Photointerrupter
Subminiature
1. Compact and thin
GP2S26
: Flat lead type
GP2S27
: Mini-flat package type
2. Optimum detection distance: 0.6 to 0.8mm
3. Visible light cut-off type
2. Floppy disk drives
3. Various microcomputerized control equip-
ment
s
Outline Dimensions
(Unit : mm )
s
Features
s
Applications
GP2S09/GP2S24/GP2S26/GP2S27
1. Cassette tape recorders, VCRs
GP2S24
1
2
3
4
1.75
C0.7
15
0.8
GP2S09
GP2S26
GP2S27
( 0.2
) Emitter center
4
-
(0.6)
(4.0)
Tolerance
:
0.15mm
( )
:
Reference dimensions
The dimensions indicated by
g
refer
to those measured from the lead base.
2
1
4
3
1
2
3
4
C0.7
20
0.75
1.7
30
0.75
1.7
0.4
1.75
C0.7
( 0.2
) Emitter center
1.75
( 0.2
) Emitter center
(0.4)
Internal connection diagram
( Common to 4 models )
1
2
3
4
Tolerance
:
0.15mm
( )
:
Reference dimensions
1 Anode
2 Emitter
3 Collector
4 Cathode
Tolerance
:
0.15mm
( )
:
Reference dimensions
GP2S09
GP2S09/GP2S24/
GP2S26/GP2S27
( 0.4
) Detector center
: Compact DIP long lead type
( 0.4
) Detector center
( 0.4
) Detector center
: Compact DIP type
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
"
"
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
:
0 to 20
g
4.0
0.2
12.5
1.0
1.7
0.15
4
-
0.5
+
0.2
-
0.1
4.0
+
0.2
-
0.1
3.0
+
0.2
-
0.1
4
-
0.2
+
0.3
-
0
2
1
4
3
GP2S24
0.75
15
1.7
C0.7
1.75
( 0.2
) Emitter center
(4.0)
Tolerance
:
0.15mm
( )
:
Reference dimensions
The dimensions indicated by
g
refer
to those measured from the lead base.
( 0.4
) Detector center
:
0 to 20
g
4.0
0.2
4
-
0.4
+
0.2
-
0.1
4.0
+
0.2
-
0.1
4
-
0.15
+
0.2
-
0.1
3.5
+
1.0
-
0
3.0
+
0.2
-
0.1
0.4
+
0.2
-
0.1
0.4
+
0.2
-
0.1
0.15
+
0.2
-
0.1
3.0
+
0.2
-
0.1
4.0
+
0.2
-
0.1
0.15
+
0.2
-
0.1
3.0
+
0.2
-
0.1
5.0
MAX.
13.0
1.0
s
Absolute Maximum Ratings
(Ta = 25C)
(Ta = 25C )
5
GP2S24
and
GP2S26
and
GP2S27
don't
The ranking of collector current shall be classi-
fied into the following 6 ranks.
4 Without reflective object
Rank
B
C
A or B
B or C
A, B or C
The hatched area more than
in the figure below.
GP2S26
The hatched area more than
edges of package as shown
in the figure below.
GP2S27
Soldering area
The hatched area more than
edges of package as shown
in the figure below.
Test Condition and
Arrangement for
Collector Current
s
Electro-optical Characteristics
5
A
GP2S09/GP2S24/GP2S26/GP2S27
1mm
2
2.0mm
2.0mm
0.5mm
0.5mm
1mm-thick glass
(
GP2S09
,
GP2S24
,
GP2S26
,
GP2S27
)
Collector-current I
C
(
A)
20 to 42
34 to 71
58 to 120
20 to 71
34 to 120
20 to 120
GP2S09
,
GP2S24
1mm
2
away from the lower
4mm
2 GP2S09
:
1 Within 5 seconds ( Soldering areas for each model are shown below )
0.5mm away from the both
3 The condition and arrangement of the reflective object are shown below.
have A rank.
Parameter
Rating
Unit
Input
Forward current
50
mA
Reverse voltage
6
V
Power dissipation
75
mW
Output
Collector-emitter voltage
35
V
Emitter-collector voltage
6
V
Collector current
20
mA
Collector power dissiipation
75
mW
Total power dissipation
100
mW
Operating temperature
- 20 to + 85
C
Storage temperature
- 40 to + 100
C
1
Soldering temperature
260
C
Symbol
I
F
V
R
V
CEO
V
ECO
I
C
P
C
P
tot
T
opr
T
stg
T
sol
P
edge of package as shown
2.0mm away from the both
Al evaporation
Soldering area:
Soldering area:
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Input
Forward voltage
V
F
I
F
= 20mA
-
1.2
1.4
V
Reverse current
I
R
V
R
= 6V
-
-
10
A
Output
Collector dark current
I
CEO
V
CE
= 20V
-
10
- 9
10
- 7
A
Transfer
charac-
teristics
3
Collector current
I
C
I
F
= 4mA, V
CE
= 2V
20
45
120
A
Response time
Rise time
t
r
V
CE
= 2V, I
C
= 100
A
R
L
= 1k
, d = 1mm
-
20
100
s
Fall time
t
f
-
20
100
s
4
Leak current
I
LEAK
I
F
= 4mA, V
CE
= 2V
-
-
0.1
A
GP2S09/GP2S24/GP2S26/GP2S27
- 25
0
25
50
75
85
100
0
10
20
30
40
50
60
0
25
- 25
0
20
40
60
120
Power dissipation P
(
mW
)
50
100
75
80
100
85
0
0.5
1
1.5
2
2.5
3
1
2
5
10
20
50
100
200
500
25C
0C
50C
5
10
15
25
30
0
0
100
200
300
400
500
600
700
20
0
25
- 25
0
20
40
60
80
100
120
50
100
75
2
4
6
8
10
0
0
50
100
150
200
250
300
350
12
4mA
2mA
7mA
10mA
25C
Fig. 1 Forward Current vs.
