IrDA Technical Information

GP2W0116YPS/118YPS

IrDA Technical Information

Compact Transceiver

FEATURES

· IrDA Low Power Option Compatibility for Telecom-

munication and Mobile Terminals

· Low Volume Package Design

7.2 (W) × 2.75 (D) × 1.85 (H) mm, 36.6 mm

· Low Current Receive Mode, 90

A TYP.

· Built-in Shut-Down Mode (0.001

A TYP.)

· Internal LED Current Regulator.

= 2.0 V - 3.6 V, V

LEDA

= 2.0 - 6.0 V

External LED Current Limiting Resistor not Required

· Soldering Reflow Capable

· SMD Lead-less Packages For Either Vertical Mount

or Horizontal Mount to PCBs

· Added Features include Tri-state Output and Split-

Voltage Supply Capability

· Top View Version: GP2W0118YPS

APPLICATIONS

· Telecommunication Products

Cellular Phones
Pagers
Smart Phones

· Mobile Products

PDAs
Electronic Wallets

· Imaging Products

Portable Printers
Portable Text Scanners

DESCRIPTION

The SHARP GP2W0116YPS is a low-power, short-

range infrared transceiver module. It meets the Mobile
Communication low power option within the IrDA Spec-
ifications for the 20 cm communication range. This unit
provides the interface between logic and IR signals for
through-air, serial, half-duplex IR wireless data links at
rates up to 115 kbit/s and is designed to satisfy the IrDA
physical layer (PHY) specifications.

The SHARP GP2W0116YPS infrared transceiver

module contains a high speed, high efficiency, low power
consumption AlGaAs LED, silicon PIN photodiode, and
low power bipolar integrated circuit. The IC contains a
LED driver circuit and a receiver that provides the RX
output supporting 2.4 kbit/s to 115.2 kbit/s IrDA signals,
meeting the IrDA low power option communication stan-
dard (0.2 m link distance with low powered devices and
0.3 m link distance with standard devices.)

The GP2W0116YPS includes a constant current

source in the LED driver circuit that eliminates the need
for an external current limiting resistor in the LED circuit.

The low power option specification is an excellent

choice for telecommunication products and mobile ter-
minals, such as mobile phones, paging devices, and
PDA-cellular combined multimedia devices. The trans-
ceiver module provides wireless data link capability for
mobile phones and pagers, PDAs, or any other IrDA
application already introduced to the marketplace.

The transceiver module receiver electronics operate

at 2.0 V through 3.6 V without any performance degra-
dation. The split-voltage supply allows the LED voltage
to come from a separate supply. For example, in a cell
phone the LED may operate from the battery, while the
receiver and logic section is supplied from a lower volt-
age regulated supply.

This enables an energy-saving design in any appli-

cation field, with alternatives for supply voltage and
flexibility for other components. The GP2W0116YPS
transceiver module has a built-in 0.001

A shutdown

mode for those applications that are very conscious
about current consumption. The GP2W0116YPS also
has a tri-state output, which allows its use in applica-
tions where one I/O port connection may be connected
to more than one I/O device.

The shield is appropriate in applications where Elec-

tro-Magnetic Interference (EMI) is a concern. Infrared
energy is immune to EMI; however, the receiving PIN
photodiode is somewhat sensitive to EMI. This is the
case in all IR communication devices.

GP2W0116YPS/118YPS

Compact Transceiver

IrDA Technical Information

PACKAGE

The dimensional drawing and all packaging informa-

tion is available in the specification, which is available
from your Sharp Components representative. The
specification will have the most up-to-date information.

ABSOLUTE MAXIMUM RATINGS

NOTE: *See the Soldering Reflow Profile section.

RECOMMENDED OPERATING CONDITIONS

NOTE: *Bit rate = 115 kbit/s (in-band signals). An in-band optical signal is a pulse/sequence

where the peak wavelength,

P, is defined as 850 nm

900 nm, and the pulse

characteristics comply with IrDA Serial Infrared Physical Layer Link Specifications.

Table 1. Pin Names

PIN NO.

