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ICs for Consumer Electronics
DDC-PLUS-Deflection Controller
SDA 9362
Data Sheet 1998-02-01
Edition 1998-02-01
This edition was realized using
the software system FrameMaker
Published by Siemens AG, Bereich
Halbleiter, Marketing-Kommunikation,
Balanstrae 73,
81541 Mnchen
Siemens AG 1998.
All Rights Reserved.
Attention please!
As far as patents or other rights of third
parties are concerned, liability is only
assumed for components, not for
applications, processes and circuits
implemented within components or
assemblies.
The information describes the type of
component and shall not be considered
as assured characteristics.
Terms of delivery and rights to change
design reserved.
For questions on technology, delivery
and prices please contact
the Semiconductor Group Offices in
Germany or the Siemens Companies and
Representatives worldwide
(see address list).
Due to technical requirements compo-
nents may contain dangerous substanc-
es. For information on the types in ques-
tion please contact your nearest
Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC man-
ufacturer.
Packing
Please use the recycling operators
known to you. We can also help you get
in touch with your nearest sales office. By
agreement we will take packing material
back, if it is sorted. You must bear the
costs of transport.
For packing material that is returned to us
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accept, we shall have to invoice you for
any costs incurred.
Components used in life-support de-
vices or systems must be expressly
authorized for such purpose!
Critical components
1
of the Semiconduc-
tor Group of Siemens AG, may only be
used in life-support devices or systems
2
with the express written approval of the
Semiconductor Group of Siemens AG.
1 A critical component is a component
used in a life-support device or system
whose failure can reasonably be
expected to cause the failure of that
life-support device or system, or to
affect its safety or effectiveness of that
device or system.
2 Life support devices or systems are
intended (a) to be implanted in the
human body, or (b) to support and/or
maintain and sustain human life. If
they fail, it is reasonable to assume
that the health of the user may be
endangered.
Data Classification
Maximum Ratings
Maximum ratings are absolute ratings; exceeding only one of these values may cause
irreversible damage to the integrated circuit.
Recommended Operating Conditions
Under this conditions the functions given in the circuit description are fulfilled. Nominal
conditions specify mean values expected over the production spread and are the
proposed values for interface and application. If not stated otherwise, nominal values will
apply at
T
A
=25C and the nominal supply voltage.
Characteristics
The listed characteristics are ensured over the operating range of the integrated circuit.
Edition 1998-02-01
Published by Siemens AG, Semiconductor Group
Copyright
Siemens AG 1998. All rights reserved.
Terms of delivery and right to change design reserved.
SDA 9362
Revision History:
Current Version: 1998-02-01
Previous Version:
1997-04-01
Page
(in previous
Version)
Page
(in current
Version)
Subjects (major changes since last revision)
30
32
Nom./max. average current and max. standby current specified
30
32
Specification of charge current pump of PLL pin LF is unnecessary
SDA 9362
Table of Contents
Page
Semiconductor Group
4
1998-02-01
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.4
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
System Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3
Reset Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4
Frequency Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5
IC-Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.1
IC-Bus Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.2
IC-Bus Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.3
IC-Bus Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.4
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.5.5
Explanation of Some Control Items . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.1
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.2
Characteristics (Assuming Recommended Operating Conditions) . . . . . . . 32
4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.1
VD- Output Voltage, 4/3-CRT and 16/9-Source . . . . . . . . . . . . . . . . . . . . . . 35
5.2
Function of H,V Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3
Power On/Off Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.4
Standby Mode, RESN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
P-MQFP-44-2
Semiconductor Group
5
1998-02-01
DDC-PLUS-Deflection Controller
SDA 9362
MOS
Type
Ordering Code
Package
SDA 9362
Q67101-H5173-A701
P-MQFP-44-2
1
Overview
1.1
Features
Deflection - Protection - 16:9 / 4:3
2
C Bus alignment of all deflection parameters
All EW-, V- and H-functions (incl.
2)
PW EHT compensation
PH EHT compensation
Compensation of H-phase deviation
(e.g. caused by white bar)
Upper/lower EW-corner correction separately adjustable
V-angle correction: Vertical frequent linear modulation of H-phase
V-bow correction: Vertical frequent parabolic modulation of H-phase
Three reduced V-scan modes (75 %, 66 %, 50 % V-size) selectable
H- and V-blanking time adjustable
Partial overscan adjustable to hide the cut off control measuring lines in the reduced
scan modes
Stop/start of vertical deflection adjustable to fill out the 16/9 screen with different
letterbox formats without annoying overscan
Dynamic PH EHT-compensation (white bar)
Self adaptation of V-frequency/number of lines per field between 192 and 680 for each
possible line frequency
Protection against EHT run away (X-rays protection)
Protection against missing V-deflection (CRT-protection)
Two digital outputs for general purpose, controlled by
2
C Bus
Selectable softstart of the H-output stage
P-MQFP-44-2 package
5 V supply voltage
SDA 9362
Semiconductor Group
6
1998-02-01
1.2
General Description
The SDA 9362 is a highly integrated deflection controller for CTV receivers with doubled
line and standard or doubled field frequencies. It controls among others an horizontal
driver circuit for a flyback line output stage, a DC coupled vertical sawtooth output stage
and an East-West raster correction circuit. All adjustable output parameters are
2
C Bus
controlled. Inputs are HSYNC, VSYNC and the line locked clock CLL.
