S21ME8/S21ME8F
S21ME8/S21ME8F
s
Outline Dimensions
(Unit : mm)
S 2 1 M E 8
6.5
0.5
1.2
0.3
9.22
0.5
2.54
0.25
7.62
0.3
3.5
0.5
3.7
0.5
3.5
0.5
3.6
0.5
3.2
0.3
2.54
0.25
7.62
0.3
10.16
0.5
0.5
0.1
0.26
0.1
0.5
0.1
3.4
0.5
0.5
TYP.
0.26
0.1
Zero-cross circuit
Anode
Cathode
NC
Anode/Cathode
No external connection
Anode/Cathode
S21ME8
S21ME8F
Epoxy resin
Internal connection diagram
:0~13
1
2
3
4
5
6
4
5
6
1
2
3
s
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Input
Forward current
15
mA
*3
1.2
A
800
V
6
V
0.1
Output
-
30 to
+
100
C
Storage temperature
-
55 to
+
125
C
*4
260
5 000
C
Operating temperature
Reverse voltage
I
F
V
R
I
T
I
surge
V
DRM
A
rms
V
rms
T
stg
T
opr
(Ta
=
25C)
Soldering temperature
T
SOL
V
iso
*1
*1
*2
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Isolation voltage
*1 The derating factors of absolute maximum ratings due to ambient temperature are
shown in Fig.1 to 2.
*2 40 to 60%RH, AC for 1min, f
=
60Hz.
*3 50Hz, sine wave.
*4 For 10s.
1. For triggering medium/high power triac
s
Features
s
Applications
High Repetitive Peak OFF-State
Voltage Type
Phototriac Couplers
1. High repetitive peak OFF-state voltage (V
DRM :
MIN. 800V)
2. Low minimum trigger current (I
FT
: MAX. 3mA)
3. Internal insulation distance : 0.5mm or more
4. Long creepage distance type
(Creepage distance : 8mm or more)
5. Built-in zero-cross circuit
6. High isolation voltage between input and output
(V
iso :
5 000V
rms
)
7. Recoginized by UL file No. E64380
Approved by BSI, No. 6690, No. 7421
Approved by SEMKO, No. 9843099
Approved by DEMKO, No. 308207
gDIN-VDE 0884 approved type is also available as an option
(S21ME8Y/S21ME8FY)
Approved by VDE, No. 77294
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
S21ME8/S21ME8F
s
Electro-optical Characteristics
Parameter
Symbol
Unit
Input
Forward voltage
V
F
V
A
A
V/
s
I
R
V
mA
Reverse current
Output
V
s
I
F
=
6mA
V
R
=
3V
V
DRM
=
Rated
I
T
=
0.1A
V
DRM
=
1/ 2.Rated
I
F
=
6mA, Resistance load
V
D
=
6V
V
D
=
6V, R
L
=
100
V
D
=
6V, R
L
=
100
, I
F
=
6mA
DC
=
500V, 40 to 60%RH
MIN.
-
-
-
-
5
10
-10
10
-5
10
-6
3.0
3.5
-
MAX.
20
-
1.4
Conditions
TYP.
