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Электронный компонент: C161RI

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Preliminary 05.98 Preliminary
Microcomputer Components
16-Bit CMOS Single-Chip Microcontroller
C161RI
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C161RI
Revision History:
1998-05-01 Preliminary
Previous Releases:
1998-01 Advance Information
1997-12 Advance Information
Page
Subjects
7
XTAL pin numbers (MQFP) corrected.
34
V
DDMIN
corrected, special threshold parameters added (
V
ILS
,
V
IHS
, HYS).
35, 37
Specification of
I
IDO
improved.
41
ADCTC value in converter timing example timing corrected.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
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Edition 1998-05-01
Published by Siemens AG,
Bereich Halbleiter, Marketing-
Kommunikation, Balanstrae 73,
81541 Mnchen
Siemens AG 1998.
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes
and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies
and Representatives worldwide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact
your nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will
take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs in-
curred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components
1
of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems
2
with the express
written approval of the Semiconductor Group of Siemens AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the
failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain hu-
man life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Semiconductor Group
3
1998-05-01
q
High Performance 16-bit CPU with 4-Stage Pipeline
q
125 ns Instruction Cycle Time at 16 MHz CPU Clock
q
625 ns Multiplication (16
16 bits), 1.25
s Division (32 / 16 bit)
q
Enhanced Boolean Bit Manipulation Facilities
q
Additional Instructions to Support HLL and Operating Systems
q
Register-Based Design with Multiple Variable Register Banks
q
Single-Cycle Context Switching Support
q
Clock Generation via Prescaler or via Direct Clock Input
q
Up to 8 MBytes Linear Address Space for Code and Data
q
1 KByte On-Chip Internal RAM (IRAM)
q
2 KBytes On-Chip Extension RAM (XRAM)
q
Programmable External Bus Characteristics for Different Address Ranges
q
8-Bit or 16-Bit External Data Bus
q
Multiplexed or Demultiplexed External Address/Data Bus
q
5 Programmable Chip-Select Signals
q
1024 Bytes On-Chip Special Function Register Area
q
8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event
Controller (PEC)
q
16-Priority-Level Interrupt System, 11 External Interrupts
q
4-Channel 8-bit A/D Converter, conversion time down to 7.625
s
q
2 Multi-Functional General Purpose Timer Units with five 16-bit Timers
q
Synchronous/Asynchronous Serial Channel (USART)
q
High-Speed Synchronous Serial Channel
q
I
2
C Bus Interface (10-bit Addressing, 400 KHz) with 2 Channels (multiplexed)
q
Up to 76 General Purpose I/O Lines
q
Programmable Watchdog Timer
q
On-Chip Real Time Clock
q
Idle and Power Down Modes with Flexible Power Management
q
Ambient temperature range 40 to 85
C
q
Supported by a Large Range of Development Tools like C-Compilers, Macro-Assembler
Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer
Disassemblers, Programming Boards
q
On-Chip Bootstraploader
q
100-Pin MQFP / TQFP Package
This document describes the SAB-C161RI-LM, the SAB-C161RI-LF, the SAF-C161RI-LM and the
SAB-C161RI-LF.
For simplicity all versions are referred to by the term C161RI throughout this document.
C166-Family of
High-Performance CMOS 16-Bit Microcontrollers
Preliminary
C161RI 16-Bit Microcontroller
C161RI
Semiconductor Group
4
1998-05-01
C161RI
Introduction
The C161RI is a new derivative of the Siemens C166 Family of 16-bit single-chip CMOS
microcontrollers. It combines high CPU performance (up to 8 million instructions per second) with
high peripheral functionality and enhanced IO-capabilities. The C161RI derivative is especially
suited for cost sensitive applications.
Figure 1
Logic Symbol
Ordering Information
The ordering code for Siemens microcontrollers provides an exact reference to the required
product. This ordering code identifies:
q
the derivative itself, i.e. its function set
q
the specified temperature range
q
the package
q
the type of delivery.
For the available ordering codes for the C161RI please refer to the
"Product Information Microcontrollers", which summarizes all available microcontroller variants.
Note: The ordering codes for the Mask-ROM versions are defined for each product after
verification of the respective ROM code.
C161RI
XTAL2
XTAL1
RSTIN
NMI
EA
RSTOUT
ALE
RD
WR/WRL
V
DD
V
SS
PORT0
16 bit
PORT1
16 bit
Port 2
8 bit
Port 3
15 bit
Port 4
7 bit
Port 6
8 bit
Port 5
6 bit
V
AREF
V
AGND
Semiconductor Group
5
1998-05-01
C161RI
Pin Configuration MQFP Package
(top view)
Figure 2
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
10
0
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
C161RI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NMI
RSTOUT
RSTIN
V
DD
V
SS
P1H.7/A15
P1H.6/A14
P1H.5/A13
P1H.4/A12
P1H.3/A11
P1H.2/A10
P1H.1/A9
P1H.0/A8
V
DD
V
SS
P1L.7/A7
P1L.6/A6
P1L.5/A5
P1L.4/A4
P1L.3/A3
P1L.2/A2
P1L.1/A1
P1L.0/A0
P0H.7/AD15
P0H.6/AD14
P0H.5/AD13
P0H.4/AD12
P0H.3/AD11
P0H.2/AD10
P0H.1/AD9
P5.2/AN2
P5.3/AN3
P5.14/T4EUD
P5.15/T2EUD
V
SS
XTAL1
XTAL2
V
DD
P3.0/SCL0
P3.1/SDA0
P3.2/CAPIN
P3.3/T3OUT
P3.4/T3EUD
P3.5/T4IN
P3.6/T3IN
P3.7/T2IN
P3.8/MRST
P3.9/MTSR
P3.10/TxD0
P3.11/RxD0
P3.12/BHE/WRH
P3.13/SCLK
P3.15/CLKOUT
V
SS
V
DD
P4.0/A16
P4.1/A17
P4.2/A18
P4.3/A19
P4.4/A20
P
5
.1
/A
N
1
P
5
.0
/A
N
0
V
AG
ND
V
ARE
F
P2.
15/
EX7I
N
P2.
14/
EX6I
N
P2.
13/
EX5I
N
P2.
12/
EX4I
N
P2.
11/
EX3I
N
P2.
10/
EX2I
N
P2.
9
/
EX1I
N
P2.
8
/
EX0I
N
P
6
.7
/S
D
A
2
P
6
.6
/S
C
L
1
P
6
.5
/S
D
A
1
P
6
.4
/C
S
4
P
6
.3
/C
S
3
P
6
.2
/C
S
2
P
6
.1
/C
S
1
P
6
.0
/C
S
0
P4.
5
/A
21
P4.
6
/A
22
RD
WR
/W
R
L
RE
ADY
ALE
EA
V
SS
V
DD
P0
L.
0/
AD
0
P0
L.
1/
AD
1
P0
L.
2/
AD
2
P0
L.
3/
AD
3
P0
L.
4/
AD
4
P0
L.
5/
AD
5
P0
L.
6/
AD
6
P0
L.
7/
AD
7
V
SS
V
DD
P0H
.
0/
AD
8
Semiconductor Group
6
1998-05-01
C161RI
Pin Configuration TQFP Package
(top view)
Figure 3
P5.
3
/A
N3
P5.
2
/A
N2
P5.
1
/A
N1
P5.
0
/A
N0
V
AG
ND
V
AR
EF
P2.
15/
E
X
7I
N
P2.
14/
E
X
6I
N
P2.
13/
E
X
5I
N
P2.
12/
E
X
4I
N
P2.
11/
E
X
3I
N
P2.
10/
E
X
2I
N
P2.
9
/E
X1I
N
P2.
8
/E
X0I
N
P6.
7
/S
DA2
P6.
6
/S
CL1
P6.
5
/S
DA1
P6.
4
/C
S4
P6.
3
/C
S3
P6.
2
/C
S2
P6.
1
/C
S1
P6.
0
/C
S0
NM
I
RST
O
U
T
RST
I
N
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
C161RI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
V
DD
V
SS
P1H.7/A15
P1H.6/A14
P1H.5/A13
P1H.4/A12
P1H.3/A11
P1H.2/A10
P1H.1/A9
P1H.0/A8
V
DD
V
SS
P1L.7/A7
P1L.6/A6
P1L.5/A5
P1L.4/A4
P1L.3/A3
P1L.2/A2
P1L.1/A1
P1L.0/A0
P0H.7/AD15
P0H.6/AD14
P0H.5/AD13
P0H.4/AD12
P0H.3/AD11
P5.14/T4EUD
P5.15/T2EUD
V
SS
XTAL1
XTAL2
V
DD
P3.0/SCL0
P3.1/SDA0
P3.2/CAPIN
P3.3/T3OUT
P3.4/T3EUD
P3.5/T4IN
P3.6/T3IN
P3.7/T2IN
P3.8/MRST
P3.9/MTSR
P3.10/TxD0
P3.11/RxD0
P3.12/BHE/WRH
P3.13/SCLK
P3.15/CLKOUT
V
SS
V
DD
P4.0/A16
P4.1/A17
P4
.2/
A
18
P4
.3/
A
19
P4
.4/
A
20
P4
.5/
A
21
P4
.6/
A
22
RD
WR
/W
R
L
RE
AD
Y
ALE
EA
V
SS
V
DD
P0L.
0/
A
D
0
P0L.
1/
A
D
1
P0L.
2/
A
D
2
P0L.
3/
A
D
3
P0L.
4/
A
D
4
P0L.
5/
A
D
5
P0L.
6/
A
D
6
P0L.
7/
A
D
7
V
SS
V
DD
P0
H
.
0
/
AD
8
P0
H
.
1
/
AD
9
P0
H
.
2
/
AD
1
0
Semiconductor Group
7
1998-05-01
C161RI
Pin Definitions and Functions
Symbol
Pin No.
TQFP
Pin No.
MQFP
Input
Outp
Function
P5.0
P5.3,
P5.14
P5.15
97
100,
1
2
99
2,
3
4
I
I
I
I
Port 5 is a 6-bit input-only port with Schmitt-Trigger
characteristics. The pins of Port 5 also serve as the (up to 4)
analog input channels for the A/D converter, where P5.x
equals ANx (Analog input channel x, x=0...3).
The following pins of Port 5 also serve as timer inputs:
P5.14
T4EUD
GPT1 Timer T4 Ext.Up/Down Ctrl.Input
P5.15
T2EUD
GPT1 Timer T5 Ext.Up/Down Ctrl.Input
XTAL1
XTAL2
4
5
6
7
I
O
XTAL1:
Input to the oscillator amplifier and input to the
internal clock generator
XTAL2:
Output of the oscillator amplifier circuit.
To clock the device from an external source, drive XTAL1,
while leaving XTAL2 unconnected. Minimum and maximum
high/low and rise/fall times specified in the AC
Characteristics must be observed.
