LH28F016SU
1
16M (1M 16, 2M 8) Flash Memory
Figure 1. TSOP Configuration
FEATURES
User-Configurable x8 or x16 Operation
User-Selectable 3.3 V or 5 V V
CC
70 ns Maximum Access Time
0.32 MB/sec Write Transfer Rate
100,000 Erase Cycles per Block
32 Independently Lockable Blocks
5 V Write/Erase Operation (5 V V
PP
)
No Requirement for DC/DC Converter
to Write/Erase
Minimum 2.7 V Read capability
160 ns Maximum Access Time
(V
CC
= 2.7 V)
Revolutionary Architecture
Pipelined Command Execution
Write During Erase
Command Superset of
Sharp LH28F008SA
5 A (Typ.) I
CC
in CMOS Standby
1 A (Typ.) Deep Power-Down
State-of-the-Art 0.55 m ETOXTM
Flash Technology
56-Pin, 1.2 mm 14 mm 20 mm
TSOP (Type I) Package
28F016SUT-1
TOP VIEW
56-PIN TSOP
2
3
4
5
8
9
A
16
A
19
A
20
53
52
51
50
49
48
45
42
NC
6
7
A
17
A
18
47
46
RY/BY
DQ
15
DQ
14
GND
GND
10
11
12
55
54
OE
V
CC
13
44
DQ
4
43
V
CC
A
15
DQ
7
14
15
16
17
18
19
20
39
36
41
40
38
37
DQ
3
DQ
10
DQ
2
V
CC
A
10
A
9
A
11
V
PP
RP
CE
0
A
8
DQ
9
WE
DQ
6
DQ
13
DQ
11
56
1
CE
1
3/5
WP
21
22
23
24
25
26
27
28
A
4
A
3
A
5
A
7
A
6
GND
A
2
A
1
34
DQ
8
35
DQ
1
31
33
32
30
29
A
0
BYTE
NC
NC
DQ
0
A
14
A
13
A
12
DQ
5
DQ
12
LH28F016SU
16M (1M 16, 2M 8) Flash Memory
2
Figure 2. TSOP Reverse Bend Configuration
INTRODUCTION
Sharp's LH28F016SU 16M Flash Memory is a revo-
lutionary architecture which enables the design of truly
mobile, high performance, personal computing and com-
munication products. With innovative capabilities, 5 V
single voltage operation and very high read/write per-
formance, the LH28F016SU is also the ideal choice for
designing embedded mass storage memory systems.
The LH28F016SU is a very high density, highest per-
formance non-volatile read/write solution for solid-state
storage applications. Its symmetrically blocked archi-
tecture (100% compatible with the LH28F008SA 8M
Flash memory), extended cycling, low power 3.3 V
operation, very fast write and read performance and
selective block locking provide a highly flexible memory
component suitable for high density memory cards,
Resident Flash Arrays and PCMCIA-ATA Flash Drives.
The LH28F016SU's dual read voltage enables the
design of memory cards which can interchangeably be
read/written in 3.3 V and 5.0 V systems. Its x8/x16
architecture allows the optimization of memory to pro-
cessor interface. The flexible block locking option
enables bundling of executable application software in
a Resident Flash Array or memory card. Manufactured
on Sharp's 0.55 m ETOXTM process technology, the
LH28F016SU is the most cost-effective, high-density
3.3 V flash memory.
DESCRIPTION
The LH28F016SU is a high performance 16M
(16,777,216 bit) block erasable non-volatile random
access memory organized as either 1M 16 or 2M 8.
The LH28F016SU includes thirty-two 64K (65,536)
blocks or thirty-two 32-KW (32,768) blocks. A chip
memory map is shown in Figure 4.
The implementation of a new architecture, with many
enhanced features, will improve the device operating
characteristics and results in greater product reliability
and ease of use.
Among the significant enhancements of the
LH28F016SU:
5 V Write/Erase Operation (5 V V
PP
)
3.3 V Low Power Capability (2.7 V V
CC
Read)
Improved Write Performance
Dedicated Block Write/Erase Protection
A 3/5
input pin reconfigures the device internally for
optimized 3.3 V or 5.0 V read/write operation.
The LH28F016SU will be available in a 56-pin,
1.2 mm thick 14 mm 20 mm TSOP (Type I) pack-
age. This form factor and pinout allow for very high board
layout densities.
