminal capacitance
Dominant
wavelength
Luminous
intensity
Colorless
transparency
s
Electro-optical Characteristics
(T
a
=25C)
4
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
s
Lead Forming Method
Avoid forming a lead pin with the lead pin base as a fulcrum: be sure to hold a
lead pin firmly when forming.
Lead pins should be formed before soldering.
s
Installation
(1) Installation on a PWB
When mounting an LED lamp on a PWB, do not apply physical stress to the lead
pins.
(Notes)The lead pin pitch should match the PWB pin-hole pitch: absolutely avoid
widening or narrowing the lead pins.
When positioning an LED lamp, basically employ an LED with tie-bar cut or
use a spacer.
(2) When an LED lamp is mounted directly on a PWB
If the bottom face of an LED lamp is mounted directly on single-sided PWB, the
base of the lead pins may be subjected to have
physical stress due to PWB warp, cutting or
clinching of lead pins. Prior to use, be sure to
check that no disconnection inside of the resin
or damage to resin etc., is found.
When an LED lamp is mounted on a double-
sided PWB, the heat during soldering affects
the resin; therefore, keep the LED lamp more
than 1.6mm afloat above the PWB.
(3) Installation using a holder
During an LED lamp positioning, in case of
using a holder, holder A should be designed to
be smaller than the inside diameter of lead
pins. Holder B should be designed to be larger
than the outside diameter of lead pins.
(Notes)Pay attention to the thermal expansion
coefficient of the material used for the
holder. Since the holder expands and
contracts due to preheat and soldering
heat, mechanical stress may be applied to the lead pins, resulting in
disconnection.
(4) Installation to the case
Do not fix part A with adhesives when
fixed to the case as shown in the figure.
A hole of the case should be designed not
to be smaller than the outside diameter of
LED lamp resin.
s
Soldering Conditions
Solder the lead pins under the following conditions.
(Notes)Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated. For example, when the
LED lamp is moved with the heat applied to the lead pins during manual
soldering or solder repair, disconnection may occur.
s
Cleaning
(1) Solvents
The package resin may be penetrated by solvents used in cleaning. Refer to the
table below for usable solvents.
TM : Acceptable
: Not acceptable
(Notes)There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC)
based solvents and we recommend that you avoid their use. However, before
using a CFC substitute solvent, carefully check that it will not penetrate the
package resin.
(2) Cleaning Methods
TM : Acceptable
: Acceptability depends on device type and conditions
(Notes)The affect on the device from ultrasonic cleaning differs depending on the size
of the cleaning bath, ultrasonic output, duration, board size and device mounting
method. Test the cleaning method under actual conditions and check for
abnormalities before actual use.
Cleaning with water is not allowed with the lead pins resin-tubulated: water may
remain, thus causing rust to the lead pins.
Please contact our representative before using a cleaning solvent or method not
given above.
Cleaning Method
Solvent cleaning
Ultrasonic cleaning
Usable
Remarks
Immersion up to one minute at room temperature
Test the cleaning under actual conditions and
check for abnormalities before actual use.
TM
v
Solvent
Usable
Ethyl alcohol
Isopropyl alcohol
Chlorosen
Acetone
Trichloroethylene
TM
TM
Soldering
iron
,,
,
,,
,
,,
,,
,
,,
,
,,
Not acceptable
Acceptable
Type of Soldering
Conditions
1. Manual soldering
2. Wave soldering
3. Reflow soldering
295C
5C, within 3 seconds
260C
5C, within 5 seconds
Preheating 70C to 80C, within 30 seconds
Soldering 245C
5C, within 5 seconds
,
,,
,
,
,,
,
,
,,
,
,
,,
,
,
,,
,
PWB
Not acceptable
Acceptable
,
,,,
,
Hold a lead pin firmly when forming
A: Lead Pin Type
,,
,,
,,
,,
,,
,
,
1.6
A
,
,,
,,,
,
,,
,,,
,,
,
Case
A
,,
,,
,,
,,
,,
,,
,
Holder
A
B
General Description of Light Emitting Diodes
v
153
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED
Lamp
Tape-packaged Products
s
General Description
Sharp can supply tape-packaged LED lamps for automatic mounting.