P3.0
P3.13,
P3.15
7
20,
21
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
9
22,
23
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
I/O
I/O
I/O
I/O
I/O
I
O
I
I
I
I
I/O
I/O
O
I/O
O
O
I/O
O
Port 3 is a 15-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-
impedance state.
The following Port 3 pins also serve for alternate functions:
P3.0
SCL0
I
2
C Bus Clock Line 0
P3.1
SDA0
I
2
C Bus Data Line 0
P3.2
CAPIN
GPT2 Register CAPREL Capture Input
P3.3
T3OUT
GPT1 Timer T3 Toggle Latch Output
P3.4
T3EUD
GPT1 Timer T3 Ext.Up/Dwn Ctrl.Input
P3.5
T4IN
GPT1 Timer T4 Input for
Count/Gate/Reload/Capture
P3.6
T3IN
GPT1 Timer T3 Count/Gate Input
P3.7
T2IN
GPT1 Timer T2 Input for
Count/Gate/Reload/Capture
P3.8
MRST
SSC Master-Rec./Slave-Transmit I/O
P3.9
MTSR
SSC Master-Transmit/Slave-Rec. O/I
P3.10
T
D0
ASC0 Clock/Data Output (Asyn./Syn.)
P3.11
R
D0
ASC0 Data Input (Asyn.) or I/O (Syn.)
P3.12
BHE
Ext. Memory High Byte Enable Signal,
WRH
Ext. Memory High Byte Write Strobe
P3.13
SCLK
SSC Master Clock Outp./Slave Cl. Inp.
P3.15
CLKOUT
System Clock Output (=CPU Clock)
Note:
Pins P3.0 and P3.1 are open drain outputs only.
Semiconductor Group
8
1998-05-01
C161RI
P4.0
P4.6
24
30
24
...
30
26 -
32
26
...
32
I/O
I/O
O
...
O
Port 4 is a 7-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-
impedance state.
In case of an external bus configuration, Port 4 can be used
to output the segment address lines:
P4.0
A16
Least Significant Segment Addr. Line
...
...
...
P4.6
A22
Most Significant Segment Addr. Line
RD
31
33
O
External Memory Read Strobe. RD is activated for every
external instruction or data read access.
WR/WRL 32
34
O
External Memory Write Strobe. In WR-mode this pin is
activated for every external data write access. In WRL-mode
this pin is activated for low byte data write accesses on a 16-
bit bus, and for every data write access on an 8-bit bus. See
WRCFG in register SYSCON for mode selection.
READY
33
35
I
Ready Input. When the Ready function is enabled, a high
level at this pin during an external memory access will force
the insertion of memory cycle time waitstates until the pin
returns to a low level.
ALE
34
36
O
Address Latch Enable Output. Can be used for latching the
address into external memory or an address latch in the
multiplexed bus modes.
EA
35
37
I
External Access Enable pin. A low level at this pin during and
after Reset forces the C161RI to begin instruction execution
out of external memory. A high level forces execution out of
the internal ROM. The C161RI must have this pin tied to `0'.
Note: This pin is expected to be used to accept the
programming voltage for OTP versions of the C161RI.
Pin Definitions and Functions (cont'd)
Symbol
Pin No.
TQFP
Pin No.
MQFP
Input
Outp
Function
Semiconductor Group
9
1998-05-01
C161RI
PORT0:
P0L.0
P0L.7,
P0H.0 -
P0H.7
38
45,
48
55
40
47,
50
57
I/O
PORT0 consists of the two 8-bit bidirectional I/O ports P0L
and P0H. It is bit-wise programmable for input or output via
direction bits. For a pin configured as input, the output driver
is put into high-impedance state.
In case of external bus configurations, PORT0 serves as the
address (A) and address/data (AD) bus in multiplexed bus
modes and as the data (D) bus in demultiplexed bus modes.
Demultiplexed bus modes:
Data Path Width:
8-bit
16-bit
P0L.0 P0L.7:
D0 D7
D0 - D7
P0H.0 P0H.7:
I/O
D8 - D15
Multiplexed bus modes:
Data Path Width:
8-bit
16-bit
P0L.0 P0L.7:
AD0 AD7
AD0 - AD7
P0H.0 P0H.7:
A8 - A15
AD8 - AD15
PORT1:
P1L.0
P1L.7,
P1H.0 -
P1H.7
56
63,
66
73
58 -
65,
68 -
75
I/O
PORT1 consists of the two 8-bit bidirectional I/O ports P1L
and P1H. It is bit-wise programmable for input or output via
direction bits. For a pin configured as input, the output driver
is put into high-impedance state. PORT1 is used as the 16-
bit address bus (A) in demultiplexed bus modes and also
after switching from a demultiplexed bus mode to a
multiplexed bus mode.
RSTIN
76
78
I
Reset Input with Schmitt-Trigger characteristics. A low level
at this pin for a specified duration while the oscillator is
running resets the C161RI. An internal pullup resistor permits
power-on reset using only a capacitor connected to
V
SS
.
In bidirectional reset mode (enabled by setting bit BDRSTEN
in register SYSCON) the RSTIN line is internally pulled low
for the duration of the internal reset sequence upon a
software reset, a WDT reset and a hardware reset.
1)
RSTOUT 77
79
O
Internal Reset Indication Output. This pin is set to a low level
when the part is executing either a hardware-, a software- or
a watchdog timer reset. RSTOUT remains low until the EINIT
(end of initialization) instruction is executed.
NMI
78
80
I
Non-Maskable Interrupt Input. A high to low transition at this
pin causes the CPU to vector to the NMI trap routine. When
the PWRDN (power down) instruction is executed, the NMI
pin must be low in order to force the C161RI to go into power
down mode. If NMI is high, when PWRDN is executed, the
part will continue to run in normal mode.
If not used, pin NMI should be pulled high externally.
Pin Definitions and Functions (cont'd)
Symbol
Pin No.
TQFP
Pin No.
MQFP
Input
Outp
Function
Semiconductor Group
10
1998-05-01
C161RI
1)
The following behavior differences must be observed when the bidirectional reset is active:
q
Bit BDRSTEN in register SYSCON cannot be changed after EINIT.
q
After a reset bit BDRSTEN is cleared.
q
The reset indication flags always indicate a long hardware reset.
q
The PORT0 configuration is treated like on a hardware reset. Especially the bootstrap loader
may be activated when P0L.4 is low.
q
Pin RSTIN may only be connected to external reset devices with an open drain output driver.
q
A short hardware reset is extended to the duration of the internal reset sequence.
P6.0
P6.7
79
86
79
...
83
84
85
86
81
88
81
...
85
86
87
88
I/O
I/O
O
...
O
I/O
I/O
I/O
Port 6 is an 8-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-
impedance state.
The Port 6 pins also serve for alternate functions:
P6.0
CS0
Chip Select 0 Output
...
...
...
P6.4
CS4
Chip Select 4 Output
P6.5
SDA1
I
2
C Bus Data Line 1
P6.6
SCL1
I
2
C Bus Clock Line 1
P6.7
SDA2
I
2
C Bus Data Line 2
Note:
Pins P6.5-P6.7 are open drain outputs only.
P2.8
P2.15
87
94
87
...
94
89
96
89
...
96
I/O
I/O
I
...
I
Port 2 is an 8-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-
impedance state.
The following Port 2 pins also serve for alternate functions:
P2.8
EX0IN
Fast External Interrupt 0 Input
...
...
...
P2.15
EX7IN
Fast External Interrupt 7 Input
V
AREF
95
97
-
Reference voltage for the A/D converter.
V
AGND
96
98
-
Reference ground for the A/D converter.
V
DD
6, 23,
37, 47,
65, 75
8, 25,
39, 49,
67, 77
-
Digital Supply Voltage:
+ 5 V during normal operation and idle mode.
2.5 V during power down mode
V
SS
3, 22,
36, 46,
64, 74
5, 24,
38, 48,
66, 76
-
Digital Ground.
Pin Definitions and Functions (cont'd)
Symbol
Pin No.
TQFP
Pin No.
MQFP
Input
Outp
Function
Semiconductor Group
11
1998-05-01
C161RI
Functional Description
The C161RI is a low cost downgrade of the high performance microcontroller C167CR with OTP or
internal ROM, reduced peripheral functionality and a high performance Capture Compare Unit with
an additional functionality.
The architecture of the C161RI combines advantages of both RISC and CISC processors and of
advanced peripheral subsystems in a very well-balanced way. The following block diagram gives an
overview of the different on-chip components and of the advanced, high bandwidth internal bus
structure of the C161RI.
Note: All time specifications refer to a CPU clock of 16 MHz
(see definition in the AC Characteristics section).
Figure 4
Block Diagram
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Semiconductor Group
12
1998-05-01
C161RI
Memory Organization
The memory space of the C161RI is configured in a Von Neumann architecture which means that
code memory, data memory, registers and I/O ports are organized within the same linear address
space which includes 16 MBytes. The entire memory space can be accessed bytewise or
wordwise. Particular portions of the on-chip memory have additionally been made directly
bitaddressable.
1 KByte of on-chip Internal RAM is provided as a storage for user defined variables, for the system
stack, general purpose register banks and even for code. A register bank can consist of up to 16
wordwide (R0 to R15) and/or bytewide (RL0, RH0, ..., RL7, RH7) so-called General Purpose
Registers (GPRs).
1024 bytes (2
512 bytes) of the address space are reserved for the Special Function Register
areas (SFR space and ESFR space). SFRs are wordwide registers which are used for controlling
and monitoring functions of the different on-chip units. Unused SFR addresses are reserved for
future members of the C166 family.
In order to meet the needs of designs where more memory is required than is provided on chip, up
to 8 MBytes of external RAM and/or ROM can be connected to the microcontroller.
Semiconductor Group
13
1998-05-01
C161RI
External Bus Controller
All of the external memory accesses are performed by a particular on-chip External Bus Controller
(EBC). It can be programmed either to Single Chip Mode when no external memory is required, or
to one of four different external memory access modes, which are as follows:
16-/18-/20-/23-bit Addresses, 16-bit Data, Demultiplexed
16-/18-/20-/23-bit Addresses, 16-bit Data, Multiplexed
16-/18-/20-/23-bit Addresses, 8-bit Data, Multiplexed
16-/18-/20-/23-bit Addresses, 8-bit Data, Demultiplexed
In the demultiplexed bus modes, addresses are output on PORT1 and data is input/output on
PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use PORT0 for
input/output.
Important timing characteristics of the external bus interface (Memory Cycle Time, Memory
Tri-State Time, Length of ALE and Read Write Delay) have been made programmable to allow the
user the adaption of a wide range of different types of memories and external peripherals.
In addition, up to 4 independent address windows may be defined (via register pairs ADDRSELx /
BUSCONx) which allow to access different resources with different bus characteristics. These
address windows are arranged hierarchically where BUSCON4 overrides BUSCON3 and
BUSCON2 overrides BUSCON1. All accesses to locations not covered by these 4 address windows
are controlled by BUSCON0.