1.3
Pin Configuration
Figure 1
UEP10259
TST4
11
1 2 3 4 5 6 7 8 9 10
33
12
44
32 31 30 29 28 27 26 25 24 23
43
13
42
14
41
15
40
16
39
17
38
18
37
19
36
20
35
21
34
22
HDEDEF
CLL
X2
SDA
V
DD(D)
SS(D)
V
X1
SCL
VBLE
HSYNC
SCP
E/W
V
DD(A)
V
REFP
REFN
V
SS(A)
V
IBEAM
SW2
DD(A)
V
HPROT
TST1
TST0
TEST
HD
SW1
REFH
V
REFL
V
SS(A)
V
DD(D)
V
V
SS(D)
TST7
SS(D)
V
LF
RESN
VPROT
VD+
VD-
VSYNC
2
SSD
TST5
TST6
V
DD(D)
SDA 9362
Semiconductor Group
7
1998-02-01
1.4
Pin Description
Pin No. Symbol
Type
Description
1
CLL
I/TTL
Clock input
2
X1
I
Reference oscillator input, crystal
3
X2
Q
Reference oscillator output, crystal
4
SDA
IQ
2
C-Bus data
5
SCL
I
2
C-Bus clock
6
HSYNC
I/TTL
H-sync input
7
VBLE
Q/TTL
Vertical blanking output
8
SCP
Q
Blanking signal with H- and color burst component
(V-component selectable by
2
C Bus)
9
V
DD(D)
S
Digital supply
10
V
SS(D)
S
Digital ground
11
VPROT
I
Watching external V-output stage
(input is the V-sawtooth from feedback resistor)
12
HPROT
I
Watching EHT (input is e.g. H-flyback)
13
V
DD(A)
S
Analog supply
14
SW2
Q/TTL
Output of an
2
C Bus controlled switch (Register 00
H
,
Bit D5)
15
IBEAM
I
Input for a beam current dependent signal for
stabilization of width, height and H-phase
16
V
SS(A)
S
Analog ground
17
V
REFN
IQ
Ground for
V
REFP
,
V
REFH
,
V
REFL
18
V
REFP
IQ
Reference voltage for IBEAM ADC, HPROT / VPROT
thresholds
19
V
DD(A)
S
Analog supply
20
E/W
Q
Control signal output for East-West raster correction
21
VD+
Q
Control signal output for DC coupled V-output stage
22
VD-
Q
Like VD+
23
V
SS(A)
S
Analog ground
24
V
REFL
IQ
Reference voltages for E/W-DAC, V-DAC
25
V
REFH
IQ
Like
V
REFL
26
2
I
Line flyback for H-delay compensation
SDA 9362
Semiconductor Group
8
1998-02-01
1.4
Pin Description (cont'd)
Pin No. Symbol
Type
Description
27
SW1
Q/TTL
Output of an
2
C Bus controlled switch (Register 00
H
,
Bit D3)
28
VSYNC
I/TTL
V-sync input
29
HD
Q
Control signal output for H driver stage
30
TEST
I/TTL
Switching normal operation (TEST = L) and test mode
(TEST = H: pin 34 is an additional test pin)
31
TST0
I
Test pin, to be grounded
32
TST1
I
Test pin, to be grounded
33
HDEDEF
I/TTL
Defines the default value of HDE
34
SSD
I/TTL
Disables soft start (H)
35
TST4
I
Test pin, to be grounded
36
TST5
O
Test pin, don't connect
37
TST6
O
Test pin, don't connect
38
V
DD(D)
S
Digital supply
39
V
SS(D)
S
Digital ground
40
TST7
O
Test pin, don't connect
41
V
SS(D)
S
Digital ground
42
LF
IQ
PLL loop filter
43
V
DD(D)
S
Digital supply
44
RESN
I/TTL
Reset input, active low
SDA 9362
Semiconductor Group
9
1998-02-01
1.5
Block Diagram
Figure 2
UEB10258
2
C
Protection
Start Up
Control
H-Out
V-Out
EW-Corr
PWM
D/A
PW/PH Corr
PLL
CLL
SCP SCAN HPROT SSD VPROT
2
SCL
SDA
RESN
HDEDEF
TEST
TST0
TST1
VSYNC
HSYNC
CLKI
LF
HD
E/W
PWM
D/A
ABL
REFN
V
REFP
V
REFH
V
REFL
V
REFC
V
X1 X2
VD+
VD-
SDA 9362
Semiconductor Group
10
1998-02-01
2
System Description
2.1
Functional Description
The main input signals are HSYNC with doubled horizontal frequency, VSYNC with
vertical frequencies of 50/100 Hz or 60/120 Hz and the line locked clock CLL.
The output signals control the horizontal as well as the vertical deflection stages and the
East-West raster correction circuit.
The H-output signal HD compensates the delays of the line output stage and its phase
can be modulated vertical frequent to remove horizontal distortions of vertical raster lines
(V-Bow, V-Angle). Time reference is the middle of the front and back edge of the line
flyback pulse. A positive HD pulse switches off the line output transistor. Maximal H-shift
is 2.25
s.
Picture tubes with 4:3 or 16:9 aspect ratio can be used by adapting the raster to the
aspect ratio of the source signal.
The V-output sawtooth signals VD- and VD+ controls a DC coupled output stage and can
be disabled. Suitable blanking signals are delivered by the IC.
The East-West output signal E/W is a vertical frequent parabola of 4th order, enabling
an additional corner correction, separately for the upper and lower part.
Two
2
C Bus controlled digital outputs are available for general purpose.
The picture width and picture height compensation (PW/PH Comp) processes the beam
current dependent input signal IBEAM with effect to the outputs E/W and VD to keep
width and height constant and independent of brightness.
The alignment parameter Horizontal Shift Compensation enables to adjust the influence
of the input signal IBEAM on the horizontal phase.
The selectable start up circuit controls the energy supply of the H-output stage during the
receiver's run up time by smooth decreasing the line output transistors switching
frequency down to the normal operating value (softstart). HD starts with about 55 kHz
and converges within 85 ms to its final value. The high time is kept constant. The normal
operating pulse ratio H/L is 45/55. A watch dog function limits the period of the HD output
signal independent of the clock CLL to max 35.2
s.
The protection circuit watches an EHT reference and the sawtooth of the vertical output
stage. H-output stage is switched off if the EHT succeeds a defined threshold or if the
V-deflection fails (refer to page 36). The function of this circuit is based on the internal
quartz oscillator and therefore independent of the input clock CLL.
