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Электронный компонент: XD010-24S

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Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without
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for use in life-support devices and/or systems.
Copyright 2003 Sirenza Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
1
EDS-102932 Rev B
Prelimi nary
The XD010-24S-D2F 10W power module is a
2-stage Class A/AB amplifier module for use in
the driver stages of CDMA RF power amplifi-
ers. The power transistors are fabricated using
Sirenza's latest, high performance LDMOS
process. This unit operates from a single volt-
age and has internal temperature compensa-
tion of the bias voltage to ensure consistant
performance over the full temperature range.
Key Specifications
Parameter
Description: Test Conditions
Z
in
= Z
out
= 50
, V
DD
= 28.0V, I
DD1
= 230mA,
I
DD2
= 150mA, T
Flange
= 25C
Unit
Min.
Typ.
Max.
Frequency
Frequency of Operation
MHz
1930
1990
P
1dB
Output Power at 1dB Compression
W
10
Gain
Gain at 1W Output Power
dB
28
Gain Flatness
Peak to Peak Gain Variation, 1930-1990MHz
dB
0.4
IRL
Input Return Loss 1W Output Power, 1930-1990MHz
dB
14
Efficiency
Drain Efficiency at 10W CW output
%
26
Drain Efficiency at 2W CDMA (Single Carrier IS-95)
%
12
Drain Efficiency at 1W CDMA (Single Carrier IS-95)
%
6.5
Linearity
ACPR at 1W CDMA Power Output (Single Carrier IS-95)
dB
-58
ALT-1 at 2W CDMA (Single Carrier IS-95)
dB
-70
3
rd
Order IMD at 10W PEP (Two Tone; 1MHz)
dBc
-32
Delay
Signal Delay from Pin 1 to Pin 5
nS
2.9
Phase Linearity
Deviation from Linear Phase (Peak to Peak)
Deg
0.5
R
TH, j-l
Thermal Resistance Stage 1 (Junction to Case)
C/W
11
R
TH, j-2
Thermal Resistance Stage 2 (Junction to Case)
C/W
4
Functional Block Diagram
XD010-24S-D2F
1930-1990 MHz Class A/AB
10W CDMA Driver Amplifier
Product Features
Applications
50 W RF impedance
10W Output P
1dB
Single Voltage Operation
High Gain: 28 dB Typical
High Efficiency
Advanced, XeMOS LDMOS II FETS
Temperature Compensation
Base Station PA driver
Repeater
CDMA
GSM / EDGE
Product Description
Case Flange = Ground
Temperature
Compensation
28 V
1
RF in
2
DC
Stage 1
RF out
4
3
28 V
DC
Temperature
Compensation
5
Stage 2
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
2
EDS-102932 Rev B
Preliminary
XD010-24S-D2F 1930-1990 MHz 10W
Pin Out Description
Pin #
Function
Description
1
RF Input
Module RF input. Care must be taken to protect against video transients that may damage the active devices.
2
V
DD1
This is the bias feed for the 1
st
stage of the amplifier module. The gate bias is temperature compensated to
maintain constant current over the operating temperature range. See Note 1.
3,4
V
DD2
This is the bias feed for the 2
nd
stage of the amplifier module. The gate bias is temperature compensated to
maintain constant current over the operating temperature range. See Note 1.
5
RF Output
Module RF output. Care must be taken to protect against video transients that may damage the active devices.
Flange
Gnd
Exposed area on the bottom side of the package needs to be mechanically attached to the ground plane of the
board for optimum thermal and RF performance. See mounting instructions for recommendation.
Simplified Device Schematic
Absolute Maximum Ratings
Parameters
Value
Unit
1
st
Stage Bias Voltage (V
DD1
)
28
V
2
nd
Stage Bias Voltage (V
DD2
)
28
V
RF Input Power
+20
dBm
Load Impedance for Continuous Operation
Without Damage
5:1
VSWR
Output Device Channel Temperature
+200
C
Lead Temperature During Solder Reflow
+210
C
Operating Temperature Range
-20 to +90
C
Storage Temperature Range
-40 to +100
C
Operation of this device beyond any one of these limits may
cause permanent damage. For reliable continuous operation see
typical setup values specified in the table on page one.
Caution: ESD Sensitive
Appropriate precaution in handling, packaging
and testing devices must be observed.
Note 1:
The internal generated gate voltage is ther-
mally compensated to maintain constant qui-
escent current over the temperature range
listed in the data sheet. No compensation is
provided for gain changes with temperature.
This can only be provided with AGC external
to the module.