Up to 5 external CS signals (4 windows plus default) can be generated in order to save external glue
logic. Access to very slow memories is supported via a particular `Ready' function.
For applications which require less than 8 MBytes of external memory space, this address space
can be restricted to 1 MByte, 256 KByte or to 64 KByte. In this case Port 4 outputs four, two or no
address lines at all. It outputs all 7 address lines, if an address space of 8 MBytes is used.
Semiconductor Group
14
1998-05-01
C161RI
Central Processing Unit (CPU)
The main core of the CPU consists of a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit
(ALU) and dedicated SFRs. Additional hardware has been spent for a separate multiply and divide
unit, a bit-mask generator and a barrel shifter.
Based on these hardware provisions, most of the C161RI's instructions can be executed in just one
machine cycle which requires 125 ns at 16 MHz CPU clock. For example, shift and rotate
instructions are always processed during one machine cycle independent of the number of bits to
be shifted. All multiple-cycle instructions have been optimized so that they can be executed very fast
as well: branches in 2 cycles, a 16
16 bit multiplication in 5 cycles and a 32-/16 bit division in
10 cycles. Another pipeline optimization, the so-called `Jump Cache', allows reducing the execution
time of repeatedly performed jumps in a loop from 2 cycles to 1 cycle.
Figure 5
CPU Block Diagram
MCB02147
CPU
SP
STKOV
STKUN
Instr. Reg.
Instr. Ptr.
Exec. Unit
4-Stage
Pipeline
MDH
MDL
PSW
SYSCON
Context Ptr.
Mul/Div-HW
R15
R0
General
Purpose
Registers
Bit-Mask Gen
Barrel - Shifter
ALU
(16-bit)
Data Page Ptr.
Code Seg. Ptr.
Internal
RAM
R15
R0
ROM
16
16
32
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
ADDRSEL 4
ADDRSEL 3
ADDRSEL 2
ADDRSEL 1
Semiconductor Group
15
1998-05-01
C161RI
The CPU disposes of an actual register context consisting of up to 16 wordwide GPRs which are
physically allocated within the on-chip RAM area. A Context Pointer (CP) register determines the
base address of the active register bank to be accessed by the CPU at a time. The number of
register banks is only restricted by the available internal RAM space. For easy parameter passing,
a register bank may overlap others.
A system stack of up to 1024 bytes is provided as a storage for temporary data. The system stack
is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack pointer (SP)
register. Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack
pointer value upon each stack access for the detection of a stack overflow or underflow.
The high performance offered by the hardware implementation of the CPU can efficiently be utilized
by a programmer via the highly efficient C161RI instruction set which includes the following
instruction classes:
Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words.
A variety of direct, indirect or immediate addressing modes are provided to specify the required
operands.
Semiconductor Group
16
1998-05-01
C161RI
Interrupt System
With an interrupt response time within a range from just 315 ns to 750 ns (in case of internal
program execution), the C161RI is capable of reacting very fast to the occurrence of non-
deterministic events.
The architecture of the C161RI supports several mechanisms for fast and flexible response to
service requests that can be generated from various sources internal or external to the
microcontroller. Any of these interrupt requests can be programmed to being serviced by the
Interrupt Controller or by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is suspended and
a branch to the interrupt vector table is performed, just one cycle is `stolen' from the current CPU
activity to perform a PEC service. A PEC service implies a single byte or word data transfer between
any two memory locations with an additional increment of either the PEC source or the destination
pointer. An individual PEC transfer counter is implicity decremented for each PEC service except
when performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source related vector location. PEC services are very
well suited, for example, for supporting the transmission or reception of blocks of data. The C161RI
has 8 PEC channels each of which offers such fast interrupt-driven data transfer capabilities.
A separate control register which contains an interrupt request flag, an interrupt enable flag and an
interrupt priority bitfield exists for each of the possible interrupt sources. Via its related register, each
source can be programmed to one of sixteen interrupt priority levels. Once having been accepted
by the CPU, an interrupt service can only be interrupted by a higher prioritized service request. For
the standard interrupt processing, each of the possible interrupt sources has a dedicated vector
location.
Fast external interrupt inputs are provided to service external interrupts with high precision
requirements. These fast interrupt inputs feature programmable edge detection (rising edge, falling
edge or both edges).
Software interrupts are supported by means of the `TRAP' instruction in combination with an
individual trap (interrupt) number.
Semiconductor Group
17
1998-05-01
C161RI
The following table shows all of the possible C161RI interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers:
Source of Interrupt or
PEC Service Request
Request
Flag
Enable
Flag
Interrupt
Vector
Vector
Location
Trap
Number
External Interrupt 0
CC8IR
CC8IE
CC8INT
00'0060
H
18
H
External Interrupt 1
CC9IR
CC9IE
CC9INT
00'0064
H
19
H
External Interrupt 2
CC10IR
CC10IE
CC10INT
00'0068
H
1A
H
External Interrupt 3
CC11IR
CC11IE
CC11INT
00'006C
H
1B
H
External Interrupt 4
CC12IR
CC12IE
CC12INT
00'0070
H
1C
H
External Interrupt 5
CC13IR
CC13IE
CC13INT
00'0074
H
1D
H
External Interrupt 6
CC14IR
CC14IE
CC14INT
00'0078
H
1E
H
External Interrupt 7
CC15IR
CC15IE
CC15INT
00'007C
H
1F
H
GPT1 Timer 2
T2IR
T2IE
T2INT
00'0088
H
22
H
GPT1 Timer 3
T3IR
T3IE
T3INT
00'008C
H
23
H
GPT1 Timer 4
T4IR
T4IE
T4INT
00'0090
H
24
H
GPT2 Timer 5
T5IR
T5IE
T5INT
00'0094
H
25
H
GPT2 Timer 6
T6IR
T6IE
T6INT
00'0098
H
26
H
GPT2 CAPREL Register
CRIR
CRIE
CRINT
00'009C
H
27
H
A/D Conversion Complete ADCIR
ADCIE
ADCINT
00'00A0
H
28
H
A/D Overrun Error
ADEIR
ADEIE
ADEINT
00'00A4
H
29
H
ASC0 Transmit
S0TIR
S0TIE
S0TINT
00'00A8
H
2A
H
ASC0 Transmit Buffer
S0TBIR
S0TBIE
S0TBINT
00'011C
H
47
H
ASC0 Receive
S0RIR
S0RIE
S0RINT
00'00AC
H
2B
H
ASC0 Error
S0EIR
S0EIE
S0EINT
00'00B0
H
2C
H
SSC Transmit
SCTIR
SCTIE
SCTINT
00'00B4
H
2D
H
SSC Receive
SCRIR
SCRIE
SCRINT
00'00B8
H
2E
H
SSC Error
SCEIR
SCEIE
SCEINT
00'00BC
H
2F
H
I
2
C Data Transfer Event
XP0IR
XP0IE
XP0INT
00'0100
H
40
H
I
2
C Protocol Event
XP1IR
XP1IE
XP1INT
00'0104
H
41
H
X-Peripheral Node 2
XP2IR
XP2IE
XP2INT
00'0108
H
42
H
PLL Unlock / RTC
XP3IR
XP3IE
XP3INT
00'010C
H
43
H
Semiconductor Group
18
1998-05-01
C161RI
The C161RI also provides an excellent mechanism to identify and to process exceptions or error
conditions that arise during run-time, so-called `Hardware Traps'. Hardware traps cause immediate
non-maskable system reaction which is similar to a standard interrupt service (branching to a
dedicated vector table location). The occurence of a hardware trap is additionally signified by an
individual bit in the trap flag register (TFR). Except when another higher prioritized trap service is in
progress, a hardware trap will interrupt any actual program execution. In turn, hardware trap
services can normally not be interrupted by standard or PEC interrupts.
The following table shows all of the possible exceptions or error conditions that can arise during run-
time:
Exception Condition
Trap
Flag
Trap
Vector
Vector
Location
Trap
Number
Trap
Priority
Reset Functions:
Hardware Reset
Software Reset
Watchdog Timer Overflow
RESET
RESET
RESET
00'0000
H
00'0000
H
00'0000
H
00
H
00
H
00
H
III
III
III
Class A Hardware Traps:
Non-Maskable Interrupt
Stack Overflow
Stack Underflow
NMI
STKOF
STKUF
NMITRAP
STOTRAP
STUTRAP
00'0008
H
00'0010
H
00'0018
H
02
H
04
H
06
H
II
II
II
Class B Hardware Traps:
Undefined Opcode
Protected Instruction
Fault
Illegal Word Operand
Access
Illegal Instruction Access
Illegal External Bus
Access
UNDOPC
PRTFLT
ILLOPA
ILLINA
ILLBUS
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
00'0028
H
00'0028
H
00'0028
H
00'0028
H
00'0028
H
0A
H
0A
H
0A
H
0A
H
0A
H
I
I
I
I
I
Reserved
[2C
H
3C
H
] [0B
H
0F
H
]
Software Traps
TRAP Instruction
Any
[00'0000
H
00'01FC
H
]
in steps
of 4
H
Any
[00
H
7F
H
]
Current
CPU
Priority
Semiconductor Group
19
1998-05-01
C161RI
General Purpose Timer (GPT) Unit
The GPT unit represents a very flexible multifunctional timer/counter structure which may be used
for many different time related tasks such as event timing and counting, pulse width and duty cycle
measurements, pulse generation, or pulse multiplication.
The GPT unit incorporates five 16-bit timers which are organized in two separate modules, GPT1
and GPT2. Each timer in each module may operate independently in a number of different modes,
or may be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of four
basic modes of operation, which are Timer, Gated Timer, Counter, and Incremental Interface Mode.
In Timer Mode, the input clock for a timer is derived from the CPU clock, divided by a programmable
prescaler, while Counter Mode allows a timer to be clocked in reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of
a timer is controlled by the `gate' level on an external input pin. For these purposes, each timer has
one associated port pin (TxIN) which serves as gate or clock input. The maximum resolution of the
timers in module GPT1 is 500 ns (@ 16 MHz CPU clock).
The count direction (up/down) for each timer is programmable by software or may additionally be
altered dynamically by an external signal on a port pin (TxEUD) to facilitate e.g. position tracking.
In Incremental Interface Mode the GPT1 timers (T2, T3, T4) can be directly connected to the
incremental position sensor signals A and B via their respective inputs TxIN and TxEUD. Direction
and count signals are internally derived from these two input signals, so the contents of the
respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can
be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer over-flow/
underflow. The state of this latch may be output on a port pin (T3OUT) e.g. for time out monitoring
of external hardware components, or may be used internally to clock timers T2 and T4 for
measuring long time periods with high resolution.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload or capture
registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The
contents of timer T3 are captured into T2 or T4 in response to a signal at their associated input pins
(TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or
by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to
alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM
signal, this signal can be constantly generated without software intervention.
