IrDA Technical Information

GP2W0004YP/XP

IrDA Technical Information

Infrared Transceiver

FEATURES

· IrDA 115 kbit/s, 1 meter Transceiver

· Small Package Design

W 9.21 × D 3.86 × H 2.71 mm

· Receiver Output Provides a Gated Output Pulse for

the Received Input Signal

· Fits Within Mobile Phone Connector Dimensions

· Low Power Consumption and Built-in Shut-Down

Mode (1

A MAX.)

· Wide Range Operating Voltage

VCC = 2.4 V - 5.5 V

· Wide Operating Temperature Range

-20°C to +85°C

· Split Voltage Design

LED Voltage Separate from Operating Voltage

· Internal Echo-Cancel Function

RX Data Output Disabled when the Transmit LED

is Active

· LED Disabled During Shutdown Mode

· Solder Reflow Capability for Automated Production

Process

· GP2W0004YP is Electrically and Mechanically

Compatible with IRMS5000, HSDL-3000, CHX1010,
MiniSIR2-1

· Top View Version: GP2W0004XP

DESCRIPTION

The SHARP GP2W0004YP has a wide operating

voltage range and is one of the smallest IrDA one-
meter transceiver modules. It provides the interface
between logic and IR signals for through-air, serial,
half-duplex IR wireless data links and is designed to
satisfy the IrDA physical layer specifications.

This part features an integral Electro-Magnetic Inter-

ference (EMI) shield. IR energy is inherently immune to
EMI; however, the receiving devices are sensitive to
EMI. The shield provides additional protection in noisy
environments such as PCs and other digital products.

The SHARP GP2W0004YP infrared transceiver

module contains a high speed, high efficiency, low
power consumption AlGaAs LED, silicon PIN photo-
diode, and low power bipolar integrated circuit. The IC
contains an LED driver circuit and a receiver, which
provides the RX output. IrDA data rates of 2.4 kbit/s to
115.2 kbit/s are supported at both the 20 cm and one
meter distances. Emitter current is approximately IF =
100 mA at the one meter range, and the IrDA low
power option communication mode is IF = 27 mA. This
dual mode communication capability provides wider
application use in a final product, such as a wireless
data link with PCs, PDAs, or any other IrDA compliant
application already introduced to the marketplace.

The GP2W0004YP transceiver module operates

over a power supply range of 2.4 V to 5.5 V without any
performance degradation. This provides a single part
with a wide variety of design applications. The LED
voltage is separate and may be provided from a second
source, allowing the main power supply voltage to
directly interface to the IC controller. The LED may be
connected to the device battery or some other higher
level source.

The GP2W0004YP also includes an integral echo-

cancel function that disables the RX Data Output when
the Transmit LED is driven by TX data.

The transceiver module has a built-in shutdown

mode for those applications that are very conscious
about current consumption. This reduces the current
consumption of the receiver circuit to 1

A (MAX.) dur-

ing shutdown mode. During shutdown, the transmitter
output is disabled so that data on the input will not drive
the LED when the IrDA transceiver is one of several
devices on an I/O line.

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

PACKAGE

The dimensional drawing is available in the specifi-

cation, which is available from your Sharp Components
representative. The specification will have the most up-
to-date information.

ABSOLUTE MAXIMUM RATINGS

NOTE: *Solder reflow time is 5 seconds.

RECOMMENDED OPERATING CONDITIONS

NOTES:
1. An in-band optical signal is a pulse/sequence where the peak wavelength,

is defined as 850 nm

900 nm, and the pulse characteristics are compliant

with the IrDA Serial Infrared Physical Layer Link Specifications.

2. See IrDA Serial Infrared Physical Layer Link Specification Appendix A for ambient light.

Table 1. Pin Names

PIN NO.

