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Электронный компонент: LH5324C00

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LH5324C00
CMOS 24M (1.5M
16) MROM
FEATURES
1,572,864
16 bit organization
Access time: 120 ns (MAX.)
Supply current:
Operating: 80 mA (MAX.)
Standby: 100
A (MAX.)
TTL compatible I/O
Three-state output
Single +5 V Power supply
Static operation
When the address input at both A
19
and
A
20
is high level, outputs become high
impedance irrespective of CE or OE.
Package:
42-pin, 600-mil DIP
Others:
Non programmable
Not designed or rated as radiation
hardened
CMOS process (P type silicon
substrate)
DESCRIPTION
The LH5324C00 is a 24M-bit mask-programmable
ROM organized as 1,572,864
16 bits. It is fabricated
using silicon-gate CMOS process technology.
PIN CONNECTIONS
5324C00-1
TOP VIEW
2
3
4
5
8
9
A
2
A
5
39
38
37
36
35
34
31
28
A
7
A
6
6
7
A
3
A
4
33
32
A
10
A
11
A
13
A
15
GND
D
14
10
11
12
41
40
A
9
A
1
13
30
D
15
29
D
7
OE
A
0
CE
A
12
42-PIN DIP
14
15
16
17
18
19
20
21
25
22
27
26
24
23
D
13
D
5
D
12
D
4
D
2
D
10
D
9
GND
D
8
D
1
D
0
D
3
D
11
V
CC
A
8
A
14
A
16
D
6
42
1
A
17
A
18
A
19
A
20
Figure 1. Pin Connections
1
5324C00-2
A
3
A
2
A
1
A
12
A
11
A
10
A
9
A
8
A
7
A
6
V
CC
A
4
MEMORY
MATRIX
(1,572,864 x 16)
SENSE AMPLIFIER
GND
A
5
A
13
ADDRESS BUFFER
A
0
ADDRESS DECODER
COLUMN SELECTOR
CE
BUFFER
A
14
A
15
TIMING
GENERATOR
A
16
DATA SELECTOR/OUTPUT BUFFER
OE
BUFFER
OE
CE
A
17
A
19
A
18
A
20
37
38
39
40
4
7
8
9
3
6
41
5
36
10
35
34
33
2
42
1
32
11
13
22
31
12
D
3
D
2
D
1
D
7
D
6
D
4
D
5
D
0
25
18
16
14
20
29
23
27
D
11
D
10
D
9
D
15
D
14
D
12
D
13
D
8
26
19
17
15
21
30
24
28
Figure 2. LH5324C00 Block Diagram
PIN DESCRIPTION
SIGNAL
PIN NAME
A
0
- A
20
Address input
D
0
- D
15
Data output
CE
Chip enable input
SIGNAL
PIN NAME
OE
Output enable input
V
CC
Power supply (+5 V)
GND
Ground
LH5324C00
CMOS 24M (1.5M x 16) MROM
2
TRUTH TABLE
CE
OE
A
0
- A
18
A
19
A
20
DATA
OUTPUT
SUPPLY
CURRENT
D
0
- D
15
H
X
X
X
X
High-Z
Standby (I
SB
)
L
H
X
X
X
High-Z
Operating (I
CC
)
L
L
X
L
L
Output
Operating (I
CC
)
L
L
X
L
H
Output
Operating (I
CC
)
L
L
X
H
L
Output
Operating (I
CC
)
L
L
X
H
H
High-Z
Operating (I
CC
)
NOTES:
1.
X = Don't care; High-Z = High-impedance
2.
When the address inputs become HIGH to both A
19
and A
20
, the data does not exist in this address area,
the data outputs become "High Impedance".
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
UNIT
Supply voltage
V
CC
-0.3 to +7.0
V
Input voltage
V
IN
-0.3 to V
CC
+ 0.3
V
Output voltage
V
OUT
-0.3 to V
CC
+ 0.3
V
Operating temperature
T
OPR
0 to +70
C
Storage temperature
T
STG
-65 to +150
C
RECOMMENDED OPERATING CONDITIONS (T
A
= 0 to +70
C)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage
V
CC
4.5
5.0
5.5
V
DC ELECTRICAL CHARACTERISTICS (V
CC
= 5 V
10%, T
A
= 0 to +70
C)
PARAMETER
SYMBOL
CONDITIONS
MIN.