28F016SUT-17
TOP VIEW
56-PIN TSOP
2
3
4
5
8
9
A
16
A
19
A
20
53
52
51
50
49
48
45
42
NC
6
7
A
17
A
18
47
46
DQ
15
DQ
14
GND
GND
10
11
12
55
54
OE
V
CC
13
44
DQ
4
43
V
CC
A
15
DQ
7
14
15
16
17
18
19
20
39
36
41
40
38
37
DQ
3
DQ
10
DQ
2
V
CC
A
10
A
9
A
11
V
PP
RP
CE
0
A
8
DQ
9
WE
DQ
6
DQ
13
DQ
11
56
1
CE
1
3/5
WP
21
22
23
24
25
26
27
28
A
4
A
3
A
5
A
7
A
6
GND
A
2
A
1
34
DQ
8
35
DQ
1
31
33
32
30
29
A
0
BYTE
NC
NC
DQ
0
A
14
A
13
A
12
DQ
5
DQ
12
RY/BY
16M (1M 16, 2M 8) Flash Memory
LH28F016SU
3
Figure 3. LH28F016SU Block Diagram (Architectural Evolution Includes Page Buffers,
Queue Registers and Extended Status Registers)
OUTPUT
BUFFER
OUTPUT
BUFFER
INPUT
BUFFER
INPUT
BUFFER
DQ
8
- DQ
15
DQ
0
- DQ
7
ID
REGISTER
OUTPUT
MULTIPLEXER
CSR
ESRs
DATA
COMPARATOR
DATA
QUEUE
REGISTERS
PAGE
BUFFERS
I/O
LOGIC
CUI
WSM
64KB BLOCK 0
64KB BLOCK 1
64KB BLOCK 30
64KB BLOCK 31
. . .
. . .
Y GATING/SENSING
Y-DECODER
X-DECODER
CE
0
CE
1
OE
WE
WP
RP
PROGRAM/
ERASE
VOLTAGE
SWITCH
3/5
BYTE
V
PP
3/5
V
CC
GND
RY/BY
ADDRESS
COUNTER
ADDRESS
QUEUE
LATCHES
INPUT
BUFFER
A
0
- A
20
. . .
28F016SUT-2
LH28F016SU
16M (1M 16, 2M 8) Flash Memory
4
PIN DESCRIPTION
SYMBOL
TYPE
NAME AND FUNCTION
A
0
INPUT
BYTE-SELECT ADDRESS:
Selects between high and low byte when device is in x8
mode. This address is latched in x8 Data Writes. Not used in x16 mode (i.e., the A
0
input buffer is turned off when BYTE is high).
A
1
- A
15
INPUT
WORD-SELECT ADDRESSES:
Select a word within one 64K block. A
6
-
A
15
selects
1 of 1024 rows, and A
1
- A
5
selects 16 of 512 columns. These addresses are
latched during Data Writes.
A
16
- A
20
INPUT
BLOCK-SELECT ADDRESSES:
Select 1 of 32 Erase blocks. These addresses are
latched during Data Writes, Erase and Lock-Block operations.
DQ
0
- DQ
7
INPUT/OUTPUT
LOW-BYTE DATA BUS:
Inputs data and commands during CUI write cycles.
Outputs array, buffer, identifier or status data in the appropriate Read mode. Floated
when the chip is de-selected or the outputs are disabled.
DQ
8
- DQ
15
INPUT/OUTPUT
HIGH-BYTE DATA BUS
: Inputs data during x16 Data-Write operations. Outputs
array, buffer or identifier data in the appropriate Read mode; not used for Status
register reads. Floated when the chip is de-selected or the outputs are disabled.
CE
0
, CE
1
INPUT
CHIP ENABLE INPUTS
: Activate the device's control logic, input buffers, decoders and
sense amplifiers. With either CE
0
or CE
1
high, the device is de-selected and power
consumption reduces to Standby levels upon completion of any current Data-Write or
Erase operations. Both CE
0
, CE
1
must be low to select the device. All timing
specifications are the same for both signals. Device Selection
occ
urs with the latter
falling edge of CE
0
or CE
1
. The first rising edge of CE
0
or CE
1
disables the device.
RP
INPUT
RESET/POWER-DOWN:
With RP
low, the device is reset, any current operation is
aborted and device is put into the deep power down mode. When the power is
turned on, RP
pin is turned to low in order to return the device to default con-
figuration. When the 3/5
pin is switched, or when the power transition is occurred, or
at the power on/off, RP
is required to stay low in order to protect data from noise.
When returning from Deep Power-Down, a recovery time of 400
ns
(V
CC
+5.0 V
0.5 V) is required to allow these circuits to power-up. When RP
goes
low, any current or pending WSM operation(s) are terminated, and the device is
reset. All Status registers return to ready (with all status flags cleared). After
returning, the device is in read array mode.
OE
INPUT
OUTPUT ENABLE:
Gates device data through the output buffers when low. The
outputs float to tri-state off when OE
is high.