With its maximum resolution of 250 ns (@ 16 MHz), the GPT2 module provides precise event
control and time measurement. It includes two timers (T5, T6) and a capture/reload register
(CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via
a programmable prescaler. The count direction (up/down) for each timer is programmable by
software. Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6,
which changes its state on each timer overflow/underflow.
The state of this latch may be used to clock timer T5. The overflows/underflows of timer T6 can
additionally be used to cause a reload from the CAPREL register. The CAPREL register may
capture the contents of timer T5 based on an external signal transition on the corresponding port pin
Semiconductor Group
20
1998-05-01
C161RI
(CAPIN), and timer T5 may optionally be cleared after the capture procedure. This allows absolute
time differences to be measured or pulse multiplication to be performed without software overhead.
The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1 timer
T3's inputs T3IN and/or T3EUD. This is especially advantageous when T3 operates in Incremental
Interface Mode.
Figure 6
Block Diagram of GPT1
MCB02141
GPT1 Timer T2
Mode
Control
Interrupt
Request
T2IN
T2
2
n
n = 3...10
CPU Clock
Reload
Capture
T2EUD
T3
Mode
Control
CPU Clock
n = 3...10
n
2
T3IN
GPT1 Timer T3
T3OTL
Request
Interrupt
T4
Control
Mode
Reload
Capture
CPU Clock
n = 3...10
n
2
T4IN
Request
Interrupt
GPT1 Timer T4
T4EUD
T3EUD
Toggle FF
U/D
U/D
U/D
Semiconductor Group
21
1998-05-01
C161RI
Figure 7
Block Diagram of GPT2
Watchdog Timer
The Watchdog Timer represents one of the fail-safe mechanisms which have been implemented to
prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can only be disabled in the time
interval until the EINIT (end of initialization) instruction has been executed. Thus, the chip's start-up
procedure is always monitored. The software has to be designed to service the Watchdog Timer
before it overflows. If, due to hardware or software related failures, the software fails to do so, the
Watchdog Timer overflows and generates an internal hardware reset and pulls the RSTOUT pin low
in order to allow external hardware components to be reset.
The Watchdog Timer is a 16-bit timer, clocked with the system clock divided either by 2 or by 128.
The high byte of the Watchdog Timer register can be set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced
by the application software, the high byte of the Watchdog Timer is reloaded. Thus, time intervals
between 31
s and 525 ms can be monitored (@ 16 MHz). The default Watchdog Timer interval
after reset is 8.2 ms (@ 16 MHz).
GPT2 Timer T5
2
n
n=2...9
T5
Mode
Control
GPT2 Timer T6
T6
Mode
Control
GPT2 CAPREL
T6OTL
Interrupt
Request
CPU
Interrupt
Request
2
n
n=2...9
CPU
Clock
Clock
Interrupt
Request
CAPIN
Clear
Capture
Semiconductor Group
22
1998-05-01
C161RI
Real Time Clock
The Real Time Clock (RTC) module of the C161RI consists of a chain of 3 divider blocks, a fixed
8-bit divider, the reloadable 16-bit timer T14 and the 32-bit RTC timer (accessible via registers
RTCH and RTCL). The RTC module is directly clocked with the on-chip oscillator frequency divided
by 32 via a separate clock driver and is therefore independent from the selected clock generation
mode of the C161RI. All timers count up.
The RTC module can be used for different purposes:
q
System clock to determine the current time and date
q
Cyclic time based interrupt
q
48-bit timer for long term measurements
Figure 7-1
RTC Block Diagram
Note: The registers associated with the RTC are not effected by a reset in order to maintain the
correct system time even when intermediate resets are executed.
RTCL
RTCL
T14
T14REL
8:1
f
RTC
Reload
Interrupt
Request
Semiconductor Group
23
1998-05-01
C161RI
A/D Converter
For analog signal measurement, an 8-bit A/D converter with 4 multiplexed input channels and a
sample and hold circuit has been integrated on-chip. It uses the method of successive
approximation. The sample time (for loading the capacitors) and the conversion time is
programmable and can so be adjusted to the external circuitry.
Overrun error detection is provided for the conversion result register (ADDAT): an interrupt request
will be generated when the result of a previous conversion has not been read from the result register
at the time the next conversion is complete.
For applications which require less than 4 analog input channels, the remaining channel inputs can
be used as digital input port pins.
The A/D converter of the C161RI supports two different conversion modes. In the standard Single
Channel conversion mode, the analog level on a specified channel is sampled once and converted
to a digital result. In the Single Channel Continuous mode, the analog level on a specified channel
is repeatedly sampled and converted without software intervention.
The 8-bit result can be left-aligned or right-aligned within a 10-bit result area.
The Peripheral Event Controller (PEC) may be used to automatically store the conversion results
into a table in memory for later evaluation, without requiring the overhead of entering and exiting
interrupt routines for each data transfer.
I
2
C Module
The integrated
I
2
C Bus Module handles the transmission and reception of frames over the two-line
I
2
C bus in accordance with the
I
2
C Bus specification. The on-chip
I
2
C Module can receive and
transmit data using 7-bit or 10-bit addressing and it can operate in slave mode, in master mode or
in multi-master mode.
Several physical interfaces (port pins) can be established under software control. Data can be
transferred at speeds up to 400 Kbit/sec.
Two interrupt nodes dedicated to the
I
2
C module allow efficient interrupt service and also support
operation via PEC transfers.
Note: The port pins associated with the
I
2
C interfaces feature open drain drivers only, as required
by the
I
2
C specification.
Semiconductor Group
24
1998-05-01
C161RI
Serial Channels
Serial communication with other microcontrollers, processors, terminals or external peripheral
components is provided by two serial interfaces with different functionality, an Asynchronous/
Synchronous Serial Channel (ASC0) and a High-Speed Synchronous Serial Channel (SSC).
The ASC0 is upward compatible with the serial ports of the Siemens 8-bit microcontroller families
and supports full-duplex asynchronous communication at up to 500 KBaud and half-duplex
synchronous communication at up to 2 MBaud @ 16 MHz CPU clock.
A dedicated baud rate generator allows to set up all standard baud rates without oscillator tuning.
For transmission, reception and error handling 4 separate interrupt vectors are provided. In
asynchronous mode, 8- or 9-bit data frames are transmitted or received, preceded by a start bit and
terminated by one or two stop bits. For multiprocessor communication, a mechanism to distinguish
address from data bytes has been included (8-bit data plus wake up bit mode).
In synchronous mode, the ASC0 transmits or receives bytes (8 bits) synchronously to a shift clock
which is generated by the ASC0. The ASC0 always shifts the LSB first. A loop back option is
available for testing purposes.
A number of optional hardware error detection capabilities has been included to increase the
reliability of data transfers. A parity bit can automatically be generated on transmission or be
checked on reception. Framing error detection allows to recognize data frames with missing stop
bits. An overrun error will be generated, if the last character received has not been read out of the
receive buffer register at the time the reception of a new character is complete.
The SSC supports full-duplex synchronous communication at up to 4 Mbaud @ 16 MHz CPU clock.
It may be configured so it interfaces with serially linked peripheral components. A dedicated baud
rate generator allows to set up all standard baud rates without oscillator tuning. For transmission,
reception and error handling 3 separate interrupt vectors are provided.
The SSC transmits or receives characters of 2...16 bits length synchronously to a shift clock which
can be generated by the SSC (master mode) or by an external master (slave mode). The SSC can
start shifting with the LSB or with the MSB and allows the selection of shifting and latching clock
edges as well as the clock polarity.
A number of optional hardware error detection capabilities has been included to increase the
reliability of data transfers. Transmit and receive error supervise the correct handling of the data
buffer. Phase and baudrate error detect incorrect serial data.
Semiconductor Group
25
1998-05-01
C161RI
Parallel Ports
The C161RI provides up to 76 IO lines which are organized into six input/output ports and one input
port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise)
programmable as inputs or outputs via direction registers. The I/O ports are true bidirectional ports
which are switched to high impedance state when configured as inputs. The output drivers of three
IO ports can be configured (pin by pin) for push/pull operation or open-drain operation via control
registers. The other IO ports operate in push/pull mode, except for the
I
2
C interface pins which are
open drain pins only. During the internal reset, all port pins are configured as inputs.
All port lines have programmable alternate input or output functions associated with them.
PORT0 and PORT1 may be used as address and data lines when accessing external memory,
while Port 4 outputs the additional segment address bits A22/19/17...A16 in systems where
segmentation is enabled to access more than 64 KBytes of memory.
Port 3 includes alternate functions of timers, serial interfaces, the optional bus control signal BHE
and the system clock output (CLKOUT).
Port 5 is used for the analog input channels to the A/D converter or timer control signals.
Port 6 provides the optional chip select signals and interface lines for the
I
2
C module.
All port lines that are not used for these alternate functions may be used as general purpose IO
lines.
Semiconductor Group
26
1998-05-01
C161RI
Instruction Set Summary
The table below lists the instructions of the C161RI in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation of the
instructions, parameters for conditional execution of instructions, and the opcodes for each
instruction can be found in the "C166 Family Instruction Set Manual".
This document also provides a detailed description of each instruction.
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2 / 4
ADDC(B)
Add word (byte) operands with Carry
2 / 4
SUB(B)
Subtract word (byte) operands
2 / 4
SUBC(B)
Subtract word (byte) operands with Carry
2 / 4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR (16-16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit)
2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit)
2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2 / 4
OR(B)
Bitwise OR, (word/byte operands)
2 / 4
XOR(B)
Bitwise XOR, (word/byte operands)
2 / 4
BCLR
Clear direct bit
2
BSET
Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND, BOR, BXOR
AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/L
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2 / 4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2 / 4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2 / 4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL / SHR
Shift left/right direct word GPR
2
ROL / ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
Semiconductor Group
27
1998-05-01
C161RI
MOV(B)
Move word (byte) data
2 / 4
MOVBS
Move byte operand to word operand with sign extension
2 / 4
MOVBZ
Move byte operand to word operand. with zero extension
2 / 4
JMPA, JMPI, JMPR
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
J(N)B
Jump relative if direct bit is (not) set
4
JBC
Jump relative and clear bit if direct bit is set
4
JNBS
Jump relative and set bit if direct bit is not set
4
CALLA, CALLI, CALLR
Call absolute/indirect/relative subroutine if condition is met
4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH, POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET
Return from intra-segment subroutine
2
RETS
Return from inter-segment subroutine
2
RETP
Return from intra-segment subroutine and pop direct
word register from system stack
2
RETI
Return from interrupt service subroutine
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
Enter Power Down Mode
(supposes NMI-pin being low)
4
SRVWDT
Service Watchdog Timer
4
DISWDT
Disable Watchdog Timer
4
EINIT
Signify End-of-Initialization on RSTOUT-pin
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2 / 4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2 / 4
NOP
Null operation
2
Instruction Set Summary (cont'd)
Mnemonic
Description
Bytes
Semiconductor Group
28
1998-05-01
C161RI
Special Function Registers Overview
The following table lists all SFRs which are implemented in the C161RI in alphabetical order.