DESCRIPTION

SYMBOL

LED Anode

LEDA

Transmitter Data Input

TxD

Receiver Data Output

RxD

Shut Down Circuit Input

Supply Voltage

Ground

GND

Figure 1. Package Orientation

GP2W0004YP-6

PIN 1

FRONT

REAR

PIN 6

PIN 1

PARAMETER

SYMBOL

MIN.

MAX.

UNIT

Supply Voltage

6.0

LED Supply Voltage

LEDA

7.0

Operating Temperature

OPR

-10

+70

°C

Storage Temperature

STG

-20

+85

°C

Soldering Temperature*

SOL

240

°C

PARAMETER

SYMBOL

OPERATING CONDITIONS

UNIT

CONDITIONS

Supply Voltage

2.4 to 5.5

LED Supply Voltage

LEDA

+ 4.0 (MAX.)

+ 2.4 V to 5.5 V

Logic HIGH Transmitter Input Voltage (TX

)

IHTXD

2/3 × V

Logic LOW Transmitter Input Voltage (TX

)

ILTXD

1/3 × V

Data Rate

9.6 to 115.2

kbit/s

Shutdown circuit HIGH level input voltage

IHSD

0.5

Shutdown circuit LOW level input voltage

ILSD

Operating Temperature

OPR

-25 to +85

°C

Infrared Transceiver

GP2W0004YP/XP

IrDA Technical Information

ELECTRICAL AND
OPTICAL SPECIFICATIONS

Specifications hold over the Recommended Operat-

ing Conditions, unless otherwise noted. All typical val-
ues are at 25°C. Figure 2 through Figure 5 show typical
signals and test conditions.

Figure 2. Input Signal Waveform, Detector Side

NOTES: At BR = 2.4 kbit/s: T

= 416.7 µs, T

= 78.1 µs

At BR = 115.2 kbit/s: T

= 8.68 µs, T

= 1.63 µs

RADIATION
INTENSITY OF
TRANSMITTER
3.6 mW/sr (MIN.)

GP2W0004YP-2

Figure 3. Output Waveform

Figure 4. Recommended Circuit, Emitter Side

90%

50%

10%

GP2W0004YP-3

1.63 µs

TX = 5.0 V

GP2W0004YP

LEDA

= 5.1

= 5 V

GP2W0004YP-5

Figure 5. Standard Optical System, Detector Side

GP2W0004YP-4

TRANSMITTER

(NOTE 1)

OSCILLOSCOPE

GP2W0004YP

NOTE:
1. Transmitter uses GP2W0004YP (

p = 870 nm TYP.)

with the radiation intensity attenuated to 3.6 mW/sr.
2.

Indicates horizontal and vertical directions.

3. Ee: Detector face illuminance < 10 x

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

ELECTRICAL DESIGN APPLICATION TIPS

Figure 6 shows the recommended application circuit

and passive values for GP2W0004YP. The table in
Figure 6 provides some approximate external passive
values for design reference. See the specification for
complete optical/electrical characteristic data.

Application Circuit and External Passives

The application circuit and external passives shown

in Figure 6 enable GP2W0004YP to operate at both
one meter and in 20 cm low power option communica-
tion mode at V

= 3.0 V.

Shutdown Mode

The `Shutdown' pin (Pin 4) is an active HIGH termi-

nal and controls the power saving mode as shown in
Table 2 and Figure 7.

Shutdown mode affects the power consumption of

the Receiver circuits and inhibits the transmitter LED.
The two circuits are internally connected. The transmit-
ter circuit does not conduct current during the shut-
down mode.

After shutdown, the Receiver circuits require 40 ms

to wakeup.