HPROT:
Input
V
i
< V2
Continues blanking
V
i
> V1
HD disabled
V2
V
i
< V1
Operating range
SDA 9362
Semiconductor Group
11
1998-02-01
VPROT:
Vertical sawtooth voltage
V
i
< V1 in first half of V-period or
V
i
> V2 in second half: HD disabled
The pin SCP delivers the composite blanking signal SCP. It contains burst (
V
b
), H-
blanking HBL (
V
HBL
) and selectable V-blanking (control bit SSC). The phase of the H-
blanking period can be varied by
2
C Bus. For the timing following settings are possible:
BD = 1 :
t
BL
= 0
BD = 0, BSE = 0 (default value)
:
t
HBL
=
t
f
(H-flyback time)
BD = 0, BSE = 1(alignment range)
:
t
HBL
= (4
*
H-blanking-time + 1) / CLL
:
t
DBL
= (H-shift + 4
*
H-blanking-phase
-2
*
H-blanking-time + 43) / CLL
SSC = 0
:
t
BL
=
t
VBL
during V-blanking period
SSC = 1
:
t
BL
is always
t
HBL
Figure 3
BG-pulse width
t
B
54 / CLL
Delay to HSYNC
t
DB
36 / CLL
UED10260
Input Signal
HSYNC
B
t
DB
t
DBL
t
t
BL
OH
V
OHBL
V
OL
V
SDA 9362
Semiconductor Group
12
1998-02-01
2.2
Circuit Description
The system clock for the SDA 9362 has to be generated externally (e.g. in the
SDA 9206) and applied to pin CLL. Its frequency must be always the line frequency
(defined by the horizontal time reference HSYNC) multiplied by 864. If no HSYNC signal
is available an internal horizontal synchronisation signal is derived from CLL (CLL
divided by 879).
The input signal at VSYNC is the vertical time reference. It has to pass a window
avoiding too short or long V-periods in the case of distorted or missing VSYNC pulses.
The window allows a VSYNC pulse only after a minimum number of lines from its
predecessor and sets an artificial one after a maximum number of lines. The window size
is programmable by
2
C Bus.
The beam current dependent input signal IBEAM is A/D converted and then digitally
processed. The A/D Converter requires a clock frequency twice the frequency of CLL
which is generated by an internal analog PLL with an external loop filter at pin LF.
Values which influence shape and amplitude of the output signals are transmitted as
reduced binary values to the SDA 9362 via
2
C Bus. A CPU which is designed for speed
reasons in a pipe line structure calculates in consideration of feedback signals (e.g.
IBEAM) values which exactly represent the output signals. These values control after
D/A conversion the external deflection and raster correction circuits. The CPU firmware
is stored in an internal ROM.
SDA 9362
Semiconductor Group
13
1998-02-01
2.3
Reset Modes
The circuit is only completely reset at power-on/off (timing diagram refer 5.3). If the pin
RESN has L-level or during standby operation some parts of the circuit are not affected
(timing diagram refer 5.4):
Note: Power-On-Reset state is deactivated after ca. 32 cycles of the X1/X2 oscillator
clock. RESN = Low and standby state are deactivated after ca. 42 cycles of the
CLL clock.
2.4
Frequency Ranges
The allowed deviation of all input line frequencies is max. 4.5 %.
n
L
:
Number of lines per frame
I:
Interlaced
NI:
Non interlaced
1)
Inactive if HPROT < V2 (typ. 2.4 V)
2)
Can only be read after Power-On-Reset is finished
Power-On-Reset
External Reset
(pin RESN=0)
Standby Mode
(
I
2
C-Bit STDBY=1)
HD output
High
Active
Active
H-protection
Inactive
Active
Active
V-protection
Inactive
Active
1)
Active
1)
2
C Interface (SDA,
SCL)
Tristate
Ready
Ready
2
C Register
01
H
..1B
H
Set to default values Set to default values Set to default values
2
C Register
00
H
, 48
H
Set to default values Not affected
Not affected
Status bit PONRES
Set to 1
2)
Set to 1
Not affected
V
REFP
Not affected
Not affected
Not affected
V
REFH
,
V
REFL
Not affected
Not affected
Inactive
CPU
Inactive
Inactive
Inactive
H
V
n
L
31.25 kHz
50 Hz
100 Hz
625 NI / 1250I
625 I
31.5 kHz
60 Hz
120 Hz
525 NI / 1050 I
525 I
SDA 9362
Semiconductor Group
14
1998-02-01
If NSA = 0 (subaddress 01
H
/D5
H
) number of lines per field is selfadaptable between 192
and 680 for each specified H-frequency.
2.5
I
2
C-Bus Control
2.5.1
I
2
C-Bus Address
2.5.2
I
2
C-Bus Format
write:
read:
Reading starts at the last write address n. Specification of a subaddress in reading mode
is not possible.
S:
Start condition
A:
Acknowledge
P:
Stop condition
NA:
Not acknowledge
An automatical address increment function is implemented.
After switching on the IC, all bits are set to defined states (00
H
) (exception: HDE depends
on pin 33; see page 17)
1 0 0 0 1 1 0
S 1 0 0 0 1 1 0 0 A
Subaddress
A
Data Byte
A *****
A
P
S 1 0 0 0 1 1 0 1 A
Status byte
A
Data Byte n
A ***** NA P
SDA 9362
Semiconductor Group
15
1998-02-01
2.5.3
I
2
C-Bus Commands
1)
see 2.5.5: Explanation of some control items
Control Item
Sub
-
addr
. D7 D6 D5 D4 D3 D2 D1 D0 Allowed
Range
Effective
Range
Can be
Disabled
by Bit
Default
Value if
Disabled
Unit
Deflection control 0
00
H
see below
Deflection control 1
01
H
see below
Vertical shift
02
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical size
03
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical linearity
04
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical S-correction
05
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical EHT
compensation
1)
06
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Horizontal size
07
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Pin phase
08
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Pin amp
09
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Upper corner pin
correction
0A
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Lower corner pin
correction
0B
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Horizontal EHT
compensation
1)
0C
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Horizontal shift
0D
H
B6 B5 B4 B3 B2 B1 B0 X
-64..63
-64..63
1/CLL
Vertical angle
0E
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical bow
0F
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127 -128..127
Vertical blanking time
1)
10
H
X
B6 B5 B4 B3 B2 B1 B0
0..127
a)
BSE = 0
b)
lines
Horizontal blanking time 11
H
X
X
B5 B4 B3 B2 B1 B0
0..63
0..63
BSE = 0 H-flyback
4/CLL
Horizontal blanking
phase
12
H
B5 B4 B3 B2 B1 B0 X
X
-32..31
-32..31
4/CLL
Start vertical scan
1)
13
H
B7 B6 B5 B4 B3 B2 B1 B0 -128..127
c)
SSE = 0
9
line
Vertical scan width 0
1)
14
H
X
X
X
X
X
X
B9 B8
0..3
d)
STE = 0
e)
256 lines
Vertical scan width 1
1)
15
H
B7 B6 B5 B4 B3 B2 B1 B0
0..255
d)
STE = 0
e)
lines
Guard band
1)
16
H
X
X
B5 B4 B3 B2 B1 B0
0..63
0..63
GBE = 0
3
half lines
Start reduced scan
1)
17
H
X
X
B5 B4 B3 B2 B1 B0
0..63
0, 2..63
SRSE =
0
2
line
Vertical sync control
18
H
see below
Min..No. of lines / field
1)
19
H
B7 B6 B5 B4 B3 B2 B1 B0
0..255
0..255
2 lines
Max. No. of lines / field
1)
1A
H
B7 B6 B5 B4 B3 B2 B1 B0
0..255
0..255
2 lines
AFC EHT
compensation
1)
1B
H
B5 B4 B3 B2 B1 B0 X
X
-32..31
-32..31
Internal voltage Ref
control
48
H
see below
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16
1998-02-01
a) The effective range for Vertical Blanking Time:
16 ... 127 (absolute value)
if STE = 0
0 ... 127 (offset value)
if STE = 1.