MAX.
UNIT
NOTE
Input `High' voltage
V
IH
2.2
V
CC
+ 0.3
V
Input `Low' voltage
V
IL
-0.3
0.8
V
Output `High' voltage
V
OH
I
OH
= -400
A
2.4
V
Output `Low' voltage
V
OL
I
OL
= 2.0 mA
0.4
V
Input leakage current
| I
LI
|
V
IN
= 0 V to V
CC
10
A
Output leakage current
| I
LO
|
V
OUT
= 0 V to V
CC
10
A
1
Operating current
I
CC1
t
RC
= 120 ns
80
mA
2
I
CC2
t
RC
= 1
s
70
Standby current
I
SB1
CE = V
IH
2
mA
I
SB2
CE = V
CC
- 0.2 V
100
A
Input capacitance
C
IN
f = 1 MHz, t
A
= 25
C
10
pF
Output capacitance
C
OUT
10
pF
NOTES:
1.
CE = V
IH
, OE = V
IH
2.
V
IN
= V
IH
or V
IL
, CE = V
IL
, output is open
CMOS 24M (1.5M x 16) MROM
LH5324C00
3
AC ELECTRICAL CHARACTERISTICS (V
CC
= +5 V
10%, T
A
= 0 to +70
C)
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
NOTE
Read cycle time
t
RC
120
ns
Address access time
t
AA
120
ns
Chip enable access time
t
ACE
120
ns
Output enable delay time
t
OE
60
ns
Output hold time
t
OH
0
ns
Output floating time
t
CHZ
50
ns
1
t
OHZ
50
ns
t
AHZ
60
ns
NOTE:
1.
Determined by the time for the output to be opened. (Irrespective of output voltage)
AC TEST CONDITIONS
PARAMETER
RATING
Input voltage amplitude
0.6 V to 2.4 V
Input signal rise time
10 ns
Input signal fall time
10 ns
Input reference level
1.5 V
Output reference level
1.5 V
Output load condition
1TTL + 100 pF
NOTE:
It is recommended that a decoupling capacitor be connected between V
CC
and GND-Pin.
LH5324C00
CMOS 24M (1.5M x 16) MROM
4
5324C00-3
t
OE
t
AA
D
0
- D
15
t
OHZ
t
CHZ
t
RC
t
ACE
CE
t
OH
DATA VALID
(NOTE)
OE
A
0
- A
20
(NOTE)
(NOTE)
NOTE: The output data becomes valid when the last
intervals, t
AA
, t
ACE
, or t
OE
, have concluded.
HI-Z = High Impedance.
HI-Z
HI-Z
Figure 3. Byte Mode
5324C00-4
D
0
- D
15
t
OHZ
t
CHZ
CE
DATA VALID
OE
A
0
- A
18
A
19
, A
20
t
AHZ
HI-Z
HI-Z
HI-Z = High impedance.
NOTE: The output data becomes valid when the last
intervals, t
AA
, t
ACE
, or t
OE
, have concluded.
Figure 4. Word Mode
CMOS 24M (1.5M x 16) MROM
LH5324C00
5
LH5324C00
Device Type
D
Package
5324C00-5
Example: LH5324C00D (CMOS (24M 1.5M x 16) Mask-Programmable ROM, 42-pin, 600-mil DIP)
CMOS 24M (1.5M x 16) Mask-Programmable ROM
42-pin, 600-mil DIP (DIP42-P-600)
ORDERING INFORMATION
13.45 [0.530]
12.95 [0.510]
0.90 [0.035] TYP.
5.40 [0.213]
4.80 [0.189]
3.55 [0.140]
2.95 [0.116]
2.54 [0.100]
TYP.
0.60 [0.024]
0.40 [0.016]
0.30 [0.012]
0.20 [0.008]
DETAIL
DIMENSIONS IN MM [INCHES]
54.10 [2.130]
53.50 [2.106]
0
TO 15
MAXIMUM LIMIT
MINIMUM LIMIT
4.55 [0.179]
3.95 [0.156]
15.24 [0.600]
TYP.
42DIP (DIP042-P-0600)
1
21
22
42
42DIP
PACKAGE DIAGRAM
LH5324C00
CMOS 24M (1.5M x 16) MROM
6