Bit-addressable SFRs are marked with the letter "b" in column "Name". SFRs within the Extended
SFR-Space
(ESFRs) are marked with the letter "E" in column "Physical Address". Registers within
on-chip X-Peripherals (
I
2
C) are marked with the letter "X" in column "Physical Address".
An SFR can be specified via its individual mnemonic name. Depending on the selected addressing
mode, an SFR can be accessed via its physical address (using the Data Page Pointers), or via its
short 8-bit address (without using the Data Page Pointers).
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
ADCIC
b FF98
H
CC
H
A/D Converter End of Conversion Interrupt
Control Register
0000
H
ADCON
b FFA0
H
D0
H
A/D Converter Control Register
0000
H
ADDAT
FEA0
H
50
H
A/D Converter Result Register
0000
H
ADDRSEL1
FE18
H
0C
H
Address Select Register 1
0000
H
ADDRSEL2
FE1A
H
0D
H
Address Select Register 2
0000
H
ADDRSEL3
FE1C
H
0E
H
Address Select Register 3
0000
H
ADDRSEL4
FE1E
H
0F
H
Address Select Register 4
0000
H
ADEIC
b FF9A
H
CD
H
A/D Converter Overrun Error Interrupt Control
Register
0000
H
BUSCON0 b FF0C
H
86
H
Bus Configuration Register 0
0000
H
BUSCON1 b FF14
H
8A
H
Bus Configuration Register 1
0000
H
BUSCON2 b FF16
H
8B
H
Bus Configuration Register 2
0000
H
BUSCON3 b FF18
H
8C
H
Bus Configuration Register 3
0000
H
BUSCON4 b FF1A
H
8D
H
Bus Configuration Register 4
0000
H
CAPREL
FE4A
H
25
H
GPT2 Capture/Reload Register
0000
H
CC8IC
b FF88
H
C4
H
External Interrupt 0 Control Register
0000
H
CC9IC
b FF8A
H
C5
H
External Interrupt 1 Control Register
0000
H
CC10IC
b FF8C
H
C6
H
External Interrupt 2 Control Register
0000
H
CC11IC
b FF8E
H
C7
H
External Interrupt 3 Control Register
0000
H
CC12IC
b FF90
H
C8
H
External Interrupt 4 Control Register
0000
H
CC13IC
b FF92
H
C9
H
External Interrupt 5 Control Register
0000
H
CC14IC
b FF94
H
CA
H
External Interrupt 6 Control Register
0000
H
CC15IC
b FF96
H
CB
H
External Interrupt 7 Control Register
0000
H
CP
FE10
H
08
H
CPU Context Pointer Register
FC00
H
Semiconductor Group
29
1998-05-01
C161RI
CRIC
b FF6A
H
B5
H
GPT2 CAPREL Interrupt Control Register
0000
H
CSP
FE08
H
04
H
CPU Code Segment Pointer Register
(8 bits, not directly writeable)
0000
H
DP0L
b F100
H
E 80
H
P0L Direction Control Register
00
H
DP0H
b F102
H
E 81
H
P0H Direction Control Register
00
H
DP1L
b F104
H
E 82
H
P1L Direction Control Register
00
H
DP1H
b F106
H
E 83
H
P1H Direction Control Register
00
H
DP2
b FFC2
H
E1
H
Port 2 Direction Control Register
0000
H
DP3
b FFC6
H
E3
H
Port 3 Direction Control Register
0000
H
DP4
b FFCA
H
E5
H
Port 4 Direction Control Register
00
H
DP6
b FFCE
H
E7
H
Port 6 Direction Control Register
00
H
DPP0
FE00
H
00
H
CPU Data Page Pointer 0 Register (10 bits)
0000
H
DPP1
FE02
H
01
H
CPU Data Page Pointer 1 Register (10 bits)
0001
H
DPP2
FE04
H
02
H
CPU Data Page Pointer 2 Register (10 bits)
0002
H
DPP3
FE06
H
03
H
CPU Data Page Pointer 3 Register (10 bits)
0003
H
EXICON
b F1C0
H
E E0
H
External Interrupt Control Register
0000
H
ICADR
ED06
H
X ---
I
2
C Address Register
0XXX
H
ICCFG
ED00
H
X ---
I
2
C Configuration Register
XX00
H
ICCON
ED02
H
X ---
I
2
C Control Register
0000
H
ICRTB
ED08
H
X ---
I
2
C Receive/Transmit Buffer
XX
H
ICST
ED04
H
X ---
I
2
C Status Register
0000
H
IDCHIP
F07C
H
E 3E
H
Identifier
09XX
H
IDMANUF
F07E
H
E 3F
H
Identifier
1820
H
IDMEM
F07A
H
E 3D
H
Identifier
0000
H
IDPROG
F078
H
E 3C
H
Identifier
0000
H
ISNC
b F1DE
H
E EF
H
Interrupt Subnode Control Register
0000
H
MDC
b FF0E
H
87
H
CPU Multiply Divide Control Register
0000
H
MDH
FE0C
H
06
H
CPU Multiply Divide Register High Word
0000
H
MDL
FE0E
H
07
H
CPU Multiply Divide Register Low Word
0000
H
ODP2
b F1C2
H
E E1
H
Port 2 Open Drain Control Register
0000
H
ODP3
b F1C6
H
E E3
H
Port 3 Open Drain Control Register
0000
H
ODP6
b F1CE
H
E E7
H
Port 6 Open Drain Control Register
00
H
ONES
b FF1E
H
8F
H
Constant Value 1's Register (read only)
FFFF
H
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
Semiconductor Group
30
1998-05-01
C161RI
P0L
b FF00
H
80
H
Port 0 Low Register (Lower half of PORT0)
00
H
P0H
b FF02
H
81
H
Port 0 High Register (Upper half of PORT0)
00
H
P1L
b FF04
H
82
H
Port 1 Low Register (Lower half of PORT1)
00
H
P1H
b FF06
H
83
H
Port 1 High Register (Upper half of PORT1)
00
H
P2
b FFC0
H
E0
H
Port 2 Register
0000
H
P3
b FFC4
H
E2
H
Port 3 Register
0000
H
P4
b FFC8
H
E4
H
Port 4 Register (7 bits)
00
H
P5
b FFA2
H
D1
H
Port 5 Register (read only)
XXXX
H
P5DIDIS
b FFA4
H
D2
H
Port 5 Digital Input Disable Register
0000
H
P6
b FFCC
H
E6
H
Port 6 Register (8 bits)
00
H
PECC0
FEC0
H
60
H
PEC Channel 0 Control Register
0000
H
PECC1
FEC2
H
61
H
PEC Channel 1 Control Register
0000
H
PECC2
FEC4
H
62
H
PEC Channel 2 Control Register
0000
H
PECC3
FEC6
H
63
H
PEC Channel 3 Control Register
0000
H
PECC4
FEC8
H
64
H
PEC Channel 4 Control Register
0000
H
PECC5
FECA
H
65
H
PEC Channel 5 Control Register
0000
H
PECC6
FECC
H
66
H
PEC Channel 6 Control Register
0000
H
PECC7
FECE
H
67
H
PEC Channel 7 Control Register
0000
H
PSW
b FF10
H
88
H
CPU Program Status Word
0000
H
RP0H
b F108
H
E 84
H
System Startup Configuration Register (Rd. only)
XX
H
RTCH
F0D6
H
E 6B
H
RTC High Register
no
RTCL
F0D4
H
E 6A
H
RTC Low Register
no
S0BG
FEB4
H
5A
H
Serial Channel 0 Baud Rate Generator Reload
Register
0000
H
S0CON
b FFB0
H
D8
H
Serial Channel 0 Control Register
0000
H
S0EIC
b FF70
H
B8
H
Serial Channel 0 Error Interrupt Control Register
0000
H
S0RBUF
FEB2
H
59
H
Serial Channel 0 Receive Buffer Register
(read only)
XXXX
H
S0RIC
b FF6E
H
B7
H
Serial Channel 0 Receive Interrupt Control
Register
0000
H
S0TBIC
b F19C
H
E CE
H
Serial Channel 0 Transmit Buffer Interrupt Control
Register
0000
H
S0TBUF
FEB0
H
58
H
Serial Channel 0 Transmit Buffer Register
0000
H
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
Semiconductor Group
31
1998-05-01
C161RI
S0TIC
b FF6C
H
B6
H
Serial Channel 0 Transmit Interrupt Control
Register
0000
H
SP
FE12
H
09
H
CPU System Stack Pointer Register
FC00
H
SSCBR
F0B4
H
E 5A
H
SSC Baudrate Register
0000
H
SSCCON
b FFB2
H
D9
H
SSC Control Register
0000
H
SSCEIC
b FF76
H
BB
H
SSC Error Interrupt Control Register
0000
H
SSCRB
F0B2
H
E 59
H
SSC Receive Buffer (read only)
XXXX
H
SSCRIC
b FF74
H
BA
H
SSC Receive Interrupt Control Register
0000
H
SSCTB
F0B0
H
E 58
H
SSC Transmit Buffer (write only)
0000
H
SSCTIC
b FF72
H
B9
H
SSC Transmit Interrupt Control Register
0000
H
STKOV
FE14
H
0A
H
CPU Stack Overflow Pointer Register
FA00
H
STKUN
FE16
H
0B
H
CPU Stack Underflow Pointer Register
FC00
H
SYSCON
b FF12
H
89
H
CPU System Configuration Register
0XX0
H
1)
SYSCON2 b F1D0
H
E E8
H
CPU System Configuration Register 2
0000
H
SYSCON3 b F1D4
H
E EA
H
CPU System Configuration Register 3
0000
H
T14
F0D2
H
E 69
H
RTC Timer 14 Register
no
T14REL
F0D0
H
E 68
H
RTC Timer 14 Reload Register
no
T2
FE40
H
20
H
GPT1 Timer 2 Register
0000
H
T2CON
b FF40
H
A0
H
GPT1 Timer 2 Control Register
0000
H
T2IC
b FF60
H
B0
H
GPT1 Timer 2 Interrupt Control Register
0000
H
T3
FE42
H
21
H
GPT1 Timer 3 Register
0000
H
T3CON
b FF42
H
A1
H
GPT1 Timer 3 Control Register
0000
H
T3IC
b FF62
H
B1
H
GPT1 Timer 3 Interrupt Control Register
0000
H
T4
FE44
H
22
H
GPT1 Timer 4 Register
0000
H
T4CON
b FF44
H
A2
H
GPT1 Timer 4 Control Register
0000
H
T4IC
b FF64
H
B2
H
GPT1 Timer 4 Interrupt Control Register
0000
H
T5
FE46
H
23
H
GPT2 Timer 5 Register
0000
H
T5CON
b FF46
H
A3
H
GPT2 Timer 5 Control Register
0000
H
T5IC
b FF66
H
B3
H
GPT2 Timer 5 Interrupt Control Register
0000
H
T6
FE48
H
24
H
GPT2 Timer 6 Register
0000
H
T6CON
b FF48
H
A4
H
GPT2 Timer 6 Control Register
0000
H
T6IC
b FF68
H
B4
H
GPT2 Timer 6 Interrupt Control Register
0000
H
TFR
b FFAC
H
D6
H
Trap Flag Register
0000
H
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
Semiconductor Group
32
1998-05-01
C161RI
1)
The system configuration is selected during reset.