b) The "default value if disabled" for Vertical Blanking Time:
21 (absolute value)
if STE = 0
8 (offset value)
if STE = 1.
c) The effective range for Start Vertical Scan:
2 ... 127 (absolute value)
if STE = 0
if STE = 1 and NSA = 1
-128 ... 127 (offset value)
if STE = 1 and NSA = 0.
d) The effective range for Vertical Scan (total width: 10 Bit): 160 ... 684 lines.
e) The "default value if disabled" for Vertical Scan equals the number of lines of the
source signal reduced by the control value for Start Vertical Scan. (E.g.: input signal:
262 lines per field; Start vertical scan = 8 lines; then (if SSE = 1, STE = 0) vertical
scan = 262 - 8 = 254 lines.
At power on the RAM containing the control items is cleared. Therefore all data are zero
by default before transferring individual values via
2
C Bus.
Allowed values out of the effective range are limited, e. g. Vertical blanking time = 3 is
limited to 16 if STE = 0 (that means a minimum of 16 lines is blanked).
There are five bits (SRSE, BSE, SSE, STE, GBE) in the deflection control byte 1 for
disabling some control items. If one of these bits is "0", the value of the corresponding
control item will be ignored and replaced by the value "default value if disabled" in the
table above.
2.5.4
Detailed Description
The Deflection Control Byte 0 includes the following bits:
VOFF:
Vertical off
0:
normal vertical output due to control items
1:
vertical saw-tooth is switched off,
vertical protection is disabled
STDBY:
Stand-by mode
0:
normal operation
1:
stand-by mode (all internal clocks are disabled)
VOFF
STDBY
SW2
BD
SW1
VR1
VR0
HDE
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SW2:
Setting of output SW2
0:
output SW2 has L-level
1:
output SW2 has H-level
BD:
Blanking disable
0:
horizontal and vertical blanking enabled
1:
horizontal and vertical blanking disabled
SW1:
Setting of output SW1
0:
output SW1 has L-level
1:
output SW1 has H-level
VR1 ... VR0:
Reduction of vertical size
00: 100 % V-size
(16:9 source on 16:9 display)
01: 75 % V-size
(16:9 source on 4:3 display)
10: 66 % V-size
(two 4:3 sources on 16:9 display)
11: 50 % V-size
(two 16:9 sources on 16:9 display)
HDE:
HD enable
0:
line is switched off (HD disabled, that is H-level)
1:
line is switched on (HD enabled)
Default value depends on pin 33 (HDEDEF):
HDEDEF = Low: 0
HDEDEF = High: 1
The Deflection Control Byte 1 includes the following bits:
VDC:
Vertical dynamic compensation
0:
influence of the beam current input IBEAM on the
vertical sawtooth is static (zooming correction)
1:
influence of the beam current input IBEAM on the
vertical sawtooth is dynamic (ripple correction)
X
VDC
NSA
STE
GBE
SRSE
SSE
BSE
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NSA:
No self adaptation
0:
self adaptation on
1:
self adaptation off
STE:
Scan time enable
0:
control items for vertical scan width 0 and width 1 are disabled
1:
control items for vertical scan width 0 and width 1 are enabled
GBE:
Guard band enable
0:
control item for guard band is disabled
1:
control item for guard band is enabled
SRSE:
Start reduced scan enable
0:
control item for start reduced scan is disabled
1:
control item for start reduced scan is enabled
SSE:
Start scan enable
0:
control item for start vertical scan is disabled
1:
control item for start vertical scan is enabled
BSE:
Blanking select enable
0:
control items for blanking times are disabled
1:
control items for blanking times are enabled
The Vertical Sync Control Byte includes the following bits:
VBLE:
Vertical blanking extension
(this bit does not change the VBL component at output SCP, only the
trailing edge of VBLE is affected)
0:
output VBLE has the same timing as VBL component at SCP
1:
output VBLE is 6 lines longer than VBL component at SCP
SSC:
Sandcastle without VBL
0:
output SCP with VBL component
1:
output SCP without VBL component
X
VBLE
SSC
X
NI
X
X
X
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NI:
Non interlace
0:
interlace depends on source
1:
no interlace
The Internal Voltage Ref Control Byte includes the following bits:
BANDG5 ...
Adjustment of internal bandgap reference
BANDG0:100000: Reference Output voltage min
:
011111: Reference Output voltage max
Typical adjustment range is 1 V.
BANDGOFF: Bandgap off
0:
V
REFH
,
V
REFL
derived internally from
V
REFP
1:
external references on
V
REFP
,
V
REFH
,
V
REFL
have to be applied
(in this case BANDG4OFF must be = 1)
BANDG4OFF: Bandgap 4 V off
0:
internal bandgap reference is used for
V
REFP
1:
external reference on
V
REFP
(4 V) has to be applied
The Status Byte includes the following bits
HPON:
H-protection on
0:
normal operation of the line output stage
1:
high level on input HPROT has switched off the line
VPON:
V-protection on
0:
normal operation of the vertical output stage
1:
incorrect signal on input VPROT has switched off the line
BANDG5 BANDG4 BANDG3 BANDG2 BANDG1 BANDG0
BANDG
OFF
BANDG4
OFF
HPON
VPON
PONRES
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PONRES:
Power On Reset
0:
after bus master has read the status byte
1:
after each detected reset
Note: PONRES is reset after this byte has been read.