DESCRIPTION

SYMBOL

Supply Voltage

Ground

GND

Shutdown

Receiver Data Output

RXD

Transmitter Data Input

TXD

LED Anode

LEDA

Figure 1. Package Orientation

PIN 1

FRONT VIEW

REAR VIEW

PIN 6

PIN 1

GP2W0116YPS-3

PARAMETER

SYMBOL MIN. MAX. UNIT

Supply Voltage

6.0

LED Supply Voltage

LEDA

7.0

Peak Forward LED Current

Operating Temperature

OPR

-40

+85

°C

Storage Temperature

STG

-40

+85

°C

Soldering Temperature*

SOL

260

°C

PARAMETER

SYMBOL

MIN.

MAX.

UNIT

CONDITIONS

Supply Voltage

2.0

3.6

LED Supply Voltage

LEDA

2.0

6.0

Logic HIGH Shut-down Terminal Input Voltage

IHSD

× 0.67

Shutdown Mode

Logic LOW Shut-down Terminal Input Voltage

ILSD

0.0

× 0.1

Normal Mode

Logic HIGH Transmitter Input Voltage (TXD)

IHTXD

× 0.80

LED ON

Logic LOW Transmitter Input Voltage (TXD)

ILTXD

0.0

× 0.2

LED OFF

Logic HIGH Receiver Input Irradiance*

0.081

mW/cm

Receiver Signal Rate

2.4

4,000

kbit/s

Operating Temperature

OPR

°C

25°C TYP.

Compact Transceiver

GP2W0116YPS/118YPS

IrDA Technical Information

ELECTRICAL AND OPTICAL
SPECIFICATIONS

Specifications in Table 2 hold over the Recom-

mended Operating Conditions, unless otherwise noted.

All typical values are at 25°C, and V

= 2.0 V to 3.6 V,

unless otherwise noted. Refer to the specifications for
complete details and conditions.

NOTE: *I

current goes into IC while RXD is ON state.

Table 2. Electrical and Optical Specifications

PARAMETER

SYMBOL

MIN.

TYP. MAX.

UNIT

CONDITIONS

Maximum Reception Distance

0.2

1/2

15°, I

3.3 mW/sr

High Level Output Voltage

OHRXD

0.4

= 20

Low Level Output Voltage*

OLRXD

0.45

= 20

Viewing Angle

degrees

Low Level Pulse Width

1.28

6.0

BR = 115.2 kbit/s, 2

1/2

15°

Current Consumption

120

With no input signal, SD = 0 V,
Output Terminal Open

DD-S

0.001

0.1

Shutdown Mode, no input signal,
V

IHSD

= V

0.5 V,

Output Terminal Open,
T

OPR

= 25°C, V

= 3.3 V

Rise Time

0.06

See Figure 2

Fall Time

0.06

See Figure 2

Latency

TAT

300

Receiver Wakeup Time

tsdw

200

No input signal

Radiant Intensity

4.0

mW/sr

1/2

15°, BR = 115.2 kbit/s,

LEDA

= 3.3 V, V

IHTXD

= 2.8 V

Peak Emission Wavelength

850

870

900

Peak LED Current

LED

Shutdown Input Current

lisd

-0.02

+0.02

OPR

= 25°C, V

= 3.3 V

Figure 2. Infrared Transceiver Module Output

90%

50%

10%

CRITERIA FOR

PULSE POSITION

GP2W0116YPS-1

GP2W0116YPS/118YPS

Compact Transceiver

IrDA Technical Information

ELECTRICAL DESIGN APPLICATION TIPS

The only external component needed for the

GP2W0116YPS is a capacitor for filtering power supply
noise. See the Mechanical Design Hints section for
technical reference data in optical/electrical character-
istics. An optional resistor can be added in series with
the V

line if the system power supply is noisy and

additional filtering is required. A resistor value of 1

is suggested, depending on the amount of filtering

required.

Application Circuit and External
Components

Figure 3 shows the recommended application circuit.

LEDA

may be connected to V

or driven sepa-

rately from a different voltage source that is within the
allowed range. The recommended operating voltage
range for V

is 2.0 V to 3.6 V, and the operating range

for V

LEDA

is 2.0 to 6.0 V.