Figure 6. Application Circuit

LED

LEDA

TxD

RxD

GP2W0004YP-7

COMPONENTS

NOTE: All recommended values are for V

= 3.0 V

RECOMMENDED VALUES

F, 6.3 V or as appropriate

LED

1,500 pF, 25 V, or as needed

2.2

±5%, 1/2 W,1 meter at V

= 3.0 V

±1%, 1/8 W,

20 cm low power option at V

= 3.0 V

Table 2. Shutdown Pin Functions

INPUT

PERFORMANCE

LOW

Normal Mode

HIGH

Shutdown Mode

Open

Shutdown Mode

Figure 7. Shutdown-Receiver Wakeup Time

GP2W0004YP-8

RxD

NORMAL

HIGH

(or OPEN)

LOW

40 ms

Infrared Transceiver

GP2W0004YP/XP

IrDA Technical Information

Signal Waveform Example

Figure 9 provides examples of each waveform when

correctly operating the GP2W0004YP in a manner con-
forming to IrDA standards. Refer to the Basic System
Block Diagram in Figure 8 for the positions that corre-
spond to each waveform. Note that the IrDA bit stream
is inverted in the encoder and decoder circuits, and the
output pulse is sent during a `0' bit time. The waveform
examples are applicable as a design and evaluation
reference only, for understanding the GP2W0004YP
hardware implementation, as well as for performing
measurements.

MECHANICAL DESIGN TIPS
Recommended Footprint

Figure 10 shows the recommended footprint for

PCB design when using the SHARP GP2W0004YP
infrared transceiver module. All values in the figure are
applicable as a design reference and are in mm.

Figure 8. Basic System Block Diagram

GP2W0004YP-9

ENCODER

CIRCUIT

DECODER

CIRCUIT

Figure 9. Basic System Waveforms

NOTES:

1 Transmit data waveform

2 Encoder circuit output waveform

3 Transmitter output optical signal waveform

4 GP2W0004YP receiver output waveform

5 Receive data waveform

Data Rate

T =

Data rate: 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 38.4 kbit/s,
57.6 kbit/s, 115.2 kbit/s

3/16T

GP2W0004YP-10

Figure 10. Recommended Footprint

NOTE: Dimensions are in mm.

GP2W0004YP-11

1.1

6 - 0.9

P 1.55

P 1.55 × 5 = 7.75

6 - 2.6

1.1

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

Solder Paste Footprint

T h e s o l d e r p a s t e f o o t p r i n t d r a w i n g f o r

GP2W0004YP is shown in Figure 11. Note that the
shield contact for GP2W0004YP is applied through the
Ground pin in position 6. The shield is soldered to the
back of the transceiver at the ground pin, and a sepa-
rate contact for a ground tab is not required.

T h e s o l d e r p a s t e f o o t p r i n t d r a w i n g f o r

GP2W0004XP is shown in Figure 12.

For complete mechanical dimensions, refer to the

full specification.

Figure 11. GP2W0004YP Solder Paste Footprint

0.85

2.3

0.775

P 1.55 × 5 = 75

NOTE: Viewed from the parts side of PCB.

LENS (PD/LED) SIDE

GP2W0004YP-1

Figure 12. GP2W0004XP Solder Paste Footprint

0.85

1. Dimensions are in mm.

2. Soldering paste area.

NOTES:

2.3

1.825

0.775

0.80

0.775

2.325

5.60

3.875

GP2W0004YP-15

Infrared Transceiver

GP2W0004YP/XP

IrDA Technical Information

Designing the IR Cosmetic Window

Figure 13 provides example calculations and design

hints for IR cosmetic windows with viewing angles of
±18° in both the vertical and horizontal axes. All values
given here for the transceiver dimensions are only for
design reference and are in mm.

The optical window size should be the minimum size

of W × H, rectangular or elliptical, in order to not reduce
IrDA data transfer performance. The dimensions for W
can be calculated by the formula:

W = 2 × L × tan 18 + w

and the dimensions for H can be calculated by the

formula:

H = 2 × L × tan 18 + h

in the case where the viewing angle is +18°, which

conforms to or exceeds the IrDA Serial Infrared Physi-
cal Layer Link Specification. Any values to be calcu-
lated with these formula must be given in mm.

Figure 13. IR Window Cosmetic Design

(8.475)

NOTE: Dimensions are in mm.