2.5.5
Explanation of Some Control Items
Start Vertical Scan
If enabled (SSE = 1) this control item defines the start of calculation of the vertical
sawtooth, the east/west parabola and the vertical function required for the vertical
modulated output HD.
Vertical Scan (width0 and width1)
The total width of this control item is 10 Bit. Therefore two (width0 and width1) registers
are necessary. If enabled (STE = 1) it defines the duration of the vertical scan. When the
vertical period has more lines than the sum of Start Vertical Scan and Vertical Scan,
the calculation of the vertical sawtooth, the east/west parabola and the vertical parabola
required for HD stops so that the corresponding output signals remain unchanged till the
next vertical synchron pulse.
Guard Band
This control item is useful for optimizing self adaptation. Video signals with different
number of lines in consecutive fields (e. g. VCR search mode) must not start the
procedure of self adaptation. But switching between different TV standards has to
change the slope of the vertical sawtooth getting always the same amplitude (self
adaptation).
To avoid problems with flicker free TV systems which have alternating number of lines
per field an average value of four consecutive fields is calculated. If the deviation of these
average values (e.g. PAL: 312.5 lines or 625 half lines) is less or equals Guard Band,
no adaptation takes place. When it exceeds Guard Band, the vertical slope will be
changed.
Start Reduced Scan
If enabled (SRSE = 1) this item defines the start of the D/A-conversion of the calculated
vertical sawtooth. From begin of the vertical flyback to the line defined by Start Reduced
Scan
the output signals VD+, VD- remain unchanged (flyback level). Other outputs are
not affected.
a) control bits VR1, VR0 # 00 (reduction of vertical size)
In this case the byte is useful for e.g. displaying 16/9 source format on 4/3 picture
tubes without visible RGB lines generated of the automatic cut-off control (partial
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overscan). It defines the start of the reduced amplitude (factors 0.5, 0.66, 0.75) of the
vertical sawtooth (refer page 35). When Start Reduced Scan = 0 the reduction
takes place over all lines including vertical flyback.
b) control bits VR1, VR0 = 00 (no reduction of vertical size)
If Start Reduced Scan > Start Vertical Scan the D/A conversion of the sawtooth
starts (Start Reduced Scan - Start Vertical Scan) lines after begin of the
calculation.
This causes a jump of the output voltage VD+, VD- from flyback to scan level. It may
be useful to hide the automatic cut-off control lines if no overscan is desired (e.g. for
VGA display). If Start Reduced Scan <= Start Vertical Scan this byte has no effect.
Vertical EHT Compensation
This item controls the influence of the beam current dependent input signal IBEAM on
the outputs VD+ and VD- according to the following equation
V
VDPP
:
variation of VD+ and VD- peak-to-peak voltage
V
IBEAM
:
variation of IBEAM input voltage
1)
the factor 0.57 depends on
V
REFP
,
V
REFH
,
V
REFL
If Vertical EHT Compensation = -128 the outputs VD+ and VD- are
independent of the input signal IBEAM.
Horizontal EHT Compensation
This item controls the influence of the input signal IBEAM on the output E/W according
to the following equation:
V
EW
:
variation of E/W output voltage
V
IBEAM
:
variation of IBEAM input voltage
1)
the factor 2.12 depends on
V
REFP
,
V
REFH
,
V
REFL
If Horizontal EHT Compensation = -128 the output E/W is independent
of the input signal IBEAM.
AFC EHT Compensation
Deviation of the horizontal phase caused by high beam current (e.g. white bar) can be
eliminated by this control item. The beam current dependent input signal IBEAM is
multiplied by AFC EHT Compensation.
V
VDPP
V
IBEAM
*
Vertical EHT compensation
128
+
512
----------------------------------------------------------------------------------------- * 0,57
1
)
=
V
EW
V
IBEAM
*
Horizontal EHT compensation
128
+
128
--------------------------------------------------------------------------------------------------- * 2,12
1
)
=
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Additional to the control items Vertical angle, Vertical bow and Horizontal shift, this
product influences the horizontal phase at the output HD according to the following
equation:
:
variation of horizontal phase at the output HD
(positive values: shift left, negatives values: shift right)
V
IBEAM
:
variation of IBEAM input voltage (units: Volt)
CLL:
864
*
f
H
1)
the factor 52 depends on
V
REFP
Vertical Blanking Time (VBT)
VBT defines the vertical blanking pulse VBL which is part of the output signal SCP. VBL
is synchronized with the leading edge of HSYNC. It always starts and stops at the
beginning of line and never in the center.
a) Case of STE = 0
In this case the control item Vertical blanking time defines the duration of the
V-blanking pulse (VBL) exactly in number of lines. Because of IC internal limitations
16 through 127 lines can be blanked. If BSE = 0 the control item Vertical blanking
time is disabled and always 21 lines (default value if disabled) are blank.
After power on the control bit BSE is 0. Therefore 21 lines will be blanked before any
programming of the IC. If Vertical Blanking Time is less or equals 21 lines, VBL
starts (point A in fig. above) always 0 ... 0.5 line (new odd field) or 0.5 ... 1 line (new
even field) prior to the vertical flyback. Otherwise VBL is concentric to a fictitious
vertical flyback period of 21 lines, that means VBL starts (VBT - 21) / 2 lines at the
end of an odd field or (VBT - 20) / 2 at the end of an even field prior to point A.
Possible start points are only the beginning of line.
V
IBEAM
*
AFC EHT compensation
64
---------------------------------------------------------------- *
52
1
)
CLL
-----------
=
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Figure 4
Vertical Blanking Pulse VBL when STE = 0 and Number of Lines per Field = Constant
UED10261
1
~ ~
2
14
15
16
17
18
19
20
21
22
23
24
25
HSYNC
~ ~
VSYNC
VD-
VBL
(BSE = 0)
(BSE = 1,
VBL
VBT = 16)
(BSE = 1,
VBT = 25)
VBL
VBT = 26)
(BSE = 1,
VBL
1 Line
Start of even Field
Start of odd Field
21 Lines
16 Lines
2 Lines
25 Lines
3 Lines
26 Lines
A
~~
~~
~~
~~
~~
2 Lines
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b)
Case of STE = 1
In this case the control item Vertical blanking time is an extension for the V-blanking
pulse.
