In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices
shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device spcification sheets before using any SHARP device.
s
Features
Operation by small magnet due to high sensitivity Operating
point
<
30mT
Combining a GaAs Hall device and an IC in a compact
package (2.9
X
1.5
X
1.1mm)
Wide operation temperature range obtained by GaAs Hall
device (-20 to +125C)
Long life time due to noncontact-type
s
Applications
FDD
HDD
Water meter
Car stereo
Microswitch, etc.
s
Outline Dimensions
(Unit : mm)
LT253A
LT253A
Hall IC
GaAs Hall IC for Noncontact Swich
(Unidirectional magnetic field-type)
As for dimensions of tape-packaged products, refer to page 44 .
s
Operating Explanation
*1 Soldering time : within 10 seconds
s
Absolute Maximum Ratings
(T
a
=25C)
Supply voltage
Output voltage
Output current
Power dissipation
Operating temperature
Storage temperature
Soldering temperature
*1
Symbol
V
CC
V
OUT
I
O
P
D
T
opr
T
stg
T
sol
Rating
18
18
5
100
-20 to +125
-55 to +150
260
Unit
V
V
mA
mW
C
C
C
Parameter
s
Electrical Characteristics
(T
a
=25C)
Low level output voltage
Operating magnetic flux density
Hysteresis breadth
Operating voltage
Supply current
Output leakage current
Operating point temperature drift
Symbol
B
OP
B
RP
B
H
V
CC
I
CC
V
OL
I
OH
B
OP
Conditions
V
CC
=16V
V
OO
=16V
R
L
=10k
V
CC
=16V, B==<10mT
I
O
=4mA, B>=30mT
V
CC
=16V, B=<10mT, V
OO
=16V
V
CC
=16V, T
a
=-5C to+60C
V
CC
=16V, T
a
=-20C to+80C
MIN.
-
10
-
4.5
-
-
-
-
-
TYP.
18
16
2
-
-
-
-
2.0
2.5
MAX.
30
-
5
16
10.5
0.4
10
4.5
8.0
Unit
mT
mT
mT
V
mA
V
A
mT
mT
Parameter
2.70.3
1.50.2
1
2
4
3
0.6
0.4
0.4
0.4
1.9
2.90.2
0.85
0.95
2.90.2
4-R0.2
S
Z
0.6
0.6
0.3
0.8
(0to0.15)
0.16
+0.10
-0.06
1.1
+0.2
-0.1
1 : V
CC
2 : V
OUT
3 : Don't use.
4 : GND
+
-
H
REG
Y
X
Hall device center line
X : +0.050.23mm against package center
Y : -0.050.1mm against package lead center between
No.2 and No.3 terminals
Z : 0.810.15mm from package surface
*No.3 terminal and the section of leads(both sides
of package in X directionj
are connected with the
terminal of internal IC. Be careful in connecting other circuits.
Terminal connections
Hall
device
B
RP
0
B
OP
+B
Magnetic flux density
<Unidirectional magnetic field-type>
Output voltage
Fig. 1 Operating Magnetic Flux Density
vs. Supply Voltage
Fig. 2 Operating Magnetic Flux Density
vs. Ambient Temperature
Fig. 6 Low Level Output Voltage vs.
Ambient Temperature
Fig. 5 Low Level Output Voltage vs.
Output Current
Fig. 3 Supply Current vs. Supply Voltage
Fig. 4 Supply Current vs. Ambient
Temperature
LT253A
Hall IC
T
a
=25C
B
OP
B
RP
0
0
16
8
12
4
20
20
16
8
4
24
12
Operating magnetic flux density B
(mT)
Supply voltage V
CC
(V)
V
CC
=16V
B
OP
B
RP
0
80
0
40
-40
120
20
16
8
4
24
12
Operating magnetic flux density B
(mT)
Ambient temperature T
a
(C)
V
CC
=16V
I
O
=4mA
B>=30mT
0
80
-40
0
40
120
0.5
0.4
0.3
0.2
0.1
Low level output voltage V
OL
(V)
Ambient temperature T
a
(C)
V
CC
=16V
B=<10mT
0
-40
120
0
40
80
10
8
6
4
2
Supply current I
CC
(mA)
Ambient temperature T
a
(C)
B=<10mT
T
a
=25C
0
0
16
4
8
12
20
10
8
6
4
2
Supply current I
CC
(mA)
Supply voltage V
CC
(V)
V
CC
=16V
B>=30mT
T
a
=25C
0
0
4
1
2
3
5
0.5
0.4
0.3
0.2
0.1
Low level output voltage V
OL
(V)
Output current I
O
(mA)
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