2)
The reset value depends on the indicated reset source.
WDT
FEAE
H
57
H
Watchdog Timer Register (read only)
0000
H
WDTCON b FFAE
H
D7
H
Watchdog Timer Control Register
00XX
H
2)
XP0IC
b F186
H
E C3
H
I
2
C Data Interrupt Control Register
0000
H
XP1IC
b F18E
H
E C7
H
I
2
C Protocol Interrupt Control Register
0000
H
XP2IC
b F196
H
E CB
H
X-Peripheral 2 Interrupt Control Register
0000
H
XP3IC
b F19E
H
E CF
H
RTC Interrupt Control Register
0000
H
ZEROS
b FF1C
H
8E
H
Constant Value 0's Register (read only)
0000
H
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
Semiconductor Group
33
1998-05-01
C161RI
Absolute Maximum Ratings
Ambient temperature under bias (
T
A
):
SAB-C161RI ...................................................................................................................0 to + 70
C
SAF-C161RI .............................................................................................................. 40 to + 85
C
Storage temperature (
T
ST
)........................................................................................ 65 to + 150
C
Voltage on
V
DD
pins with respect to ground (
V
SS
) ..................................................... 0.5 to + 6.5 V
Voltage on any pin with respect to ground (
V
SS
) ................................................. 0.5 to
V
DD
+ 0.5 V
Input current on any pin during overload condition .................................................. 10 to + 10 mA
Absolute sum of all input currents during overload condition ..............................................|100 mA|
Power dissipation..................................................................................................................... 1.5 W
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
During absolute maximum rating overload conditions (
V
IN
>
V
DD
or
V
IN
<
V
SS
) the voltage on
V
DD
pins with respect to ground (
V
SS
) must not exceed the values defined by the absolute
maximum ratings.
Parameter Interpretation
The parameters listed in the following partly represent the characteristics of the C161RI and partly
its demands on the system. To aid in interpreting the parameters right, when evaluating them for a
design, they are marked in column "Symbol":
CC (Controller Characteristics):
The logic of the C161RI will provide signals with the respective timing characteristics.
SR (System Requirement):
The external system must provide signals with the respective timing characteristics to the C161RI.
Semiconductor Group
34
1998-05-01
C161RI
DC Characteristics
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V;
f
CPU
= 20 MHz
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
Parameter
Symbol
Limit Values
Unit
Test Condition
min.
max.
Input low voltage
(P3.0, P3.1, P6.5, P6.6, P6.7)
V
IL1
SR
0.5
0.3
V
DD
V
Input low voltage
(TTL)
V
IL
SR
0.5
0.2
V
DD
0.1
V
Input low voltage
(Special Threshold)
V
ILS
SR
0.5
2.0
V
Input high voltage RSTIN
V
IH1
SR
0.6
V
DD
V
DD
+ 0.5
V
Input high voltage XTAL1,
P3.0, P3.1, P6.5, P6.6, P6.7
V
IH2
SR
0.7
V
DD
V
DD
+ 0.5
V
Input high voltage
(TTL)
V
IH
SR
0.2
V
DD
+ 0.9
V
DD
+ 0.5
V
Input high voltage
(Special Threshold)
V
IHS
SR
0.8
V
DD
0.2
V
DD
+ 0.5
V
Input Hysteresis
(Special Threshold)
HYS
400
mV
Output low voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
V
OL
CC
0.45
V
I
OL
= 2.4 mA
Output low voltage
(P3.0, P3.1, P6.5, P6.6, P6.7)
V
OL2
CC
0.4
V
I
OL2
= 3 mA
Output low voltage
(all other outputs)
V
OL1
CC
0.45
V
I
OL1
= 1.6 mA
Output high voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
V
OH
CC
0.9
V
DD
2.4
V
I
OH
= 500
A
I
OH
= 2.4 mA
Output high voltage
1)
(all other outputs)
V
OH1
CC
0.9
V
DD
2.4
V
V
I
OH
= 250
A
I
OH
= 1.6 mA
Input leakage current (Port 5)
I
OZ1
CC
200
nA
0.45 V <
V
IN
<
V
DD
Input leakage current (all other)
I
OZ2
CC
500
nA
0.45 V <
V
IN
<
V
DD
Overload current
I
OV
SR
5
mA
5) 8)
RSTIN pullup resistor
R
RST
CC
50
250
k
Read/Write inactive current
4)
I
RWH
2)
40
A
V
OUT
= 2.4 V
Read/Write active current
4)
I
RWL
3)
500
A
V
OUT
=
V
OLmax
Semiconductor Group
35
1998-05-01
C161RI
ALE inactive current
4)
I
ALEL
2)
40
A
V
OUT
=
V
OLmax
ALE active current
4)
I
ALEH
3)
500
A
V
OUT
= 2.4 V
Port 6 inactive current
4)
I
P6H
2)
40
A
V
OUT
= 2.4 V
Port 6 active current
4)
I
P6L
3)
500
A
V
OUT
=
V
OL1max
PORT0 configuration current
4)
I
P0H
2)
10
A
V
IN
=
V
IHmin
I
P0L
3)
100
A
V
IN
=
V
ILmax
XTAL1 input current
I
IL
CC
20
A
0 V <
V
IN
<
V
DD
Pin capacitance
5)
(digital inputs/outputs)
C
IO
CC
10
pF
f
= 1 MHz
T
A
= 25
C
Power supply current (active)
with all peripherals active
I
DD
7 +
3
f
CPU
mA
RSTIN =
V
IL2
f
CPU
in [MHz]
6)
Idle mode supply current
with all peripherals active
I
IDX
3 +
1.1
f
CPU
mA
RSTIN =
V
IH1
f
CPU
in [MHz]
6)
Idle mode supply current
with all peripherals deactivated,
PLL off, SDD factor = 32
I
IDO
500 +
50
f
OSC
9)
A
RSTIN =
V
IH1
f
OSC
in [MHz]
6)
Power-down mode supply current
with RTC running
I
PDR
100 +
25
f
OSC
9)
A
V
DD
= 5.5 V
f
OSC
in [MHz]
7)
Power-down mode supply current
with RTC disabled
I
PDO
50
A
V
DD
= 5.5 V
7)
Parameter
Symbol
Limit Values
Unit
Test Condition
min.
max.
Semiconductor Group
36
1998-05-01
C161RI
Notes
1)
This specification is not valid for outputs which are switched to open drain mode. In this case the respective
output will float and the voltage results from the external circuitry.
2)
The maximum current may be drawn while the respective signal line remains inactive.
3)
The minimum current must be drawn in order to drive the respective signal line active.
4)
This specification is only valid during Reset, or during Adapt-mode.
5)
Not 100% tested, guaranteed by design characterization.
6)
The supply current is a function of the operating frequency. This dependency is illustrated in the figure below.
These parameters are tested at
V
DDmax
and 20 MHz CPU clock with all outputs disconnected and all inputs at
V
IL
or
V
IH
.
The oscillator also contributes to the total supply current. The given values refer to the worst case, i.e.
I
PDRmax
.
For lower oscillator frequencies the respective supply current can be reduced accordingly.
7)
This parameter is tested including leakage currents. All inputs (including pins configured as inputs) at 0 V to
0.1 V or at
V
DD
0.1 V to
V
DD
,
V
REF
= 0 V, all outputs (including pins configured as outputs) disconnected.
8)
Overload conditions under operating conditions occur if the voltage on the respective pin exceeds the specified
operating range (i.e.
V
OV
>
V
DD
+ 0.5 V or
V
OV
<
V
SS
- 0.5 V). The absolute sum of input overload currents on
all port pins may not exceed 50 mA. The supply voltage (
V
DD
and
V
SS
) must remain within the specified limits.
9)
This parameter is determined mainly by the current consumed by the oscillator. This current, however, is
influenced by the external oscillator circuitry (crystal, capacitors). The values given for
I
PDR
refer to a typical
circuitry and may change in case of a not optimized external oscillator circuitry.
A typical value for
I
PDR
at room temperature and
f
CPU
= 16 MHz is 300
A.
Semiconductor Group
37
1998-05-01
C161RI
Figure 8
Supply/Idle Current as a Function of Operating Frequency
Figure 9
Power Down Supply Current as a Function of Oscillator Frequency
I [m
A
]
f
CPU
[MHz]
5
10
40
I
DDtyp
I
IDXmax
I
DDmax
I
IDXtyp
10
15
20
70
I [
A]
f
OSC
[MHz]
4
I
PDRmax
8
12
16
I
PDOmax
1500
1250
1000
750
500
250
I
IDOmax
I
IDOtyp
Semiconductor Group
38
1998-05-01
C161RI
AC Characteristics
Definition of Internal Timing
The internal operation of the C161RI is controlled by the internal CPU clock
f
CPU
. Both edges of the
CPU clock can trigger internal (e.g. pipeline) or external (e.g. bus cycles) operations.
The specification of the external timing (AC Characteristics) therefore depends on the time between
two consecutive edges of the CPU clock, called "TCL" (see figure below).
Figure 10
Generation Mechanisms for the CPU Clock
The CPU clock signal can be generated via different mechanisms. The duration of TCLs and their
variation (and also the derived external timing) depends on the used mechanism to generate
f
CPU
.
This influence must be regarded when calculating the timings for the C161RI.
The used mechanism to generate the CPU clock is selected during reset via the logic levels on pins
P0.15-13 (P0H.7-5).
TCL TCL
f
CPU
f
XTAL
Direct Clock Drive
TCL
TCL
f
CPU
f
XTAL
Prescaler Operation
Semiconductor Group
39
1998-05-01
C161RI
The table below associates the combinations of these three bits with the respective clock generation
mode.
1)
The maximum frequency depends on the duty cycle of the external clock signal.
Prescaler Operation
When pins P0.15-13 (P0H.7-5) equal `001' during reset the CPU clock is derived from the internal
oscillator (input clock signal) by a 2:1 prescaler.
The frequency of
f
CPU
is half the frequency of
f
XTAL
and the high and low time of
f
CPU
(i.e. the duration
of an individual TCL) is defined by the period of the input clock
f
XTAL
.
The timings listed in the AC Characteristics that refer to TCLs therefore can be calculated using the
period of
f
XTAL
for any TCL.
