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Электронный компонент: D10XB60

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D10XB60
600V 10A
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
O U T L I N E D I M E N S I O N S
Unit : mm
RATINGS
Case : 3S
SHINDENGEN
Thin Single In-Line Package
High current capacity with Small Package
High IFSM
Superior Thermal Conductivity
FEATURES
Switching power supply
Home Appliances, Office Equipment
Factory Automation, Inverter
APPLICATION
General Purpose Rectifiers
SIL Bridges
Absolute Maximum Ratings (If not specified Tc=25)
Item
Symbol
Conditions
Ratings
Unit
Storage Temperature
Tstg
-40150
Operating Junction Temperature
Tj
150
Maximum Reverse Voltage
V
RM
600
V
Average Rectified Forward Current
I
O
50Hz sine wave, R-load With heatsink Tc=100
10
A
50Hz sine wave, R-load Without heatsink Ta=25
2.7
Peak Surge Forward Current
I
FSM
50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25
120
A
Current Squared Time
I
2
t
1mst10msTj=25
60
A
2
s
Dielectric Strength
Vdis
Terminals to case, AC 1 minute
2.5
kV
Mounting Torque
TOR
Recommended torque
0.5Nm
0.8
Nm
Electrical Characteristics (If not specified Tc=25)
Item
Symbol
Conditions
Ratings
Unit
Forward Voltage
V
F
I
F
=5A, Pulse measurement, Rating of per diode
Max.1.1
V
Reverse Current
I
R
V
R
=V
RM
,
Pulse measurement, Rating of per diode
Max.10
A
jc
junction to case With heatsink
Max.2.3
Thermal Resistance
jl
junction to lead Without heatsink
Max.6
/W
ja
junction to ambient Without heatsink
Max.26
Forward Voltage
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
0.1
1
10
D10XBx
Pulse measurement per diode
Tc=150
C [TYP]
Tc=25
C [TYP]
Forward Voltage V
F
[V]
Forward Current I
F
[A]
0
5
10
15
20
25
30
35
40
0
5
10
15
D10XBx
Forward Power Dissipation
SIN
Average Rectified Forward Current I
O
[A]
Forward Power Dissipation P
F
[W]
Tj = 150
C
Sine wave
80
90
100
110
120
130
140
150
160
0
2
4
6
8
10
12
14
D10XBx
Derating Curve
SIN
Tc
Tc
Heatsink
Sine wave
R-load
with heatsink
Case Temperature Tc [
C]
Average Rectified Forward Current I
O
[A]
0
20
40
60
80
100
120
140
160
0
0.4
0.8
1.2
1.6
2
2.4
2.8
3.2
D10XBx
Derating Curve
SIN
PCB
Sine wave
R-load
Free in air
Ambient Temperature Ta [
C]
Average Rectified Forward Current I
O
[A]
Glass-epoxy substrate
Soldering land 5mm