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Электронный компонент: S16MD02

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S16MD01/S16MD02/S26MD01/S26MD02
S16MD01/S16MD02
S26MD01/S26MD02
s
Features
s
Applications
s
Outline Dimensions
(Unit : mm )
s
Absolute Maximum Ratings
(Ta = 25 C)
1. Compact 8-pin dual-in-line package type
3. Built-in zero-cross circuit
5. Isolation voltage between input and output
( V
iso
: 4,000Vrms )
2. Microwave ovens
3. Refrigerators
Symbol
Rating
Unit
I
F
50
mA
V
R
6
V
I
T
0.6
I
surge
6
A
V
DRM
400
V
600
V
V
iso
T
opr
- 25 to + 80
C
T
stg
- 40 to + 125
C
T
sol
260
C
Terminal 1 , 3 and 4 are common ones of cathode.
To radiate the heat, solder all of the lead pins
on the pattern of PWB.
1. Oil fan heaters
S16MD01 / S16MD02
V
DRM
: MIN. 400V
S26MD01 / S26MD02
V
DRM
: MIN. 600V
For 100V lines
For 200V lines
S16MD01
S16MD02
S26MD02
2. RMS ON-state current I
T
: 0.6Arms
4. High repetitive peak OFF-state voltage
(S16MD02 / S26MD02 )
Parameter
Input
Output
Operating temperature
Storage temperature
No built-in zero-
cross circuit
Built-in zero-
Forward current
Reverse voltage
RMS ON-state current
Repetitive peak OFF-
state voltage
S16MD01 / S16MD02
S26MD01 / S26MD02
Internal connection Diagram
1
A
2
3
4
5
6
8
g
Zero-cross
circuit
1 Cathode
2 Anode
3 Cathode
4 Cathode
5 G
Anode
mark
A (Model No.)
S16MD01
S16MD02
S26MD01
S26MD02
1
2
3
4
5
6
8
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
"
"
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
S26MD01
cross circuit
8-Pin DIP Type SSR for Low
Power Control
*2
Isolation voltage
*3
Soldering temperature
Peak one cycle surge current
s
Model Line-ups
*1
*3 For 10 seconds
A
rms
V
rms
*1 50Hz sine wave
*2 AC for 1 minute, 40 to 60% RH, f = 60Hz
6. Recognized by UL, file No. E94758
7. Approved by CSA No. LR63705
4 000
g
Zero-cross circuit for S16MD02 and S26MD02
:
0 to 13
6 T
1
8 T
2
2.54
0.25
6.5
0.5
1.2
0.3
9.66
0.5
3.5
0.5
7.62
0.3
3.1
0.5
3.4
0.5
0.5
0.1
0.5
TYP.
0.26
0.1
S16MD01/S16MD02/S26MD01/S26MD02
s
Electrical Characteristics
(Ta = 25C )
Conditions
MIN.
TYP.
MAX.
Unit
I
F
= 20mA
-
1.2
1.4
V
V
R
= 3V
-
-
10
A
V
DRM
= Rated
-
-
100
A
I
T
= 0.6A
-
-
3.0
V
V
D
= 6V
-
-
25
mA
100
-
-
V/
s
I
F
= 15mA
-
-
35
V
V
D
= 6V, R
L
= 100
-
-
10
mA
5 x 10
10
10
11
-
V
D
= 6V, R
L
= 100
I
F
= 20mA
-
-
100
s
-
-
50
s
Parameter
Symbol
Input
Forward voltage
V
F
Reverse current
I
R
Output
Repetitive peak OFF-state current
I
DRM
ON-state voltage
V
T
Holding current
I
H
Critical rate of rise of OFF-state voltage
Zero-cross voltage
S16MD02
Vox
Transfer
charac-
teristics
Minimum trigger current
I
FT
Isolation resistance
R
ISO
Turn-on time
S16MD01
S26MD01
t
on
S16MD02
S26MD02
2
S26MD02
Ambient temperature T
a
(C)
- 25
0
25
50
75
100
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
40
Ambient temperature T
a
(C)
Forward current I
F
(
mA
)
- 25
0
25
75
100
0
10
20
30
40
50
60
55
80
Forward voltage V
F
(V)
Forward current I
F
(
mA
)
0
0.5
1.0
1.5
2.0
2.5
3.0
10
100
1
2
5
20
50
200
-
25C
50C
25C
0C
Ambient temperature T
a
(C)
Minimum trigger current I
FT
(
mA
)
- 30
0
20
40
60
80
100
0
2
4
6
8
10
12
S16MD02
S16MD01
Fig. 1 RMS ON-state Current vs.