They will contribute to the high-efficiency mounting, high-precision,
power saving. Please confirm before use because some products are
not available in taping package.
s
Taping specification(Unit : mm)
F
P
H
D
O
P
O
H
O
W
O
W
Forming type
*1. Tolerance :
1mm
Case end height
Lead clinch height
Tape width
Adhesive tape width
Product pitch
Sprocket hole pitch
Lead pitch
Sprocket hole diameter
Parameter
Symbol
W
P
F
A
B
D
23.35
19.5
21.5
18.0
5.0
16.0
0.5
13.0
0.3
12.7
1
12.7
0.3
4.0
0.2
+1
--0.5
+0.8
--0.2
H
*1
H
O
W
O
P
O
D
O
P
H
D
O
P
O
W
O
W
Dichromatic emission type
F
1
F
2
Case end height
Lead clinch height
Tape width
Adhesive tape width
Product pitch
Sprocket hole pitch
Lead pitch
Sprocket hole diameter
Parameter
Symbol
W
P
F
1
, F
2
Size (mm)
2.54NOM
18.0
H
*1
----
13.0
0.3
12.7
1.0
12.7
0.3
4.0
0.2
+1.0
--0.5
H
O
W
O
P
O
D
O
19.5
1.0
*1. Tolerance :
1mm
F
P
H
D
O
P
O
W
O
W
Straight type
*1. Tolerance :
1mm
Case end height
Lead clinch height
Tape width
Adhesive tape width
Product pitch
Sprocket hole pitch
Lead pitch
Sprocket hole diameter
Parameter
Symbol
W
P
F
P
W
18.0
23.35
2.54NOM
18.0
13.0
0.3
12.7
1
12.7
0.3
4.0
0.2
+1
--0.5
H
*1
H
O
W
O
P
O
D
O
-----
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
142
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED Lamp
Characteristics Diagrams
ZJ series
0
10
20
30
40
50
60
-40
0
25
50
75
125
00
85
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
5.0
1.0
0.1
0.5
10
50
100
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
(T
a=
25C)
(1
F
=20mA)
1.0
10
5.0
50
100
500
1000
-20
-40
0
20
40
60
100
80
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a
(C)
Relative luminous intensity(%)
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
(T
a=
25C)
1.0
2.0
5.0
200
500
100
20
50
10
1000
0.1
0.2
0.5
1
2
5
10
20
50
1/50
1/20 1/10
1/5
1/2
1
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
F
(mA)
(T
a=
25C)
1
2.0
5.0
200
100
30
50
10
500
Note)Characteristics shown in diagrams are typical values. (not assurance value)
ZR series
0
10
20
30
40
50
60
-40
0
25
50
75 85
125
100
0.1
0.5
1.0
5.0
10
50
100
1.0
1.2
1.4
1.6
1.8
2.0
2.4
2.6
2.2
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
(T
a=
25C)
1.0
5.0
10
50
100
500
1000
-40
-20
0
20
40
60
100
80
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a(
C)
Relative luminous intensity(%)
(1
F
=20mA)
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
1.0
5.0
2.0
10
20
50
100
200
500
1000
0.1
0.2
0.5
1
2
5
10
20
50
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
(T
a=
25C)
1.0
5.0
2.0
10
20
50
100
200
500
1/50
1/20 1/10
1/5
1/2
1
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
FM
(mA)
(T
a=
25C)
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
143
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED
Lamp
LED Lamp
Characteristics Diagrams
Note)Characteristics shown in diagrams are typical values. (not assurance value)
0
10
20
30
40
50
60
-40
0
25
50
75 85
125
100
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
0.1
0.5
1.0
5.0
10
50
100
1.4
1.6
1.8
2.0
2.2
2.4
2.8
3.0
2.6
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
1.0
5.0
10
50
100
