(Ta = 25C)
1
2
3
4
5
6
8
1
2
3
4
5
6
8
2.54
0.25
6.5
0.5
1.2
0.3
9.66
0.5
3.5
0.5
7.62
0.3
3.1
0.5
3.4
0.5
0.5
0.1
0.5
TYP.
0.26
0.1
8-pin DIP Type SSR
for Low Power Control
Outline Dimensions
(Unit : mm)
Absolute Maximum Ratings
5 G
6 T
1
8 T
2
1 Cathode
Cathode
Cathode
2 Anode
3
4
Internal connection diagram
Anode
mark
* (Note) Terminals
1
,
3
and
4
are common ones of cathode.
To radiate the heat, solder all of the lead pins on the pattern of PWB.
S13MD01
S13MD01
S13MD01
:
0
to
13
*1 50Hz sine wave
*2 40 to 60% RH, AC for 1 minute, f=60Hz
*3 For 10 seconds
Parameter
Symbol
Rating
Unit
Input
Forward current
I
F
50
mA
Reverse voltage
V
R
6
V
Output
RMS ON-state current
I
T
0.3
A
rms
Peak one cycle surge current
*1
I
surge
3
A
Repetitive peak OFF-state voltage
V
DRM
400
V
Isolation voltage
*2
V
iso
4 000
V
rms
Operating temperature
T
opr
- 25 to +80
C
Storage temperature
T
stg
- 40 to +125
C
Soldering temperature
*3
T
sol
260
C
5. Recognized by UL (No. E94758)
6. Approved by CAS (No. LR63705)
Features
Application
1. Oil fan heaters
2. Microwave ovens
3. Refrigerators
1. Compact 8-pin dual-in-line package
2. RMS ON-state current (I
T
: 0.3Arms)
3. Repetitive peak OFF-state voltage is high.
4. Isolation voltage between input and output (Viso : 4000Vrms)
s
s
s
s
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
"
"
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
(Ta=25C)
- 25
0
25
50
75
100
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
- 25
0
25
75
100
0
10
20
30
40
50
60
55
80
80
50
Electro-optical Characteristics
Fig. 1 RMS ON-state Current vs. Ambient
Temperature
Fig. 2 Forward Current vs. Ambient
Temperature
Ambient temperature Ta (C)
Forward current I
F
(mA)
Ambient temperature Ta (C)
S13MD01
60
RMS ON-state current I
T
(A
rms
)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Input
Forward voltage
V
F
I
F
= 20mA
-
1.2
1.4
V
Reverse current
I
R
V
R
= 3V
-
-
10
A
Output
Repetitive peak OFF-state current
I
DRM
V
DRM
= Rated
-
-
100
A
ON-state voltage
V
T
I
T
= 0.3A
-
-
3.0
V
Holding current
I
H
V
D
= 6V
-
-
25
mA
Critical rate of rise of OFF-state voltage
dv/dt
2 ) Rated
V
DRM
= (1/
100
-
-
V/
s
Transfer
characteristics
Minimum trigger current
I
FT
V
D
= 6V, R
L
= 100
-
-
10
mA
Insulation resistance
R
ISO
DC500V, 40 to 60% RH
5 x 10
10
1 x 10
11
-
Turn-on time
t
on
V
D
= 6V, R
L
= 100
I
F
= 20mA
-
-
100
s
s
- 30
Ambient Temperature Ta (C)
0
20
40
60
80
100
1.4
1.3
1.2
1.1
1.0
0.9
0.8
I
T
= 0.3A
- 30
Ambient temperature Ta (C)
0
20
40
60
80
100
V
D
= 6V
10
0.5
0.4
0.3
0.2
0.1
0
0
0.5
1.5
100
10
1
100
S13MD01
0
0.5
1.0
1.5
2.0
2.5
3.0
10
100
1
2
5
20
50
200
-
25C
50C
25C
0C
T
a
= -
25C
Fig. 3 Forward Current vs. Forward Voltage
Forward current I
F
(mA)
- 30
0
20
40
60
80
100
0
2
4
6
8
10
12
Ambient Temperature Ta (C)
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature (S13MD01)
Minimum trigger current I
FT
(mA)
ON-state voltage V
T
(V)
10
3
10
2
ON-state current I
T
(A)
1.0
ON-state voltage V
T
(V)
V
D
= 6V
R
L
= 100
Ta= 25C
10
20
30
40
50
Fig. 5 ON-State Voltage vs. Ambient
Temperature
(S13MD01)
Fig. 6 Relative Holding Current vs.
Ambient Temperature (S13MD01)
V
D
= 6V
R
L
= 100
Fig. 7 ON-State Current vs. ON-State Voltage
(S13MD01)
Fig. 8 Turn-on Time vs. Forward Current
(S13MD01)
I
F
= 20mA
Ta = 25C
Forward voltage V
F
(V)
Forward current I
F
(mA)
Relative holding current I
H
(tC)/I
H
(25C) x100%
Turn-on time t
on
(
s)
Z
S
SSR
2
3
D
1
R
1
+
V
CC
Tr1
Basic Operation Circuit
Load
(1) DC Drive
(2) Pulse Drive
(3) Phase Control
Input signal
Load current
(for resistance load)
Precautions for Use
Zs : Surge absorption circuit
S13MD01
(1) All pins must be soldered since they are also used as heat sinks (heat radiation fins).
In designing, consider the heat radiation from the mounted SSR.
(2) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin No. 8
when designing mounting pattern. The rounded part of Pin No. 5 (gate) must be as small as possible.
Pulling the gate pattern around increases the change of being affected by external noise.
AC supply voltage
AC 100V (S13MD01)
Notes (1) If large amount of surge is loaded onto Vcc or the driver circuit, add a diode D
1
between terminals 2 and 3 to prevent reverse
bias from being applied to the infrared LED.
(2) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load
(for CR, choose its constant). This must be carefully done especially for an inductive load.
(3) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 30mA.
V
1
As for other general cautions, refer to the chapter "Precautions for Use" (Page 78 to 93).
8
6
s
s
q
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