An example of the split voltage source design is

shown in Figure 4. In the figure, the V

pin is used to

provide power to the receiver electronics. This inter-
face can be at a lower potential than the voltage used
to source the LED.

The V

LEDA

voltage may be directly driven from the

battery in the above design example. The V

associ-

ated with the receiver interface electronics may be sup-
ported by a power regulator or other device providing

an efficient regulated lower voltage source. This volt-
age may be as low as 2.0 V to 3.6 V, and the V

LEDA

potential may range from 2.0 V to 6.0 V.

An alternative is to connect the V

LEDA

and V

pins

together as shown in Figure 5. This arrangement allows
the GP2W0116YPS to be used in previous applications
where both of these voltage sources are connected.

Figure 3. Application Circuit

GP2W0116YPS-4

GND

TXD

RXD

LEDA

COMPONENT

NOTE: CX value should be adjusted in accordance
with the noise level and the power supply frequency.

RECOMMENDED VALUE

F/6.3 V (NOTE)

Figure 4. Split Voltage Source

Figure 5. Combined Voltage Source

RECEIVER

INTERFACE

ELECTRONICS

RXD

LEDA

TXD

GP2W0116YPS-5

RECEIVER

INTERFACE

ELECTRONICS

RXD

LEDA

TXD

GP2W0116YPS-6

Compact Transceiver

GP2W0116YPS/118YPS

IrDA Technical Information

Shutdown Mode

The `Shutdown' pin is an active HIGH terminal and

performs the power saving function in accordance with
Figure 6 and Table 3.

Signal Waveform Example

Figure 9 shows the waveform at each point in the

block diagram while operating the GP2W0116YPS in a
manner conforming to IrDA standards. The waveform
example is only applicable as a design and evaluation
reference to understand the GP2W0116YPS hardware
implementation and system measurement.

Table 3. Shutdown Modes

INPUT

PERFORMANCE

HIGH

Shutdown Mode

LOW

Normal Operation Mode

OPEN

Normal Operation Mode

Figure 6. Shutdown-Receiver Wake Up Time

Table 4. Shutdown Truth Table

TXD

LED

RECEIVER

TR1

RXD

LOW

HIGH

Don't Care

Pull-up

LOW

Off

IrDA Signal

Off

LOW

No Signal

Off

HIGH

Don't

Care

Off

Don't Care

Off

Pull-up

Figure 7. RXD Output Configuration

RXD

OPERABLE

SHUTDOWN

ENABLED

HIGH

(or OPEN)

LOW

0.2 ms

GP2W0116YPS-7

TR1

TR2

260 k

TYPICAL

RXD

GP2W0116YPS-2

Figure 8. Basic System Diagram

Figure 9. Basic IrDA Waveforms

ENCODER

CIRCUIT

DECODER

CIRCUIT

GP2W0116YPS-8

NOTES:

1 Transmit data waveform

2 Encoder circuit output waveform

3 Transmitter output optical signal waveform

4 GP2W0116YP receiver output waveform

5 Receiver data waveform

Data Rate

Data rate: 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 38.4 kbit/s,
57.6 kbit/s, 115.2 kbit/s

3/16t

GP2W0116YPS-9

GP2W0116YPS/118YPS

Compact Transceiver

IrDA Technical Information

MECHANICAL DESIGN HINTS

Recommended Footprint

Figure 10 shows the recommended footprint dimen-

sions that may also be used for the solder mask stencil.

Note that the footprint spacing for the electrical con-

tacts is the same. The position of the ground tab con-
nection between the side view (GP2W0116YPS) and

the top view (GP2W0118YPS) orientation are different.
For ground tab connections, pin 7 should be connected
to the ground plane associated with the power connec-
tion for the IrDA device. The center of the device
mounting position is also slightly shifted between the
two drawings. Figure 11 shows a composite footprint
that may be used when both devices are mounted on
the same footprint for multiple applications.

Figure 10. Footprint Dimensions

Figure 11. Composite Footprint

3.0

0.6

0.8

3.95

0.475

VIEW FROM COMPONENT SIDE

Pin shown for position reference,

Pin is Shield Ground

GP2W0116YPS

LENS (PD/LED) SIDE

GP2W0118YPS

LENS (PD/LED) SIDE

1.425

0.475

2.375

1.1

1.55

0.85

1.40

0.25

0.1

1.55

2.0

VIEW FROM COMPONENT SIDE

Pin shown for position reference,

Pin is Shield Ground

GP2W0116YPS-11

NOTE: Dimensions are in mm.