- If BSE = 1 and VBT = 0 the V-blanking pulse has its minimum: it starts always at
end of scan (line B in Fig. below) and ends at start of scan (line C) defined by the
control items Start Vertical Scan (if SSE = 1) and Vertical Scan.
- BSE = 1 and (128 > VBT > 0) extend the V-blanking pulse according to the
following
relationship
(If VBT > 127 this value is ignored and replaced by VBT - 128):
VBL starts VBT / 2 lines (even field) respectively (VBT + 1) / 2 lines (odd field)
prior to line B.
VBL ends (VBT + 1) / 2 lines (even field) respectively VBT / 2 lines (odd field) after
end of line C.
Possible start points are only the beginning of line.
- If BSE = 0 (after power on) the control item Vertical Blanking Time is disabled
and VBL starts 4 lines prior to end of scan (line B) and ends 4 lines after start of scan
(line C).
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Figure 5
Vertical blanking pulse VBL when STE = 1
UED10262
~ ~
B
1
2
3
C
HSYNC
~ ~
VSYNC
VD-
VBL
(BSE = 0)
(BSE = 1,
VBL
VBT = 0)
VBT = 7)
(BSE = 1,
VBL
1 Line
Start of even Field
Start of odd Field
3 Lines
~~
~~
~~
~~
~ ~
~~
~ ~
~ ~
~ ~
4 Lines
3 Lines
4 Lines
Even
B
C
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Minimum Number of Lines per Field
It defines the minimum number of lines per field for the vertical synchronisation. If the TV
standard at the inputs VSYNC and HSYNC has less lines per field than defined by
Minimum Number of Lines per Field no synchronisation is possible. The relationship
between Minimum Number of Lines per Field and the minimum number of lines is
given in the following table:
Maximum Number of Lines per Field
It defines the maximum number of lines per field for the vertical synchronisation. If the
TV standard at the inputs VSYNC and HSYNC has more lines per field than defined by
Maximum Number of Lines per Field no synchronisation is possible. The relationship
between Maximum Number of Lines per Field and the maximum number of lines is
given in the following table:
Minimum Number of Lines per Field
Minimum Number of Lines per Field
0
192
1
194
...
...
127
446
128
448
...
...
254
700
255
702
Maximum Number of Lines per Field
Maximum Number of Lines per Field
0
702
1
192
2
194
...
...
127
444
128
446
...
...
255
700
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Most Important V-Deflection Modes for 4:3 CRT
Mode
Description
Characteristics
Notes
VR1
VR0
NSA SRSE GBE STE SSE
N0 Normal mode
(for 4:3 source,
Letterbox)
with default
settings
Self adaptation
scan start = line 9
start of V-ramp = line 9
scan time: depends on source signal
guard band = 1.5 lines
Mode after
power on
00
0
0
0
0
0
N1 Normal mode
(for 4:3 source,
Letterbox)
with user
defined
values
Self adaptation
scan start = Start Vertical Scan
if (Start Reduced Scan>Start Vertical Scan)
start of V-ramp = Start Reduced Scan
else
start of V-ramp = Start Vertical Scan
scan time: depends on source signal
guard band = Guard Band/2 [lines]
Start of scan
adjustable
start of
V-ramp
adjustable
guard band
adjustable
00
0
1
1
0
1
S0 Shrink mode
75% (for 16:9
source)
with default
settings
Self adaptation
scan start = line 9
start of reduced V-ramp = line 9
scan time: depends on source signal
guard band = 1.5 lines
01
0
0
0
0
0
S1 Shrink mode
75% (for 16:9
source)
with user
defined
values
Self adaptation
scan start = Start Vertical Scan
if (Start Reduced Scan>Start Vertical Scan)
start of reduced V-ramp =
Start Reduced Scan
else
start of reduced V-ramp =
Start Vertical Scan
scan time: depends on source signal
guard band = Guard Band/2 [lines]
Start of scan
adjustable
start of
reduced
V-ramp
adjustable
guard band
adjustable
01
0
1
1
0
1
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Most Important V-Deflection Modes for 16:9 CRT
Mode
Description
Characteristics
Notes
VR1
VR0
NSA SRSE GBE STE SSE
N0 Normal mode
(for 16:9 or
4:3 source) with
default settings
Self adaptation
scan start = line 9
start of V-ramp = line 9
scan time: depends on source signal
guard band = 1.5 lines
Mode after
power on
00
0
0
0
0
0
N1 Normal mode
(for 16:9 or
4:3 source) with
user defined
values
Self adaptation
scan start = Start Vertical Scan
if (Start reduced scan > Start vertical scan)
start of V-ramp = Start reduced scan
else
start of V-ramp = Start vertical scan
scan time: depends on source signal
guard band = Guard Band/2 [lines]
Start of scan
adjustable
start of
V-ramp
adjustable
guard band
adjustable
00
0
1
1
0
1
Z Zoom mode
(for 4:3 source,
Letterbox)
Scan start =
(number_of_lines - Vertical Scan)/2 +8
scan time = Vertical Scan
Vertical
scan
controls
zoom factor
00
0
X
X
1
0
SC Scroll mode
(for 4:3 source,
Letterbox)
Scan start =
(number_of_lines - Vertical Scan)/2 +8 +
Start vertical scan
scan time = Vertical Scan
Like above;
start
vertical scan
can be
additionally
used for
adjustment
of picture
phase
00
0
X
X
1
1
M Manual mode
(for 4:3 source,
Letterbox)
Scan start = Start Vertical Scan
scan time = Vertical Scan
Scan start
and scan
time are
separately
adjustable
00
1
X
X
1
X
S2 Shrink mode
66% (for two
4:3 sources)
with default
settings
Self adaptation
scan start = line 9
start of reduced V-ramp = line 9
scan time: depends on source signal
guard band =1.5 lines
10
0
0
0
0
0
S3 Shrink mode
50% (for two
16:9 sources)
with default
settings
Self adaptation
scan start = line 9
start of reduced V-ramp = line 9
scan time: depends on source signal
guard band = 1.5 lines
11
0
0
0
0
0
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3
Absolute Maximum Ratings
Note: Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions or at any other condition
beyond those indicated in the operational sections of this specification is
not implied.
