Semiconductor Group
1
Aug-01-1996
BSM 100 GB 170 DN2
IGBT Power Module
Preliminary data
Half-bridge
Including fast free-wheeling diodes
Package with insulated metal base plate
R
G on,min
= 15 Ohm
Type
V
CE
I
C
Package
Ordering Code
BSM 100 GB 170 DN2
1700V 145A
HALF-BRIDGE 2
C67070-A2703-A67
Maximum Ratings
Parameter
Symbol
Values
Unit
Collector-emitter voltage
V
CE
1700
V
Collector-gate voltage
R
GE
= 20 k
V
CGR
1700
Gate-emitter voltage
V
GE
20
DC collector current
T
C
= 25 C
T
C
= 80 C
I
C
100
145
A
Pulsed collector current,
t
p
= 1 ms
T
C
= 25 C
T
C
= 80 C
I
Cpuls
200
290
Power dissipation per IGBT
T
C
= 25 C
P
tot
1000
W
Chip temperature
T
j
+ 150
C
Storage temperature
T
stg
-55 ... + 150
Thermal resistance, chip case
R
thJC
0.13
K/W
Diode thermal resistance, chip case
R
thJCD
0.4
Insulation test voltage,
t
= 1min.
V
is
4000
Vac
Creepage distance
-
20
mm
Clearance
-
11
DIN humidity category, DIN 40 040
-
F
-
IEC climatic category, DIN IEC 68-1
-
55 / 150 / 56
Semiconductor Group
2
Aug-01-1996
BSM 100 GB 170 DN2
Electrical Characteristics, at T
j
= 25 C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Gate threshold voltage
V
GE
=
V
CE,
I
C
= 8 mA
V
GE(th)
4.8
5.5
6.2
V
Collector-emitter saturation voltage
V
GE
= 15 V,
I
C
= 100 A,
T
j
= 25 C
V
GE
= 15 V,
I
C
= 100 A,
T
j
= 125 C
V
CE(sat)
-
-
4.5
3.4
5.3
3.9
Zero gate voltage collector current
V
CE
= 1700 V,
V
GE
= 0 V,
T
j
= 25 C
V
CE
= 1700 V,
V
GE
= 0 V,
T
j
= 125 C
I
CES
-
-
3.2
0.8
-
1
mA
Gate-emitter leakage current
V
GE
= 20 V,
V
CE
= 0 V
I
GES
-
-
320
nA
AC Characteristics
Transconductance
V
CE
= 20 V,
I
C
= 100 A
g
fs
36
-
-
S
Input capacitance
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
C
iss
-
16
-
nF
Output capacitance
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
C
oss
-
1.3
-
Reverse transfer capacitance
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
C
rss
-
0.5
-
Semiconductor Group
3
Aug-01-1996
BSM 100 GB 170 DN2
Electrical Characteristics, at T
j
= 25 C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Switching Characteristics, Inductive Load at
T
j
= 125 C
Turn-on delay time
V
CC
= 1200 V,
V
GE
= 15 V,
I
C
= 100 A
R
Gon
= 15
t
d(on)
-
450
900
ns
Rise time
V
CC
= 1200 V,
V
GE
= 15 V,
I
C
= 100 A
R
Gon
= 15
t
r
-
200
400
Turn-off delay time
V
CC
= 1200 V,
V
GE
= -15 V,
I
C
= 100 A
R
Goff
= 15
t
d(off)
-
850
1200
Fall time
V
CC
= 1200 V,
V
GE
= -15 V,
I
C
= 100 A
R
Goff
= 15
t
f
-
110
160
Free-Wheel Diode
Diode forward voltage
I
F
= 100 A,
V
GE
= 0 V,
T
j
= 25 C
I
F
= 100 A,
V
GE
= 0 V,
T
j
= 125 C
V
F
-
-
2.1
2.3
-
2.8
V
Reverse recovery time
I
F
= 100 A,
V
R
= -1200 V,
V
GE
= 0 V
d
i
F
/
dt
= -1000 A/s,
T
j
= 125 C
t
rr
-
0.5
-
s
Reverse recovery charge
I
F
= 100 A,
V
R
= -1200 V,
V
GE
= 0 V
d
i
F
/
dt
= -1000 A/s
T
j
= 25 C
T
j
= 125 C
Q
rr
-
-
25
8
-
-
C
Semiconductor Group
4
Aug-01-1996
BSM 100 GB 170 DN2
Power dissipation
P
tot
=
(T
C
)
parameter: T
j
150 C
0
20
40
60
80
100
120
C
160
T
C
0
100
200
300
400
500
600
700
800
900
W
1100
P
tot
Safe operating area
I
C
=
(V
CE
)
parameter: D = 0, T
C
= 25C , T