Ambient Temperature
Fig. 5 Collector Current vs.
Forward current I
F
(
mA
)
Ambient temperature T
a
(C)
Ambient temperature T
a
( C)
Forward current I
F
(
mA
)
Forward voltage V
F
( V)
- 25C
Collector current I
C
Forward current I
F
( mA )
Collector current I
C
(
A
)
Collector-emitter voltage V
CE
( V)
Ambient temperature T
a
( C)
Collector-Emitter Voltage
Fig. 3 Forward Current vs.
Forward Voltage
Forward Current
Fig. 2 Power Dissipation vs.
Ambient Temperature
Ambient Temperature
Fig. 4 Collector Current vs.
(
A
)
Relatlve collector current I
C
(
%
)
Fig. 6 Relatlve Collector Current vs.
T
a
= 75C
I
F
= 15mA
I
F
= 4mA
V
CE
= 2V
V
CE
= 2V
T
a
= 25C
P
tot
P, P
C
T
a
=
GP2S09/GP2S24/GP2S26/GP2S27
2
5
2
5
2
5
2
75
100
50
25
0
0.02 0.05
0.01
0.1
0.1 0.2
0.5
1
2
5
10
0.2
0.5
1
2
5
20
50
100
0.1
1
10
100
1000
0.1
0.2
1
2
0.5
5
10
20
50
100
200
500
1000
Input
Output
Output
Input
0
1
2
4
5
80
100
40
60
20
0
3
0
2
4
80
100
40
60
20
0
6
1
3
5
7
Fig. 7 Collector Dark Current vs.
Ambient Temperature
Collector dark current I
(
A
)
Ambient temperature T
a
(C)
5
10
R
D
R
L
V
CC
t
d
t
r
t
s
t
f
90
%
10
%
Relative collector current
(%
)
Card moving distance L ( mm )
Fig.11 Relative Collector Current vs.
Fig.10 Relative Collector Current vs.
Distance between Sensor and
Al Evaporation Glass
10
- 10
10
- 9
10
- 8
10
- 7
10
- 6
(GP2S24/ GP2S26/GP2S27)
d = 1mm
CEO
Response time
(
s
)
Relative collector current
(%
)
V
CE
= 2V
Test Circuit for Response Time
V
CE
= 20V
V
CE
= 2V
I
C
= 100
A
T
a
= 25C
t
r
t
f
t
d
t
s
I
F
= 4mA
V
CE
= 2V
T
a
= 25C
Distance between sensor and Al evaporation glass d ( mm )
I
F
= 4mA
T
a
= 25C
V
CE
= 2V
I
C
= 100
A
T
a
= 25C
t
r
t
f
t
d
t
s
Card Moving Distance ( 1 )
(GP2S09)
Response time
(
s
)
Fig. 8 Response Time vs. Load Resistance
Load resistance R
L
( k
)
Fig. 9 Response Time vs. Load Resistance
Load resistance R
L
( k
)
GP2S09/GP2S24/GP2S26/GP2S27
- 2
0
2
4
80
100
40
60
20
0
6
- 1
1
3
5
1k
0
- 5
- 10
- 15
- 20
2
5
2
5
2
5
600
700
800
900
1000
1200
80
100
40
60
20
0
1100
Al evaporated glass
d
Correspond to Fig.11
OMS card
L
=
0
d
+
White
Lmm
Test condition
d
=
1mm
-
-
d
=
1mm
Test condition
Lmm
White
+
d
L
=
0
OMS card
Correspond to Fig.12
Black
Black
- 20
- 15
- 10
- 5
0
Frequency f ( Hz )
1k
Fig.12 Relative Collector Current vs.
Card moving distance L ( mm )
d= 1mm
Frequency f ( Hz )
Relative sensitivity
(%
)
V
CE
=
2V
I
F
=
4mA
V
CE
=
2V
I
F
=
4mA
(GP2S09)
(GP2S24/ GP2S26/ GP2S27)
Relative collector current
(%
)
Wavelength
( nm )
Card Moving Distance ( 2 )
Characteristics (EX
:
GP2S24 )
Test Condition for Distance & Detecting Position
Fig.13-a Frequency Response
Fig.13-b Frequency Response
Voltage gain A
V
(
dB
)
Voltage gain A
V
(
dB
)
10
2
10
3
10
4
10
5
Fig.14 Spectral Sensitivity
( Detecting Side)
I
F
= 4mA
V
CE
= 2V
T
a
= 25C
R
L
= 10k
T
a
= 25C
R
L
= 10k
V
CE
= 2V
I
C
= 100
A
T
a
= 25C
V
CE
= 2V
I
C
= 100
A
T
a
= 25C
Correspond to Fig.10
10
2
10
3
10
4
10
5
10
6
q
Please refer to the chapter " Precautions for Use " .
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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