1)
Between any internally non-connected supply pin of the same kind.
All
V
DD(D)
- and
V
DD(A)
- Pins are connected internally by about 3
The
V
SS(D)
- Pins are connected internally by about 3
Parameter
Symbol
Limit Values
Unit
Remark
min.
max.
Operating temperature
T
A
-20
70
C
Storage temperature
T
stg
-40
125
C
Junction temperature
T
j
125
C
Soldering temperature
T
S
260
C
Input voltage
V
I
V
SS
- 0.3 V
V
DD
+ 0.3 V
Output voltage
V
Q
V
SS
- 0.3 V
V
DD
+ 0.3 V
Supply voltages
V
DD
-0.3
6
V
Supply total voltage
differentials
-0.25
0.25
V
1)
Total power dissipation
P
tot
0.85
W
Latch-up protection
-100
100
mA
All inputs/outputs
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3.1
Recommended Operating Conditions
Parameter
Symbol
Limit Values
Unit
Remark
min.
nom.
max.
Supply voltages
V
DD
4.5
5
5.5
V
Ambient temperature
T
A
-20
25
70
C
For analog
parameters 0C
TTL Inputs: CLL, HSYNC, VSYNC, TEST, SSD, HDEDEF, RESN
H-input voltage
V
IH
2.0
V
DD
V
L-input voltage
V
IL
0
0.8
V
Input VPROT
Threshold V1
1.4
1.5
1.6
V
V
REFP
= 4 V
Threshold V2
0.9
1.0
1.1
V
V
REFP
= 4 V
Input HPROT
Threshold V1
3.9
4
4.1
V
V
REFP
= 4 V
Threshold V2
2.1
2.4
2.7
V
V
REFP
= 4 V
Input IBEAM
L-input voltage
V
IL
2
V
V
REFP
= 4 V
Full range input
voltage
3
V
V
REFP
= 4 V
Reference Voltage Input Pins (Internal Voltage Ref Control Byte Reg 48
H
= 00000011)
V
REFP
input voltage
V
VREFP
4
V
V
REFH
input voltage
V
VREFH
2.5
V
V
REFL
input voltage
V
VREFL
1.2
V
V
REFN
input voltage
V
VREFN
0
V
Input
2
L-input voltage
V
IL
0
0.7
V
V
REFP
= 4 V
H-input voltage
V
IH
2.0
V
DD
V
V
REFP
= 4 V
Input HSYNC
Pulse width high
100
20000 ns
Setup time
t
SU
7
ns
Hold time
t
H
6
ns
Input capacitance
C
I
10
pF
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3.1
Recommended Operating Conditions (cont'd)
Parameter
Symbol
Limit Values
Unit
Remark
min.
nom.
max.
Input VSYNC
Pulse width high
100
100/
f
H
ns
NI = 0
Pulse width high
1.5/
f
H
100/
f
H
NI = 1
Input capacitance
C
I
10
pF
Input CLL
Input frequency
f
I
25
27
30
MHz
Input capacitance
C
I
10
pF
Quartz Oscillator Input / Output X1, X2
Crystal frequency
12
MHz
Fundamental crystal
type
Crystal resonant
impedance
25
External capacitance
27
pF
See application
information
I
2
C Bus (All Values are Referred to min.(
V
IH
) and max.(
V
IL
))
H-input voltage
V
IH
3
V
DD
V
L-input voltage
V
IL
0
1.5
V
SCL clock frequency
f
SCL
0
400
kHz
Rise times of SCL,
SDA
t
R
0.3
s
f
SCL
= 400 kHz
Fall times of SCL,
SDA
t
F
0.3
s
Set-up time DATA
t
SU;DA
100
ns
Hold time DATA
t
HD;DA
0
ns
Load capacitance
C
L
400
pF
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3.2
Characteristics (Assuming Recommended Operating Conditions)
Parameter
Symbol
Limit Values
Unit
Remark
min.
nom.
max.
Average supply
current
I
CC
50
100
mA
Standby supply
current
25
mA
Output Pins: VBLE, SW1, SW2
Output low level
V
OL
0.4
V
I
O
= 1 mA
Output high level
V
OH
2.8
V
I
O
= -1 mA
Input / Output SDA
Output low level
V
OL
0.6
V
I
O
= 6 mA
Output SCP
Output low level
V
OL
0
1
V
I
O
= 1 mA
Output HBL level
V
OHBL
V
DD
/ 2
-0.4 V
V
DD
/ 2
V
DD
/ 2
+0.4 V
|
I
O
| = 100
A
Output high level
V
OH
4.0
V
DD
V
I
O
= -1 mA
DAC Output E/W
DAC resolution
10
Bit
Linear range:
100 ... 900
DAC output low
1.45
V
Input data = 100
1)
DAC output high
3.48
V
Input data = 900
1)
Load capacitance
C
L
30
pF
Output load
20
k
Zero error
-2 %
2 %
DAC output
voltage = 2.5 V
2)
Gain error
-5 %
5 %
2)
INL
-0.2 %
0.2 %
2)
DNL
-0.1 %
0.1 %
2)
1)
V
REFH
= 2.5 V,
V
REFL
= 1.2 V
2)
V
REFH
= 2.5 V,
V
REFL
= 1.2 V, Input range = 100 ... 900
SDA 9362
Semiconductor Group
33
1998-02-01
3.2
Characteristics (Assuming Recommended Operating Conditions) (cont'd)
Parameter
Symbol
Limit Values
Unit
Remark
min.
nom.
max.