Direct Drive
When pins P0.15-13 (P0H.7-5) equal `011' during reset the on-chip phase locked loop is disabled
and the CPU clock is directly driven from the internal oscillator with the input clock signal.
The frequency of
f
CPU
directly follows the frequency of
f
XTAL
so the high and low time of
f
CPU
(i.e. the
duration of an individual TCL) is defined by the duty cycle of the input clock
f
XTAL
.
The timings listed below that refer to TCLs therefore must be calculated using the minimum TCL
that is possible under the respective circumstances. This minimum value can be calculated via the
following formula:
TCL
min
= 1/
f
XTAL
DC
min
(DC = duty cycle)
For two consecutive TCLs the deviation caused by the duty cycle of
f
XTAL
is compensated so the
duration of 2TCL is always 1/
f
XTAL
. The minimum value TCL
min
therefore has to be used only once
for timings that require an odd number of TCLs (1,3,...). Timings that require an even number of
TCLs (2,4,...) may use the formula 2TCL = 1/
f
XTAL
.
Note: The address float timings in Multiplexed bus mode (
t
11
and
t
45
) use the maximum duration of
TCL (TCL
max
= 1/
f
XTAL
DC
max
) instead of TCL
min
.
C161RI Clock Generation Modes
P0.15-13
(P0H.7-5)
CPU Frequency
f
CPU
=
f
XTAL
F
Notes
1
1
1
Reserved
Default configuration without pull-downs
1
1
0
Reserved
1
0
1
Reserved
1
0
0
Reserved
0
1
1
f
XTAL
1
Direct drive
1)
0
1
0
Reserved
0
0
1
f
XTAL
/ 2
CPU clock via prescaler
0
0
0
Reserved
Semiconductor Group
40
1998-05-01
C161RI
AC Characteristics
External Clock Drive XTAL1
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
1)
The clock input signal must reach the defined levels
V
IL
and
V
IH2
.
2)
The specified minimum low and high times allow a duty cycle range of 40...60% at 16 MHz.
Figure 11
External Clock Drive XTAL1
Parameter
Symbol
Direct Drive 1:1
Prescaler 2:1
Unit
min.
max.
min.
max.
Oscillator period
t
OSC
SR
62
8000
31
4000
ns
High time
t
1
SR
25
1)
2)
6
ns
Low time
t
2
SR
25
1)
2)
6
ns
Rise time
t
3
SR
10
1)
6
1)
ns
Fall time
t
4
SR
10
1)
6
1)
ns
MCT02534
3
t
4
t
V
IH2
V
IL
V
DD
0.5
1
t
2
t
OSC
t
Semiconductor Group
41
1998-05-01
C161RI
A/D Converter Characteristics
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
4.0 V
V
AREF
V
DD
+ 0.1 V;
V
SS
- 0.1 V
V
AGND
V
SS
+ 0.2 V
The conversion time of the C161RI's A/D Converter is programmable. The table below should be
used to calculate the above timings.
The limit values for
f
BC
must not be exceeded when selecting ADCTC.
Converter Timing Example:
Assumptions:
f
CPU
= 16 MHz (i.e.
t
CPU
= 62.5 ns), ADCTC = `01'.
Basic clock
f
BC
=
f
CPU
/ 4 = 4 MHz, i.e.
t
BC
= 250 ns.
Sample time
t
S
=
t
BC
6 = 1500 ns.
Conversion time
t
C
= 30
t
BC
+ 2
t
CPU
= (7500 + 125) ns = 7.625
s.
Parameter
Symbol
Limit Values
Unit
Test Condition
min.
max.
Analog input voltage range
V
AIN
SR
V
AGND
V
AREF
V
1)
Basic clock frequency
f
BC
0.5
4
MHz
2)
Sample time
t
S
CC
6
t
BC
t
BC
= 1 /
f
BC
Conversion time
t
C
CC
30
t
BC
+ 2
t
CPU
3)
t
CPU
= 1 /
f
CPU
Total unadjusted error
TUE CC
2
LSB
4)
Internal resistance of reference
voltage source
R
AREF
SR
t
BC
/ 125
- 0.25
k
t
BC
in [ns]
5)
6)
Internal resistance of analog
source
R
ASRC
SR
t
S
/ 750
- 0.25
k
t
S
in [ns]
6)
7)
ADC input capacitance
C
AIN
CC
50
pF
6)
ADCON.15|14
(ADCTC)
A/D Converter Basic Clock
f
BC
2)
00
f
CPU
/ 2
01
f
CPU
/ 4
10
f
CPU
/ 8
11
f
CPU
/ 16
Semiconductor Group
42
1998-05-01
C161RI
Notes
1)
V
AIN
may exceed
V
AGND
or
V
AREF
up to the absolute maximum ratings. However, the conversion result in these
cases will be X000
H
or X3FF
H
, respectively.
2)
The limit values for
f
BC
must not be exceeded when selecting the CPU frequency and the ADCTC setting.
3)
This parameter includes the sample time
t
S
, the time for determining the digital result and the time to load the
result register with the conversion result.
Values for the basic clock
t
BC
depend on programming and can be taken from the table above.
This parameter depends on the ADC control logic. It is not a real maximum value, but rather a fixum.
4)
TUE is tested at
V
AREF
= 5.0 V,
V
AGND
= 0 V,
V
DD
= 4.9 V. It is guaranteed by design for all other voltages within
the defined voltage range.
The specified TUE is guaranteed only if an overload condition (see
I
OV
specification) occurs on maximum 2 not
selected analog input pins and the absolute sum of input overload currents on all analog input pins does not
exceed 10 mA.
5)
During the conversion the ADC's capacitance must be repeatedly charged or discharged. The internal
resistance of the reference voltage source must allow the capacitance to reach its respective voltage level
within each conversion step. The maximum internal resistance results from the programmed conversion
timing.
6)
Not 100% tested, guaranteed by design.
7)
During the sample time the input capacitance
C
I
can be charged/discharged by the external source. The
internal resistance of the analog source must allow the capacitance to reach its final voltage level within
t
S
.
After the end of the sample time
t
S
, changes of the analog input voltage have no effect on the conversion result.
Values for the sample time
t
S
depend on programming and can be taken from the table above.
Semiconductor Group
43
1998-05-01
C161RI
Testing Waveforms
Figure 12
Input Output Waveforms
Figure 13
Float Waveforms
AC inputs during testing are driven at 2.4 V for a logic `1' and 0.45 V for a logic `0'.
Timing measurements are made at
V
IH
min for a logic `1' and
V
IL
max for a logic `0'.
For timing purposes a port pin is no longer floating when a 100 mV change from load
voltage occurs, but begins to float when a 100 mV change from the loaded
V
OH
/
V
OL
level occurs
(
I
OH
/
I
OL
= 20 mA).
Semiconductor Group
44
1998-05-01
C161RI
Memory Cycle Variables
The timing tables below use three variables which are derived from the BUSCONx registers and
represent the special characteristics of the programmed memory cycle. The following table
describes, how these variables are to be computed.
AC Characteristics
Multiplexed Bus
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
C
L
= 100 pF
ALE cycle time = 6 TCL + 2
t
A
+
t
C
+
t
F
(186 ns at 16 MHz CPU clock without waitstates)
Description
Symbol
Values
ALE Extension
t
A
TCL
<ALECTL>
Memory Cycle Time Waitstates
t
C
2TCL
(15 - <MCTC>)
Memory Tristate Time
t
F
2TCL
(1 - <MTTC>)
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
ALE high time
t
5
CC
21 +
t
A
TCL - 10 +
t
A
ns
Address setup to ALE
t
6
CC
15 +
t
A
TCL - 16 +
t
A
ns
Address hold after ALE
t
7
CC
21 +
t
A
TCL - 10 +
t
A
ns
ALE falling edge to RD,
WR (with RW-delay)
t
8
CC
21 +
t
A
TCL - 10 +
t
A
ns
ALE falling edge to RD,
WR (no RW-delay)
t
9
CC
10 +
t
A
10 +
t
A
ns
Address float after RD,
WR (with RW-delay)
t
10
CC
6
6
ns
Address float after RD,
WR (no RW-delay)
t
11
CC
37
TCL + 6
ns
RD, WR low time
(with RW-delay)
t
12
CC
53 +
t
C
2TCL - 10
+
t
C
ns
RD, WR low time
(no RW-delay)
t
13
CC
84 +
t
C
3TCL - 10
+
t
C
ns
Semiconductor Group
45
1998-05-01
C161RI
RD to valid data in
(with RW-delay)
t
14
SR
43 +
t
C
2TCL - 20
+
t
C
ns
RD to valid data in
(no RW-delay)
t
15
SR
74 +
t
C
3TCL - 20
+
t
C
ns
ALE low to valid data in
t
16
SR
74
+
t
A
+
t
C
3TCL - 20
+
t
A
+
t
C
ns
Address to valid data in
t
17
SR
95
+
2
t
A
+
t
C
4TCL - 30
+
2
t
A
+
t
C
ns
Data hold after RD
rising edge
t
18
SR
0
0
ns
Data float after RD
t
19
SR
49 +
t
F
2TCL - 14
+
t
F
ns
Data valid to WR
t
22
CC
43 +
t
C
2TCL - 20
+
t
C
ns
Data hold after WR
t
23
CC
49 +
t
F
2TCL - 14
+
t
F
ns
ALE rising edge after RD,
WR
t
25
CC
49 +
t
F
2TCL - 14
+
t
F
ns
Address hold after RD,
WR
t
27
CC
49 +
t
F
2TCL - 14
+
t
F
ns
ALE falling edge to CS
t
38
CC
4 -
t
A
10 -
t
A
4 -
t
A
10 -
t
A
ns
CS low to Valid Data In
t
39
SR
74
+
t
C
+
2
t
A
3TCL - 20
+
t
C
+
2
t
A
ns
CS hold after RD, WR
t
40
CC
80 +
t
F
3TCL - 14
+
t
F
ns
ALE fall. edge to RdCS,
WrCS (with RW delay)
t
42
CC
27 +
t
A
TCL - 4
+
t
A
ns
ALE fall. edge to RdCS,
WrCS (no RW delay)
t
43
CC
4 +
t
A
-4
+
t
A
ns
Address float after RdCS,
WrCS (with RW delay)
t
44
CC
0
0
ns
Address float after RdCS,
WrCS (no RW delay)
t
45
CC
31
TCL
ns
RdCS to Valid Data In
(with RW delay)
t
46
SR
39 +
t
C
2TCL - 24
+
t
C
ns
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
Semiconductor Group
46
1998-05-01
C161RI
RdCS to Valid Data In
(no RW delay)
t
47
SR
70 +
t
C
3TCL - 24
+
t
C
ns
RdCS, WrCS Low Time
(with RW delay)
t
48
CC
53 +
t
C
2TCL - 10
+
t
C
ns
RdCS, WrCS Low Time
(no RW delay)
t
49
CC
84 +
t
C
3TCL - 10
+
t
C
ns
Data valid to WrCS
t
50
CC
49 +
t
C
2TCL - 14