GP2W0004YP-12

(3.15)

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

Product Packaging

Many products that use infrared communication

locate their reception component behind dark plastic.
This often fits in with the overall design and coloring of
the product and has an intentional design purpose as
well.

The photodiode that is used in optical receivers is

sensitive to a range of light wavelengths, not only the
wavelength intended for reception. Visible light has
many component factors and sources in a room. The
dark plastic used in product faceplates can be formu-
lated to act as a highpass filter, reducing the amount of
visible light and other wavelengths landing on the pho-
todiode and raising the internal noise currents.

The reduction of unwanted wavelengths provides for

a quieter and more sensitive receiver. The wavelength
used for IrDA data communication is 880 nm.

The characteristic of any plastic used in a final product
should be kept in mind and not attenuated at this wave-
length.

Figure 14 shows the basic characteristic of a high-

pass filter. The exact position of the slope and increas-
ing response will depend on the material selected. The
intent is to surprise visible light and neighboring wave-
lengths, and pass the desired 880 nm.

Plastic filters are available on the market, and ven-

dors carry plastic materials that may be cut, bent, or
molded. The key to selecting a plastics vendor is to ask
about the wavelength characteristics of the materials.
The more the vendor knows, the more likely the vendor
will be able to help you in a knowledgeable manner
when working on both the industrial design and wave-
length pass characteristics of your IR window. If the
vendor does not know what you are talking about, you
need to find a knowledgeable source for filter materials.

Figure 14. Highpass Filter Characteristics

GP2W0004YP-13

100

RESPONSE % TRANSMISSION

ULTRAVIOLET

VIOLET

BLUE-GREEN

GREEN

YELLOW

ORANGE

RED

300

400

500

600

700

800

900

1,000

1,100

WAVELENGTH, nm

Infrared Transceiver

GP2W0004YP/XP

IrDA Technical Information

Soldering Reflow Profile

Figure 15 is a straight-line representation of the rec-

ommended temperature profile for the IR solder reflow
process. The temperature profile is divided into four
process sections with three temperature/time change
rates. The temperature/time details are described in
Table 3.

I n p r o c e s s s e c t i o n 1 , t h e P C B a n d S M D

GP2W0004YP molded pinout joints are heated to a
temperature of 165°C to activate the flux in the solder
paste. The temperature ramp-up rate R1 should be
within the range of 1°C to 5°C per second. Package
temperature must be kept within the temperature range
specified in order to avoid localized temperature rise in
the resin.

In process section 2, sufficient time to dry the solder

paste should be provided, a maximum of 120 seconds
is recommended for optimum results. A stable temper-
ature is recommended with little temperature increase,
preferably staying at the level of 165°C.

Process section 3 is solder reflow. The temperature

should be raised to 240°C for 10 seconds, at the rate of
1°C to 4°C per second (R2) for the desired result. The
dwell time above 200°C must not exceed 60 seconds.
Beyond 60 seconds, weak and unreliable connections
will result.

Process section 4 is cooling. After solder reflow, the

temperature should then be reduced at the rate of -1°C
to -4°C per second (R3). Please note that deformation
of the PCB can also affect the pins of the package,
which may break the gold wire used in the transceiver
module. Full confirmation of the soldering reflow
machine condition is highly recommended for optimal
results.

Hand soldering should be conducted with a soldering

iron of less than 25 W, at less than 300°C. Soldering
time is less than 5 seconds per contact, with a second
or two between soldering each contact. The device
being soldered by hand should be at room temperature.
Use 60/40 or 63/37 solder, or Ag solder if it is available.

Table 3. Process Section Information

PROCESS SECTION

TEMPERATURE

SYMBOL

TERMPERATURE/TIME MAX.

1. Heat Up

~165°C

1°C - 5°C/sec. MAX.

2. Solder Paste Dry

165°C

3. Solder Reflow

165°C - 240°C

1°C - 5°C/sec. MAX.

4. Cooling

~200°C

-1°C - 4°C/sec. MAX.