GP2W0116YPS-13

NOTES:
1. Solder paste not needed when using GP2W0118YPS.
2. Solder paste not needed when using GP2W0116YPS.
3. Dimensions are in mm.

4. Pin shown for position reference.

5. Pin is Shield Ground

0.85

1.40

0.6

1.55

1.425

3.0

0.475

2.375

3.95

1.1

2.0

0.25

0.10

0.8

See

Note 1

BODY CENTER

for GP2W0118YPS

BODY CENTER

for GP2W0116YPS

See

Note 2

See

Note 2

Compact Transceiver

GP2W0116YPS/118YPS

IrDA Technical Information

Designing the IR Cosmetic Window

Figure 12 provides example calculations and design

hints for IR cosmetic windows with viewing angles of
±18° in both the vertical and horizontal axes. All values
given here for transceiver dimensions are only for refer-
ence. Consult the current data sheet for specifications.
The IrDA specifications require a ±15° viewing angle at
the transceiver. The ±18° angle shown here provides a
little extra clearance to allow for slight manufacturing
variations and that the required angle is always met.

The optical window size should be the minimum size

of W × H, rectangular or elliptical, to have the best IrDA
data transfer performance. The dimensions for W can
be calculated by the formula:

W = 2 × L × tan18 + w

and the dimensions for H can be calculated by the
formula:

H = 2 × L × tan18 + h

in the case of having a viewing angle of 18°, which con-
forms to or exceeds the IrDA Serial Infrared Physical
Layer Link Specifications. Values calculated with the for-
mula are in mm. The dimension `7.9' in Figure 12 is the
physical length of the transceiver. This distance includes
the side angles of the optical lenses to simplify the over-
all calculation. The height of the transceiver is 2.0 mm
with the shield.

Product Packaging

Many products that use infrared communication locate

their reception component behind dark plastic. This often
fits in with the overall design and coloring of the product
and has an intentional design purpose as well.

The photodiode that is used in optical receivers is

sensitive to a range of light wavelengths, not only the
wavelength intended for reception. Visible light has
many component factors and sources in a room. The
dark plastic used in product faceplates can be formu-
lated to act as a highpass filter, reducing the amount of
visible light and other wavelengths landing on the pho-
todiode and raising the internal noise currents.

The reduction of unwanted wavelengths provides for

a quieter and more sensitive receiver. The wavelength
used for IrDA data communication is 880 nm. The char-
acteristic of any plastic used in a final product should be
kept in mind and not attenuated at this wavelength.

Glass and plastic filters are available on the market,

and vendors carry plastic materials that may be cut,
bent, or molded. The key to selecting a plastics vendor
is to ask about the wavelength characteristics of the
materials. The more the vendor knows, the more likely
the vendor will be able to help you in a knowledgeable
manner when working on both the industrial design and
wavelength characteristics of your IR window. If the
vendor does not know what you are talking about, you
need to find a more knowledgeable source for filter
materials.

Figure 12. IR Window Cosmetic Design

(7.9)

NOTE: Dimensions are in mm.

(2.0)

GP2W0116YPS-12

GP2W0116YPS/118YPS

Compact Transceiver

IrDA Technical Information

SOLDERING REFLOW PROFILE

Figure 13 is a straight-line representation of the rec-

ommended temperature profile for the IR solder reflow
process. The temperature profile is divided into four
process sections with three temperature/time change
rates. The temperature/time details are described in
Table 5.

I n p r o c e s s s e c t i o n 1 , t h e P C B a n d S M D

GP2W0116YPS molded pinout joints are heated to a
temperature of 165°C to activate the flux in the solder
paste. The temperature ramp-up rate R1 should be
within the range of 1°C to 5°C per second. Package
temperature must be kept within the temperature range
specified in order to avoid localized temperature rise in
the resin by the infrared lamp.