+
t
C
ns
Data hold after RdCS
t
51
SR
0
0
ns
Data float after RdCS
t
52
SR
43 +
t
F
2TCL - 20
+
t
F
ns
Address hold after
RdCS, WrCS
t
54
CC
43 +
t
F
2TCL - 20
+
t
F
ns
Data hold after WrCS
t
56
CC
43 +
t
F
2TCL - 20
+
t
F
ns
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
Semiconductor Group
47
1998-05-01
C161RI
Figure 14-1
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Normal ALE
Data In
Data Out
Address
Address
t
38
t
44
t
10
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
14
t
46
t
12
t
48
t
10
t
22
t
23
t
44
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
54
t
52
t
56
Semiconductor Group
48
1998-05-01
C161RI
Figure 14-2
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Extended ALE
Data Out
Address
Data In
Address
t
38
t
44
t
10
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
14
t
46
t
12
t
48
t
10
t
22
t
23
t
44
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
54
t
52
t
56
Semiconductor Group
49
1998-05-01
C161RI
Figure 14-3
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Normal ALE
Data Out
Address
Address
Data In
t
38
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
15
t
47
t
13
t
49
t
22
t
23
t
13
t
49
t
9
t
43
t
43
t
9
t
11
t
45
t
11
t
45
t
50
t
51
t
54
t
52
t
56
Semiconductor Group
50
1998-05-01
C161RI
Figure 14-4
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Extended ALE
Data Out
Address
Data In
Address
t
38
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
15
t
47
t
13
t
49
t
22
t
23
t
13
t
49
t
9
t
43
t
43
t
9
t
11
t
45
t
11
t
45
t
50
t
51
t
54
t
52
t
56
Semiconductor Group
51
1998-05-01
C161RI
AC Characteristics
Demultiplexed Bus
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
C
L
= 100 pF
ALE cycle time = 4 TCL + 2
t
A
+
t
C
+
t
F
(125 ns at 16 MHz CPU clock without waitstates)
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
ALE high time
t
5
CC
21 +
t
A
TCL - 10 +
t
A
ns
Address setup to ALE
t
6
CC
15 +
t
A
TCL - 16 +
t
A
ns
ALE falling edge to RD,
WR (with RW-delay)
t
8
CC
21 +
t
A
TCL - 10
+
t
A
ns
ALE falling edge to RD,
WR (no RW-delay)
t
9
CC
10 +
t
A
10
+
t
A
ns
RD, WR low time
(with RW-delay)
t
12
CC
53 +
t
C
2TCL - 10
+
t
C
ns
RD, WR low time
(no RW-delay)
t
13
CC
84 +
t
C
3TCL - 10
+
t
C
ns
RD to valid data in
(with RW-delay)
t
14
SR
43 +
t
C
2TCL - 20
+
t
C
ns
RD to valid data in
(no RW-delay)
t
15
SR
74 +
t
C
3TCL - 20
+
t
C
ns
ALE low to valid data in
t
16
SR
74
+
t
A
+
t
C
3TCL - 20
+
t
A
+
t
C
ns
Address to valid data in
t
17
SR
95
+
2
t
A
+
t
C
4TCL - 30
+
2
t
A
+
t
C
ns
Data hold after RD
rising edge
t
18
SR
0
0
ns
Data float after RD rising
edge (with RW-delay
1)
)
t
20
SR
49 +
2
t
A
+
t
F
1)
2TCL - 14
+
2
t
A
+
t
F
1)
ns
Data float after RD rising
edge (no RW-delay
1)
)
t
21
SR
21 +
2
t
A
+
t
F
1)
TCL - 10
+
2
t
A
+
t
F
1)
ns
Data valid to WR
t
22
CC
43 +
t
C
2TCL - 20
+
t
C
ns
Data hold after WR
t
24
CC
21 +
t
F
TCL - 10 +
t
F
ns
ALE rising edge after RD,
WR
t
26
CC
10 +
t
F
10 +
t
F
ns
Semiconductor Group
52
1998-05-01
C161RI
1)
RW-delay and
t
A
refer to the next following bus cycle.
2)
It is guaranteed by design that read data are latched before the address changes.
Address hold after WR
2)
t
28
CC
0 +
t
F
0 +
t
F
ns
ALE falling edge to CS
t
38
CC
4 -
t
A
10 -
t
A
4 -
t
A
10 -
t
A
ns
CS low to Valid Data In
t
39
SR
74
+
t
C
+
2
t
A
3TCL - 20
+
t
C
+
2
t
A
ns
CS hold after RD, WR
t
41
CC
17 +
t
F
TCL - 14
+
t
F
ns
ALE falling edge to RdCS,
WrCS (with RW-delay)
t
42
CC
27 +
t
A
TCL - 4
+
t
A
ns
ALE falling edge to RdCS,
WrCS (no RW-delay)
t
43
CC
4 +
t
A
4
+
t
A
ns
RdCS to Valid Data In
(with RW-delay)
t
46
SR
39 +
t
C
2TCL - 24
+
t
C
ns
RdCS to Valid Data In
(no RW-delay)
t
47
SR
70 +
t
C
3TCL - 24
+
t
C
ns
RdCS, WrCS Low Time
(with RW-delay)
t
48
CC
53 +
t
C
2TCL - 10
+
t
C
ns
RdCS, WrCS Low Time
(no RW-delay)
t
49
CC
84 +
t
C
3TCL - 10
+
t
C
ns
Data valid to WrCS
t
50
CC
49 +
t
C
2TCL - 14
+
t
C
ns
Data hold after RdCS
t
51
SR
0
0
ns
Data float after RdCS
(with RW-delay)
t
53
SR
43 +
t
F
2TCL - 20
+
t
F
ns
Data float after RdCS
(no RW-delay)
t
68
SR
11 +
t
F
TCL - 20
+
t
F
ns
Address hold after
RdCS, WrCS
t
55
CC
10 +
t
F
10
+
t
F
ns
Data hold after WrCS
t
57
CC
17 +
t
F
TCL - 14
+
t
F
ns
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
Semiconductor Group
53
1998-05-01
C161RI
Figure 15-1
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Normal ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
BUS
(D15-D8)
D7-D0
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
20
t
14
t
46
t
12
t
48
t
22
t
24
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
55
t
53
t
57
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
Semiconductor Group
54
1998-05-01
C161RI
Figure 15-2
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Extended ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
20
t
14
t
46
t
12
t
48
t
22
t
24
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
55
t
53
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
Semiconductor Group
55
1998-05-01
C161RI
Figure 15-3
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Normal ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
21
t
15
t
47
t
13
t
49
t
22
t
24
t
13
t
49
t
9
t
43
t
43
t
9
t
50
t
51
t
55
t
68
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
Semiconductor Group
56
1998-05-01
C161RI
Figure 15-4
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Extended ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
21
t
15
t
47
t
13
t
49
t
22
t
24
t
13
t
49
t
9
t
43
t
43
t
9
t
50
t
51
t
55
t
68
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
Semiconductor Group
57
1998-05-01
C161RI
AC Characteristics
CLKOUT and READY
V
DD
= 4.5 - 5.5 V;
V
SS
= 0 V
T
A
= 0 to + 70
C
for SAB-C161RI
T
A
= 40 to + 85
C for SAF-C161RI
C
L
= 100 pF
Notes
1)
These timings are given for test purposes only, in order to assure recognition at a specific clock edge.
2)
Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even more time for deactivating READY.
The 2t
A
and
t
C
refer to the next following bus cycle,
t
F
refers to the current bus cycle.
Parameter
Symbol
Max. CPU Clock
= 16 MHz
Variable CPU Clock
1/2TCL = 1 to 16 MHz
Unit
min.
max.
min.
max.
CLKOUT cycle time
t
29
CC
62
62
2TCL
2TCL
ns
CLKOUT high time
t
30
CC
25
TCL 6
ns
CLKOUT low time
t
31
CC
21
TCL 10
ns
CLKOUT rise time
t
32
CC
4
4
ns
CLKOUT fall time
t
33
CC
4
4
ns
CLKOUT rising edge to
ALE falling edge
t
34
CC
0 +
t
A
10 +
t
A
0 +
t
A
10 +
t
A
ns
Synchronous READY
setup time to CLKOUT
t
35
SR
14
14
ns
Synchronous READY
hold time after CLKOUT
t
36
SR
4
4
ns
Asynchronous READY
low time
t
37
SR
76
2TCL + 14
ns
Asynchronous READY
setup time
1)
t
58
SR
14
14
ns
Asynchronous READY
hold time
1)
t
59
SR
4
4
ns
Async. READY hold time
after RD, WR high
(Demultiplexed Bus)
2)
t
60
SR
0
1
+ 2
t
A
+
t
C
+
t
F
2)
0
TCL - 30
+
2
t
A
+
t
C
+
t
F
2)
ns
Semiconductor Group
58
1998-05-01
C161RI
Figure 16
CLKOUT and READY
Notes
1)
Cycle as programmed, including MCTC waitstates (Example shows 0 MCTC WS).
2)
The leading edge of the respective command depends on RW-delay.
3)
READY sampled HIGH at this sampling point generates a READY controlled waitstate,
READY sampled LOW at this sampling point terminates the currently running bus cycle.
4)
READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or
WR).
5)
If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to CLKOUT
(eg. because CLKOUT is not enabled), it must fulfill
t
37
in order to be safely synchronized. This is guaranteed,
if READY is removed in reponse to the command (see Note
4)
).
6)
Multiplexed bus modes have a MUX waitstate added after a bus cycle, and an additional MTTC waitstate may
be inserted here.
For a multiplexed bus with MTTC waitstate this delay is 2 CLKOUT cycles, for a demultiplexed bus without
MTTC waitstate this delay is zero.
7)
The next external bus cycle may start here.
CLKOUT
ALE
t
30
t
34
Sync
READY
t
35
t
36
t
35
t
36
Async
READY
t
58
t
59
t
58
t
59
waitstate
READY
MUX/Tristate
6)
t
32
t
33
t
29
Running cycle
1)
t
31
t
37
3)
3)
5)
Command
RD, WR
t
60
4)
see
6)
2)
7)
3)
3)
Semiconductor Group
59
1998-05-01
C161RI
Package Outlines
Figure 17
Plastic Package, P-MQFP-100-2 (SMD)
(Plastic Metric Quad Flat Package)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
Dimensions in mm
SMD = Surface Mounted Device
Semiconductor Group
60
1998-05-01
C161RI
Package Outlines (cont'd)
Figure 18
Plastic Package, P-TQFP-100-1 (SMD)
(Plastic Thin Metric Quad Flat Package)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
Dimensions in mm
SMD = Surface Mounted Device