Infrared Transceiver

GP2W0004YP/XP

IrDA Technical Information

Evaluation Board

The circuit diagram in Figure 16 is the recom-

mended evaluation circuit for the GP2W0004YP. This
circuit is provided on an evaluation board for test and
evaluation purposes. Samples are available through
your Sharp support office, Sales Representative, or
Distributor.

The resistor value for R

is selected based on the

supply voltage. The 5.1

value is selected for V

LEDA

between 3.6 V and 4.5 V, and has been loaded on the
test boards as a nominal value. Adjust it for your oper-
ating conditions per Table 4.

The forward current through the LED is adjusted by

the resistor value and directly controls the operating
range of the LED.

The capacitor values shown on the board are nomi-

nal for this test application. The final values are depen-
dent on the amount and frequency of noise in the final
system. Capacitor values need to be properly tailored
for the end application.

This test and evaluation board is not intended for

production applications and should be used for test and
evaluation purposes only.

Table 4. R

Value

RESISTOR VALUE

LED SUPPLY VOLTAGE (V

LEDA

)

RANGE

1.0

at 0.5 Watt

2.4

LEDA

3.3 V

3.0

at 0.5 Watt

3.0

LEDA

3.6 V

5.1

at 0.5 Watt

3.6

LEDA

4.5 V

7.5

at 0.5 Watt

4.5

LEDA

5.5 V

Figure 16. GP2W0004YP Recommended Evaluation Circuit

GP2W0004YP-14

LEDA
TXD
RXD
SD
V

GND

+
+
+
+
+

1
2
3
4
5
6

3
5
7
9

2
4
6
8
10

TXD
RXD

GP2W0004YP

22 µF

0.1 µF

5.1

, 1/2 W

GND

2 × 5

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

PACKING INFORMATION

This section describes the GP2W0004YP moisture-

proof packing and is only for reference. The same sec-
tion of the official specifications should be consulted for
detailed packing information.

Packing Specifications

PACKING MATERIAL

The GP2W0004YP reel is moisture-proof packed for

shipment. Table 5 describes the materials used for
each item of the moisture-proof packing.

TAPE AND REEL

Figures 17 through 19 show the reel dimensions and

product orientation in the reel.

G P 2 W 0 00 4 Y P i s th e s i d e v i ew de v i c e , a n d

GP2W0004XP is the top view device. Note that the
device orientation in the reel is not the same for both
devices.

Table 5. Packing Materials

ITEM

MATERIAL

Aluminum Laminate Bag

Aluminum Polyethylene

Label

Paper

Desiccant

Outer Case

Paper

Pads

Paper

Figure 17. Reel Structure and Dimensions

330

±2

±0.2

±0.5

22.5 MAX.

±0.8

17.5

±0.5

100

±0.1

GP2W0004YP-17

NOTE:

Dimensions are in mm.

GP2W0004YP/XP

Infrared Transceiver

IrDA Technical Information

Packing Method

Table 7 provides information on how each tape reel

is packaged. Each aluminum laminate bag contains
one reel (2,000 devices per reel) and desiccant. Four
reels in their bags are packed per carton (4 reels/car-
ton; 8,000 transceivers per carton).

The outer carton will then be sealed with craft tape,

with indication of model name, quantity, and outgoing
inspection date on the case.

Storage Conditions

The product should be stored with these conditions:

· Storage temperature: 10°C to 30°C

· Humidity: below 60% RH

Treatment After Opening

After unsealing, devices should be mounted within

the temperature condition of 10°C to 30°C, at the
humidity condition below 60% RH, within 3 days

(72 hours).

If long-term storage is needed, devices should either

be stored in a dry box or re-sealed in a moisture-proof
bag with desiccant and stored in an environment where
the temperature is 10°C to 30°C at the humidity condi-
tion of below 60% RH. Devices must be mounted within
two weeks.