j
150 C
-1
10
0
10
1
10
2
10
3
10
A
I
C
10
0
10
1
10
2
10
3
V
V
CE
DC
10 ms
1 ms
100 s
10 s
t
p
= 1.8s
Collector current
I
C
=
(T
C
)
parameter: V
GE
15 V , T
j
150 C
0
20
40
60
80
100
120
C
160
T
C
0
20
40
60
80
100
120
140
A
170
I
C
Transient thermal impedance IGBT
Z
th JC
=
(t
p
)
parameter: D = t
p
/ T
-3
10
-2
10
-1
10
0
10
K/W
Z
thJC
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
s
t
p
single pulse
0.01
0.02
0.05
0.10
0.20
D = 0.50
Semiconductor Group
5
Aug-01-1996
BSM 100 GB 170 DN2
Typ. output characteristics
I
C
= f (V
CE
)
parameter:
t
p
= 80 s,
T
j
= 25 C
0.0
1.0
2.0
3.0
4.0
V
6.0
V
CE
0
20
40
60
80
100
120
140
160
A
200
I
C
17V
15V
13V
11V
9V
7V
Typ. output characteristics
I
C
= f (V
CE
)
parameter:
t
p
= 80 s,
T
j
= 125 C
0.0
1.0
2.0
3.0
4.0
V
6.0
V
CE
0
20
40
60
80
100
120
140
160
A
200
I
C
17V
15V
13V
11V
9V
7V
Typ. transfer characteristics
I
C
= f (V
GE
)
parameter:
t
p
= 80 s,
V
CE
= 20 V
0
2
4
6
8
10
V
14
V
GE
0
50
100
150
200
250
300
A
400
I
C
Semiconductor Group
6
Aug-01-1996
BSM 100 GB 170 DN2
Typ. gate charge
V
GE
=
(Q
Gate
)
parameter: I
C puls
= 100 A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4 C 1.7
Q
Gate
0
2
4
6
8
10
12
14
16
V
20
V
GE
1200 V
800 V
Typ. capacitances
C
=
f
(
V
CE
)
parameter: V
GE
= 0, f = 1 MHz
0
5
10
15
20
25
30
V
40
V
CE
-1
10
0
10
1
10
2
10
nF
C
Ciss
Coss
Crss
Reverse biased safe operating area
I
Cpuls
= f(V
CE
)
,
T
j
= 150C
parameter: V
GE
= 15 V
0
250
500
750
1000 1250 1500
V
2000
V
CE
0.0
0.5
1.0
1.5
2.5
I
Cpuls
/I
C
Short circuit safe operating area
I
Csc
= f(V
CE
) , T
j
= 150C
parameter: V
GE
= 15 V, t
SC
10 s, L < 25 nH
0
250
500
750
1000 1250 1500
V
2000
V
CE
0
2
4
6
8
12
I
Csc
/I
C
Semiconductor Group
7
Aug-01-1996
BSM 100 GB 170 DN2
Typ. switching time
I = f (I
C
) , inductive load , T
j
= 125C
par.:
V
CE
= 1200 V,
V
GE
= 15 V,
R
G
= 15
0
50
100
150
A
250
I
C
1
10
2
10
3
10
4
10
ns
t
tdoff
tr
tf
tdon
Typ. switching time
t = f (R
G
) , inductive load ,
T
j
= 125C
par.:
V
CE
= 1200 V,
V
GE
= 15 V,
I
C
= 100 A
0
20
40
60
80
120
R
G
1
10
2
10
3
10
4
10
ns
t
tdoff
tr
tdon
tf
Typ. switching losses
E = f (I
C
) ,
inductive load ,
T
j
= 125C
par.:
V
CE
= 1200 V,
V
GE
= 15 V,
R
G
= 15
0
50
100
150
A
250
I
C
0
20
40
60
80
100
120
140
160
mWs
200
E
Eon
Eoff
Typ. switching losses
E = f (R
G
) , inductive load , T
j
= 125C
par.:
V
CE
= 1200 V,
V
GE
= 15 V,
I
C
= 100 A
0
20
40
60
80
120
R
G
0
20
40
60
80
100
120
140
160
mWs
200
E
Eon
Eoff
Semiconductor Group
8
Aug-01-1996
BSM 100 GB 170 DN2
Forward characteristics of fast recovery
reverse diode
I
F
= f(V
F
)
parameter:
T
j
0.0
0.5
1.0
1.5
2.0
2.5
V
3.5
V
F
0
20
40
60
80
100
120
140
160
A
200
I
F
T
j
=25C
=125C
j
T
Transient thermal impedance Diode
Z
th JC
=
(
t
p
)
parameter:
D = t
p
/
T
-4
10
-3
10
-2
10
-1
10
0
10
K/W
Z
thJC
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
s
t
p
single pulse
0.01
0.02
0.05
0.10
0.20
D = 0.50
Semiconductor Group
9
Aug-01-1996
BSM 100 GB 170 DN2
Circuit Diagram
Package Outlines
Dimensions in mm
Weight: 420 g
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