DAC Output VD+, VD-
DAC resolution
14
Bit
Linear range:
1500 ... 15000
DAC output low (VD-)
1.44
V
Input data = 1500
1)
DAC output high (VD-)
3.58
V
Input data = 15000
1)
DAC output low
(VD-) - (VD+)
-2.12
V
Input data = 1500
1)
DAC output high
(VD-) - (VD+)
2.16
V
Input data = 15000
1)
Load capacitance
C
L
30
pF
Output load
20
k
Zero error
-1 %
1 %
(VD-) - (VD+) = 0 V
2)
Gain error
-5 %
5 %
2)
INL
-0.5 %
0.5 %
2)
DNL
Monotonous
Guar. by design
1)
V
REFH
= 2.5 V,
V
REFL
= 1.2 V
2)
V
REFH
= 2.5 V,
V
REFL
= 1.2 V, Input range = 1500 ... 15000
Reference Output
V
REFP
(Adjust. by Reg 48
H
, Bit D7 ... D2) (Reg 48
H
, Bit D1 = 0, Bit D0 = 0)
Output voltage min
4.0
V
Bit D7 ... D2 = 100000
Output voltage max
4.0
V
Bit D7 ... D2 = 011111
Output current
I
Q
-50
0
A
Reference Output
V
REFH
(Reg 48
H
, Bit D1 = 0)
Output voltage
V
Q
2.4
2.5
2.6
V
V
REFP
= 4 V
Reference Output
V
REFL
(Reg 48
H
, Bit D1 = 0)
Output voltage
V
Q
1.1
1.2
1.3
V
V
REFP
= 4 V
Output HD
Output low level
V
OL
0
1
V
I
O
= 8 mA
Output high level
V
OH
V
DD
-1 V
V
DD
I
O
= -8 mA
SDA 9362
Semiconductor Group
34
1998-02-01
4
Application Information
Figure 6
UES10263
Source Sel
Synch Sep
NVM
TV Contr.
SDA 9362
2
C
24.576
MHz
27 pF
27 pF
X1
X2
VSYNC
HSYNC
LF
+
H-Coil
V
B
EHT
ABL
HD
E/W
+
V-Coil
VPROT
VD-
VD+
SCP
SCAN
VPROT
HPROT
2
+
_
RESN
PWM
D/A
ABL
SDA 9362
Semiconductor Group
35
1998-02-01
5
Waveforms
5.1
VD- Output Voltage, 4/3-CRT and 16/9-Source
Figure 7
UED10264
VD-
V
0(max)
V
0(min)
V
(Line No.)
z
n
SRS
2
63
0
1
2
V
V
16/9
2
1
4/3 =
V
V
2
1
V
V 16/9
0.75
SRSE = 1
Start Reduced Scan (SRS) selectable (line 0, 2...63)
SDA 9362
Semiconductor Group
36
1998-02-01
5.2
Function of H,V Protection
t
0
= 2 /
f
v
... 3 /
f
v
t
1
= 64 /
f
v
... 128 /
f
v
t
2
= 1 /
f
v
... 2 /
f
v
1)
Depends on
2
C-control items
2)
HPON or VPON = 1:HD = 0(OFF)
HPROT
VPROT
Mode
SCP
HPON
2)
I
2
C Bus
VPON
2)
I
2
C Bus
1
Start up
Continuous
blanking
0
0
2
H, V
operation
1)
0
0
3
EHT over-
voltage
Continuous
blanking
after
t
2
1
after
t
2
0
4
H operation
V short
failure
Continuous
blanking
after
t
0
if
SSC = 0
0
0
5
V longer
failure
H off
after
t
1
Continuous
blanking
after
t
0
if
SSC = 0
0
1
after
t
1
6
EHT
short over-
voltage
Continuous
blanking
after
t
2
1
after
t
2
1
after
t
1
V1
V2
or
V1
V2
or
or
0
t
1
t
t
_
<
<
or
or
1
t
t <
or
1
t
t <
SDA 9362
Semiconductor Group
37
1998-02-01
5.3
Power On/Off Diagram
Figure 8
REFH
V
,
Programmable
~ 42 Cycles
For low FH-range this time has to be multiplied by 2
Power On
1)
Default
C Reg.
Active
Inactive
CPU
H
CLL
01
H
1C
...
H
1F
,
Active
Inactive
,
44
48
2
H
...
C Reg.
00
H
2
1D
,
H
H
1E ,
H
Protection
REFL
V
De-
fault
Glitch
Power Off
Programmable
~ 42 Cycles
Default
Programmable
fault
De-
Programmable
fault
De-
fault
De-
SSD = 0: ~ 250
SSD = 1: ~ 380
C Registers 01
Tristate
REFP
V
,
C Bus
2
HD
2
X1, X2
On-
Reset
Power-
Cycles
32
Supply
Voltage
SSD = 0: ~ 250
SSD = 1: ~ 380
s
1)
1F
Programmable
Ready
1C
...
H
,
H
Tri-
state
H
1)
s
Cycles
32
s
1)
H
Programmable
Ready
C Registers 01
2
H
...1C
Tristate
H
1F
,
s
1)
UET10275
SDA 9362
Semiconductor Group
38
1998-02-01
5.4
Standby Mode, RESN Diagram
Figure 9
For low FH-range this time has to be multiplied by 2
1)
H
1E
,
H
,
H
...
44
H
48
C Reg.
00
2
1D
H
...
C Reg.
01
H
2
1C
H
1F
,
H
Active
Standby Mode
Programmable
Default Values
Ready
Programmable
Inactive
2
C Bus
Protection
Default Values
External Reset
Default
Values
Programmable
Tristate
Programmable
UET10276
Programmable
Ready
Free Run
2-Loop
HD
Inactive
Active
Inactive
Active
CPU
REFP
V
REFL
REFH
V
V
,
,
RESN
Standby
Cycles
32 x 1
2-Loop
~ 42 CLL Cycles
Run
~ 42 CLL Cycles
SSD = 1: ~ 380
SSD = 0: ~ 250
1)
s
Free
1)
s
SDA 9362
Semiconductor Group
39
1998-02-01
6
Package Outlines
Figure 10
Index Marking
Does not include plastic or metal protrusions of 0.25 max per side
GPM05622
0.8
0.3 +0.15
8
C
0.1
0.2
M
A-B D C 44x
0.25 min.
2
+0.1
-0.05
2.45 max.
D
10
1)
D
A-B
0.2
H 4x
13.2
D
A-B
0.2
44x
B
1)
10
13.2
A
44
1
0.6 x 45
H
0.88 0.15
+0.08
-0.02
0.15
7 max.
1)
P-MQFP-44-2
(Plastic Metric Quad Flat Package)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
SMD = Surface Mounted Device
Dimensions in mm