NOTE:
CE
X
overrides OE
, and OE
overrides WE.
WE
INPUT
WRITE ENABLE:
Controls access to the CUI, Page Buffers, Data Queue Registers
and Address Queue Latches. WE is active low, and latches both address and data
(command or array) on its rising edge.
RY
/BY
OPEN DRAIN
OUTPUT
READY/BUSY:
Indicates status of the internal WSM. When low, it indicates that the
WSM is busy performing an operation. RY/BY# high indicates that the WSM is ready
for new operations (or WSM has completed all pending operations), or Erase is
Suspended, or the device is in deep power-down mode. This output is always active
(i.e., not floated to tri-state off when OE
or CE
0
, CE
1
are high), except if a RY
/BY
Pin Disable command is issued.
16M (1M 16, 2M 8) Flash Memory
LH28F016SU
5
PIN DESCRIPTION (Continued)
SYMBOL
TYPE
NAME AND FUNCTION
WP
INPUT
WRITE PROTECT:
Erase blocks can be locked by writing a non-volatile lock-bit for
each block. When WP is low, those locked blocks as reflected by the Block-Lock Status
bits (BSR.6), are protected from inadvertent Data Writes or Erases. When WP is high,
all blocks can be Written or Erased regardless of the state of the lock-bits. The WP
input buffer is disabled when RP
transitions low (deep power-down mode).
BYTE
INPUT
BYTE ENABLE:
BYTE low places device x8 mode. All data is then input or output
on DQ
0
- DQ
7
, and DQ
8
- DQ
15
float. Address A
0
selects between the high and low
byte. BYTE high places the device in x16 mode, and turns off the A
0
input buffer.
Address A
1
, then becomes the lowest order address.
3/5
INPUT
3.3/5.0 VOLT SELECT:
3/5
high configures internal circuits for 3.3 V operation. 3/5
low configures internal circuits for 5.0 V operation.
NOTES:
Reading the array with 3/5
high in a 5.0 V system could damage the
device. There is a significant delay from 3/5
switching to valid data.
V
PP
SUPPLY
ERASE/WRITE POWER SUPPLY:
For erasing memory array blocks or writing
words/bytes/pages into the flash array.
V
CC
SUPPLY
DEVICE POWER SUPPLY (3.3 V 0.3 V, 5.0 V 0.5 V) (2.7 V ~ 3.6 V at Read
Operation)
: Do not leave any power pins floating.
GND
SUPPLY
GROUND FOR ALL INTERNAL CIRCUITRY:
Do not leave any ground pins floating.
NC
NO CONNECT:
No internal connection to die, lead may be driven or left floating.
The LH28F016SU incorporates two Page Buffers of
256 Bytes (128 Words) each to allow page data writes.
This feature can improve a system write performance
over previous flash memory devices.
All operations are started by a sequence of Write
commands to the device. Three Status Registers
(described in detail later) and a RY
/BY
output pin
provide information on the progress of the requested
operation.
While the LH28F008SA requires an operation to com-
plete before the next operation can be requested, the
LH28F016SU allows queuing of the next operation while
the memory executes the current operation. This elimi-
nates system overhead when writing several bytes in a
row to the array or erasing several blocks at the same
time. The LH2F016SUR-10 can also perform write op-
erations to one block of memory while performing erase
of another block.
The LH28F016SU provides user-selectable block
locking to protect code or data such as Device Drivers,
PCMCIA card information, ROM-Executable O/S or
Application Code. Each block has an associated non-
volatile lock-bit which determines the lock status of the
block. In addition, the LH28F016SU has a master Write
Protect pin (WP
) which prevents any modifications to
memory blocks whose lock-bits are set.
A Command User Interface (CUI) serves as the sys-
tem interface between the microprocessor or
microcontroller and the internal memory operation.
Internal Algorithm Automation allows Byte/Word
Writes and Block Erase operations to be executed
using a Two-Write command sequence to the CUI in
the same way as the LH28F008SA 8M Flash memory.
A Superset of commands have been added to the
basic LH28F008SA command-set to achieve higher
write performance and provide additional capabilities.
These new commands and features include:
Page Buffer Writes to Flash
Command Queuing Capability
Automatic Data Writes During Erase
Software Locking of Memory Blocks
Two-Byte Successive Writes in 8-bit Systems
Erase All Unlocked Blocks
Writing of memory data is performed in either byte or
word increments typically within 8 s, a 25% improve-
ment over the LH28F008SA. A Block Erase operation
erases one of the 32 blocks in typically 0.7 seconds,
independent of the other blocks, which is about 55%
improvement over the LH28F008SA.
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