Ambient Temperature
Fig. 2 Forward Current vs.
Ambient Temperature
Fig. 3 Forward Current vs.
Forward Voltage
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature
(S16MD01/S16MD02 )
80
V
DRM
= (1/ ) Rated
RMS ON-state current I
F
(
Arms
)
dV/dt
DC500V, 40 to 60 % RH
50
V
D
= 6V
R
L
= 100
T
a
=-
25C
Resistance load
S16MD01/S16MD02/S26MD01/S26MD02
Ambient temperature T
a
(C)
Minimum trigger current I
FT
(
mA
)
- 30
0
20
40
60
80
100
0
2
4
6
8
10
12
Ambient temperature T
a
(C)
- 30
0
20
40
60
80
100
0.8
0.9
1.0
1.1
1.2
1.3
1.4
Ambient temperature T
a
(C)
- 30
0
20
40
60
80
100
0
0.5
1.0
1.5
0
0.2
0.4
0.6
0.8
1.0
1.2
Forward current I
F
( mA )
10
20
30
40
50
10
20
30
40
50
100
100
Forward current I
F
( mA )
100
10
20
30
50
40
100
20
30
40
50
200
Fig. 5 Minimum Trigger Current vs.
Ambient Temperature
Fig. 6 ON-state Voltage vs.
Ambient Temperature
Fig. 7 Relative Holding Current vs.
Ambient Temperature
Fig. 8 ON-state Current vs.
ON-state Voltage
Fig. 9 Turn-on Time vs. Forward Current
Fig.10 Turn-on Time vs. Forward Current
ON-state voltage V
T
(V)
ON-state current I
T
(
mA
)
ON-state voltage V
T
(
V
)
(S26MD01 )
( S16MD01)
Turn-ON time t
on
(
s
)
Turn-ON time t
on
(
ms
)
( S26MD01/ S26MD02)
S26MD01
S26MD02
V
D
= 6V
R
L
= 100
I
T
= 0.6A
I
F
= 20mA
T
a
= 25C
V
D
= 6V
10
1
10
2
10
3
V
D
= 6V
R
L
= 100
T
a
= 25C
V
D
= 6V
R
L
= 100
T
a
= 25C
Relative holding current I
H
(
tC
)
/ I
H
(
25C
)
x
100%
S16MD01/S16MD02/S26MD01/S26MD02
Forward current I
F
( mA )
Turn-on time t
on
(
s
)
3
4
5
10
20
30
40
50
100
2
10
20
Ambient temperature T
a
(C)
Zero-cross voltage V
OX
(
V
)
- 30
0
20
40
60
80
100
15
20
25
Load
Z
S
SSR
2
3
8
6
D
1
R
1
+
V
CC
(1) DC Drive
(2) Pulse Drive
s
Basic Operation Circuit
Fig.11 Turn-on Time vs. Forward Current
Fig.12 Zero-cross Voltage vs.
Z
S
:
Surge absorption circuit
s
Precautions for Use
1) All pins must be soldered since they are also used as heat sinks ( heat radiation fins) . In
designing, consider the heat radiation from the mounted SSR.
2) For higher radiation efficiency that allows wider thermal margin, secure a wider round
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
(S16MD02/S26MD02)
(S16MD02/S26MD02)
AC 100V (S16MD01/S16MD02)
AC 200V (S26MD01/S26MD02)
Notes 1 ) If large amount of surge is loaded onto V
CC
or the driver circuit, add a diode D
1
between terminal 2
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
more than 30mA.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
V
I
Tr1
Load : R
AC supply voltage
Input signal
Load current
(for resistance load)
(3) Phase Control
and 3 to prevent reverse bias from being applied to the infrared LED.
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
Ambient Temperature
V
D
= 6V
R
L
= 100
T
a
= 25C
I
F
= 15mA
3) As for other general cautions, refer to the chapter"Precautions for Use"