Baking Before Mounting

In the event that the devices are not maintained in

the storage conditions described, or the enclosed des-
iccant indicator has turned pink in color, baking must be
done before devices are to be mounted. Also note that
devices should only be baked once.

These devices are hydroscopic, in that the plastic resin will ab-
sorb moisture. If the resin absorbs too much moisture, it will
undergo rapid mechanical expansion when passed through
the IR reflow process. This can cause device failures. The res-
in material from all device vendors has this characteristic.

CAUTION

Baking should be done with the devices removed from the
reel, as the reel will melt. To complete the baking properly, de-
vices should either be temporarily mounted to a PCB with ad-
hesive or placed in a metal tray. Any device that has been out
of dry pack for more than 72 hours should be dried in some
manner prior to any surface mount reflow process. Otherwise
these devices should be mounted and soldered by hand.

Recommended temperature: 100°C, 12 to 24 hours.

CAUTION

Table 7. Packing Methods

PACKING

SHAPE

PRODUCT

QUANTITY

PER REEL

QUANTITY

PER BAG

QUANTITY

PER CARTON

Tape reel

(

300 mm)

1 model

2,000 pieces

per reel

1 reel per

laminated bag

4 reels

per carton

GP2W0004YP/XP

Infrared Transceiver

Reference Code SMA02025

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited
Warranty for SHARP's product warranty. The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied.
ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND
FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or in any way responsible,
for any incidental or consequential economic or property damage.

NORTH AMERICA

EUROPE

JAPAN

SHARP Microelectronics of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: (1) 360-834-2500
Fax: (1) 360-834-8903
www.sharpsma.com

SHARP Microelectronics Europe
Division of Sharp Electronics (Europe) GmbH
Sonninstrasse 3
20097 Hamburg, Germany
Phone: (49) 40-2376-2286
Fax: (49) 40-2376-2232
www.sharpsme.com

SHARP Corporation
Electronic Components & Devices
22-22 Nagaike-cho, Abeno-Ku
Osaka 545-8522, Japan
Phone: (81) 6-6621-1221
Fax: (81) 6117-725300/6117-725301
www.sharp-world.com

TAIWAN

SINGAPORE

KOREA

SHARP Electronic Components
(Taiwan) Corporation
8F-A, No. 16, Sec. 4, Nanking E. Rd.
Taipei, Taiwan, Republic of China
Phone: (886) 2-2577-7341
Fax: (886) 2-2577-7326/2-2577-7328

SHARP Electronics (Singapore) PTE., Ltd.
438A, Alexandra Road, #05-01/02
Alexandra Technopark,
Singapore 119967
Phone: (65) 271-3566
Fax: (65) 271-3855

SHARP Electronic Components
(Korea) Corporation
RM 501 Geosung B/D, 541
Dohwa-dong, Mapo-ku
Seoul 121-701, Korea
Phone: (82) 2-711-5813 ~ 8
Fax: (82) 2-711-5819

CHINA

HONG KONG

SHARP Microelectronics of China
(Shanghai) Co., Ltd.
28 Xin Jin Qiao Road King Tower 16F
Pudong Shanghai, 201206 P.R. China
Phone: (86) 21-5854-7710/21-5834-6056
Fax: (86) 21-5854-4340/21-5834-6057
Head Office:
No. 360, Bashen Road,
Xin Development Bldg. 22
Waigaoqiao Free Trade Zone Shanghai
200131 P.R. China
Email: smc@china.global.sharp.co.jp

SHARP-ROXY (Hong Kong) Ltd.
3rd Business Division,
17/F, Admiralty Centre, Tower 1
18 Harcourt Road, Hong Kong
Phone: (852) 28229311
Fax: (852) 28660779
www.sharp.com.hk
Shenzhen Representative Office:
Room 13B1, Tower C,
Electronics Science & Technology Building
Shen Nan Zhong Road
Shenzhen, P.R. China
Phone: (86) 755-3273731
Fax: (86) 755-3273735

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