500
1000
-40
-20
0
20
40
60
80
100
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a(
C)
Relative luminous intensity(%)
(I
F
=
20mA)
1.0
5.0
2.0
10
20
50
100
200
500
1000
0.1
0.2
0.5
1
2
5
10
20
50 100
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
1.0
5.0
2.0
10
20
50
100
200
500
1000
1/50
1/20 1/10
1/5
1/2
1
10
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
FM
(mA)
GL5XS022BOS
ZS series
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
0
10
20
30
40
50
60
-25
0
25
50
75 85
125
100
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
0.1
0.5
1.0
5.0
10
50
100
1.0
1.2
1.4
1.6
1.8
2.0
2.4
2.6
2.2
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
1.0
5.0
10
50
100
500
1000
-40
-20
0
20
40
60
100
80
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a(
C)
Relative luminous intensity(%)
(1
F
=20mA)
1.0
5.0
2.0
10
20
50
100
200
500
1000
0.1
0.2
0.5
1
2
5
10
20
50
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
1.0
5.0
2.0
10
20
50
100
200
500
1/50
1/20 1/10
1/5
1/2
1
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
FM
(mA)
(T
a=
25
C
)
(T
a=
25
C
)
(T
a=
25
C
)
(T
a=
25
C
)
(T
a=
25
C
)
(T
a=
25
C
)
144
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED Lamp
Characteristics Diagrams
0
10
20
30
40
50
60
-40
0
25
50
75 85
125
100
0.1
0.5
1.0
5.0
10
50
100
1.0
1.2
1.4
1.6
1.8
2.0
2.4
2.6
2.2
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
(T
a=
25C)
1.0
5.0
10
50
100
500
1000
-40
-20
0
20
40
60
100
80
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a(
C)
Relative luminous intensity(%)
(1
F
=20mA)
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
1.0
5.0
2.0
10
20
50
100
200
500
1000
0.1
0.2
0.5
1
2
5
10
20
50
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
(T
a=
25C)
1.0
5.0
2.0
10
20
50
100
200
500
1/50
1/20 1/10
1/5
1/2
1
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
FM
(mA)
(T
a=
25C)
ZE series
10
20
30
40
50
60
0
25
50
75 85
125
100
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
Note)Characteristics shown in diagrams are typical values. (not assurance value)
ZV series
(1
F
=20mA)
1.0
10
5.0
50
100
500
1000
-20
-40
0
20
40
60
100
80
Luminous Intensity vs. Ambient Temperature(Note)
Ambient temperature T
a
(C)
Relative luminous intensity(%)
0.5
0.1
1.0
5.0
10
50
100
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Forward Current vs. Forward Voltage(Note)
Forward voltage V
F
(V)
Forward current I
F
(mA)
(T
a=
25C)
Luminous Intensity vs. Forward Current(Note)
Forward current I
F
(mA)
Relative luminous intensity(%)
(T
a=
25C)
0
10
20
30
40
50
60
-40
0
25
50
75
125
100
85
Forward Current Derating Curve
Ambient temperature T
a
(C)
Forward current I
F
(mA)
0
20
40
60
80
100
120
-40
0
25
50
75 85
125
100
Peak Forward Current Derating Curve
Ambient temperature T
a
(C)
Peak forward current I
FM
(mA)
1/50
1/20 1/10
1/5
1/2
1
Duty Ratio vs. Peak Forward Current
Duty ratio D
R
Peak forward current I
F
(mA)
(T
a=
25C)
1.0
2.0
5.0
200
500
100
20
50
10
1000
1.0
20
5.0
200
100
30
50
10
500
0.1
0.2
0.5
1
2
5
10
20
50
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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