-
-
0.1
-
-
500
50
-
-
-
mA
-
3.0
-
1
10
-11
1.2
-
1.7
(Ta
=
25C)
I
DRM
Transfer
charac-
teristics
Isolation resistance
Turn-on time
Repetitive peak OFF-state current
V
T
I
H
dV/dt
V
ox
I
FT
t
on
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
R
iso
Zero-cross voltage
Minimum trigger current
F
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
(
m
A
)
0
5
10
15
20
25
30
35
-
30
-
20
-
10 0 10 20 30 40
80 90 100
50 60 70
Ambient temperature T
a
(
C)
0
25
50
75
100
125
150
175
-
30
-
20
-
10 0 10 20 30 40
80 90 100
50 60 70
Ambient temperature T
a
(
C)
R
M
S
O
N
-
s
t
a
t
e
c
u
r
r
e
n
t
I
T
(
m
A
r
m
s
)
F
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
(
m
A
)
1
100
10
0
0.2 0.4 0.6 0.8
2
1.8
1.6
1.4
1.2
1
Forward voltage V
F
(V)
T
a
=
75
C
50
C
-
25
C
25
C
0
C
0
1
2
3
4
5
-
30
-
10
10
30
90
50
70
Ambient temperature T
a
(
C)
M
i
n
i
m
u
m
t
r
i
g
g
e
r
c
u
r
r
e
n
t
I
F
T
(
m
A
)
V
D
=
6V
R
L
=
100
Fig.3 Forward Current vs. Forward Voltage
Fig.2 Forward Current vs. Ambient
Temperature
Fig.1 RMS ON-state Current vs. Ambient
Temperature
Fig.4 Minimum Trigger Current vs. Ambient
Temperature
S21ME8/S21ME8F
0.7
0.8
0.9
1.1
1.0
1.2
1.3
-
30
-
10
10
30
90
50
70
Ambient temperature T
a
(
C)
R
e
l
a
t
i
v
e
r
e
p
e
t
i
t
i
v
e
p
e
a
k
O
F
F
-
s
t
a
t
e
v
o
l
t
a
g
e
V
D
R
M
(
T
j
=
T
a
)
/
V
D
R
M
(
T
j
=
2
5
C
)
0.001
0.01
0.1
1
10
0
10
20
30
40
80
90 100
50
60
70
Ambient temperature T
a
(
C)
R
e
p
e
t
i
t
i
v
e
p
e
a
k
O
F
F
-
s
t
a
t
e
c
u
r
r
e
n
t
I
D
R
M
(
A
)
V
D
=
800V
1.0
1.2
1.6
1.4
1.8
2.0
2.2
-
30
-
10
10
30
90
50
70
Ambient temperature T
a
(
C)
O
N
-
s
t
a
t
e
v
o
l
t
a
g
e
V
T
(
V
)
I
T
=
100mA
0.1
1
10
-
30
-
10
10
30
90
50
70
Ambient temperature T
a
(
C)
H
o
l
d
i
n
g
c
u
r
r
e
n
t
I
H
(
m
A
)
V
D
=
6V
T
u
r
n
-
o
n
t
i
m
e
t
o
n
(
s
)
Forward current I
F
(mA)
10
100
1
10
100
V
D
=
6V
R
L
=
100
Ta
=
25
C
0
5
10
15
20
25
-
30
-
10
10
30
90
50
70
Ambient temperature T
a
(
C)
Z
e
r
o
-
c
r
o
s
s
v
o
l
t
a
g
e
V
o
x
(
V
)
Resistance load
I
F
=
6mA
Fig.9 Turn-on Time vs. Forward Current
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Fig.6 ON-state Voltage vs. Ambient
Temperature
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
Fig.7 Holding Current vs. Ambient
Temperature
Fig.10 Zero-cross Voltage vs. Ambient
Temperature
S21ME8/S21ME8F
T
a
=
25
C
Resistance
load
0
5
10
15
25
20
0
2
4
6
8
12
14
16
18
20
10
Forward current I
F
(mA)
Z
e
r
o
-
c
r
o
s
s
v
o
l
t
a
g
e
V
o
x
(
V
)
0
20
10
40
30
60
50
100
90
80
70
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
O
N
-
s
t
a
t
e
c
u
r
r
e
n
t
I
T
(
m
A
)
ON-state voltage V
T
(V)
I
F
=
6mA
T
a
=
25
C
25
C
2min
230
C
200
C
180
C
1min
30s
1min
10s
Only one time soldering is recommended within the temperature
profile shown below.
Fig.13 Reflow Soldering
Fig.11 Zero-cross Voltage vs. Forward
Current
Fig.12 ON-state Current vs. ON-state
Voltage
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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