In process section 2, sufficient time to dry the solder

paste should be provided, a maximum of 120 seconds
is recommended for optimum results. A stable temper-
ature is recommended with little temperature increase,
preferably staying at the level of 165°C.

Process section 3 is solder reflow. The temperature

should be raised to 260°C for 5 seconds, at the rate of
1°C to 4°C per second (R2) for the desired result. The
dwell time above 200°C must not exceed 60 seconds.
Beyond 60 seconds, weak and unreliable connections
will result. The temperature should then be reduced at
the rate of -1°C to -4°C per second (R3). Please note
that deformation of the PCB can also affect the pins of
the package, which may break the gold wire used in the
transceiver module. Full confirmation of the soldering
reflow machine condition is highly recommended for
optimal results.

Hand soldering should be conducted with a soldering

iron of less than 25 W, at less than 300°C. Soldering
time is less than 5 seconds per contact, with a second
or two between soldering each contact. The device
being soldered by hand should be at room temperature.
Use 60/40 or 63/37 solder, or Ag solder if it is available.

Table 5. Process Step Information

SECTION

TEMPERATURE SYMBOL TERMPERATURE/TIME MAX.

Heat Up

~165°C

1°C - 5°C/sec. MAX.

Solder Paste Dry

165°C

Solder Reflow

165°C - 230°C

1°C - 5°C/sec. MAX.

Cooling

~200°C

-1°C - 4°C/sec. MAX.

GP2W0116YPS/118YPS

Compact Transceiver

Reference Code SMA02050

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited
Warranty for SHARP's product warranty. The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied.
ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND
FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or in any way responsible,
for any incidental or consequential economic or property damage.

NORTH AMERICA

EUROPE

JAPAN

SHARP Microelectronics of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: (1) 360-834-2500
Fax: (1) 360-834-8903
www.sharpsma.com

SHARP Microelectronics Europe
Division of Sharp Electronics (Europe) GmbH
Sonninstrasse 3
20097 Hamburg, Germany
Phone: (49) 40-2376-2286
Fax: (49) 40-2376-2232
www.sharpsme.com

SHARP Corporation
Electronic Components & Devices
22-22 Nagaike-cho, Abeno-Ku
Osaka 545-8522, Japan
Phone: (81) 6-6621-1221
Fax: (81) 6117-725300/6117-725301
www.sharp-world.com

TAIWAN

SINGAPORE

KOREA

SHARP Electronic Components
(Taiwan) Corporation
8F-A, No. 16, Sec. 4, Nanking E. Rd.
Taipei, Taiwan, Republic of China
Phone: (886) 2-2577-7341
Fax: (886) 2-2577-7326/2-2577-7328

SHARP Electronics (Singapore) PTE., Ltd.
438A, Alexandra Road, #05-01/02
Alexandra Technopark,
Singapore 119967
Phone: (65) 271-3566
Fax: (65) 271-3855

SHARP Electronic Components
(Korea) Corporation
RM 501 Geosung B/D, 541
Dohwa-dong, Mapo-ku
Seoul 121-701, Korea
Phone: (82) 2-711-5813 ~ 8
Fax: (82) 2-711-5819

CHINA

HONG KONG

SHARP Microelectronics of China
(Shanghai) Co., Ltd.
28 Xin Jin Qiao Road King Tower 16F
Pudong Shanghai, 201206 P.R. China
Phone: (86) 21-5854-7710/21-5834-6056
Fax: (86) 21-5854-4340/21-5834-6057
Head Office:
No. 360, Bashen Road,
Xin Development Bldg. 22
Waigaoqiao Free Trade Zone Shanghai
200131 P.R. China
Email: smc@china.global.sharp.co.jp

SHARP-ROXY (Hong Kong) Ltd.
3rd Business Division,
17/F, Admiralty Centre, Tower 1
18 Harcourt Road, Hong Kong
Phone: (852) 28229311
Fax: (852) 28660779
www.sharp.com.hk
Shenzhen Representative Office:
Room 13B1, Tower C,
Electronics Science & Technology Building
Shen Nan Zhong Road
Shenzhen, P.R. China
Phone: (86) 755-3273731
Fax: (86) 755-3273735

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: GP2W0116YPS-2