Note 2:
Internal RF decoupling is included on all bias
leads. No additional bypass elements are
required, however some applications may
require energy storage on the drain leads to
accommodate time-varying waveforms.
Case Flange = Ground
Q2
Temperature
Compensation
1
RF
in
Temperature
Compensation
Q1
Vdd1
2
RF
out
5
3
4 Vdd2
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
3
EDS-102932 Rev B
Preliminary
XD010-24S-D2F 1930-1990 MHz 10W
Gain and Efficiency vs. Output Power and Voltage
Freq=1960 MHz, Vdd=24V, 28 V, 32 V T
Flange
= 25C
0
5
10
15
20
25
30
35
0
2
4
6
8
10
12
Output Power (W)
Gain (dB), E
fficiency (%)
Gain @ 24 VDC
Gain @ 28 VDC
Gain @ 32 VDC
Efficiency @ 24 VDC
Efficiency @ 28 VDC
Efficiency @ 32 VDC
ACPR and ALT1 vs. Output Power and Temperature
Freq=1960 MHz IS-95 Vdd=28 V, T
Flange
=-20C, 25C, 90C
ACPR 885 kHz, 30 kHz
ALT1 1.25 MHz, 30 kHz
-70
-60
-50
-40
-30
-20
-10
0
0
0.5
1
1.5
2
2.5
Output Power (W)
ACPR (d
B)
-100
-90
-80
-70
-60
-50
-40
-30
AL
T
1
(d
B)
ACPR @ 25C
ACPR @-20C
ACPR @ 90C
ALT1 @-20C
ALT1 @ 25C
ALT1 @ 90C
Two Tone IMD vs. Output Power and Temperature
Freq=1960, 1961 MHz, Vdd=28 V, T
Flange
=-20
o
C, 25
o
C, 90
o
C
-60
-50
-40
-30
-20
-10
0
0
1
2
3
4
5
6
Output Power, Avg (W)
IMD
(d
Bc)
IMD @ 25 C
IMD @ 90
IMD @ -20
Gain and Efficiency vs. Output Power and Temperature
Freq=1960 MHz, Vdd=28 V, T
Flange
=-20C, 25C, 90C
0
5
10
15
20
25
30
35
0
2
4
6
8
10
12
Output Power (W)
Ga
i
n
(d
B)
0
5
10
15
20
25
30
35
Efficiency (%)
Gain @-20C
Gain @ 25C
Gain @ 90C
Efficiency @-20C
Efficiency @ 25C
Efficiency @ 90C
Gain, Efficiency and ACPR vs. Frequency
Freq=1960 MHz, Vdd=28 V, T
Flange
= 25C
Output Power=2 Watts
0
5
10
15
20
25
30
35
1920
1930
1940
1950
1960
1970
1980
1990
2000
Frequency (MHz)
Gai
n
(dB), E
fficiency (%)
-60
-55
-50
-45
-40
-35
-30
-25
ACPR (dB)
Gain
Efficiency
ACPR
Gain, Output Power and Efficiency vs. Input Power
Freq=1960 MHz, Vdd=28 V, T
Flange
= 25C
0
5
10
15
20
25
30
35
0
0.002
0.004
0.006
0.008
0.01
0.012
Input Power (W)
Ga
i
n
(d
B), Ou
tp
u
t
Po
we
r (W
), Effi
ci
e
n
cy (%)
Pout
Gain
Efficiency
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
4
EDS-102932 Rev B
Preliminary
XD010-24S-D2F 1930-1990 MHz 10W
Test Board Schematic with module attachments shown
Test Board Layout and Bill of Materials
Component
Description
Manufacturer
PCB
Rogers 4350, e
r
=3.5
Thickness=30mils
Rogers
J1, J2
SMA, RF, Panel Mount
Tab W / Flange
AMP
J3, J4
MTA Post Header, 5 Pin,
Rectangle, Polarized,
Surface Mount
AMP
C1, C2
Cap, 220mF 50V, -40 to
85
o
C, Electrolytic, G
Panasonic
C4, C6
Cap, 0.01mF, 100V, 10%,
1206
Johanson
C3, C5
Cap, 1000pF, 100V, 10%,
1206
Johanson
JP1 Header
SMT Header, Low Profile,
2mm
Specialty
Electronics
JP1 Shunt
Shunt, Mate to Header,
2mm
Specialty
Electronics
Mounting
Screws
4-40 X 0.250"
Various
To download Gerber files, DXF drawings, a detailed BOM, and
assembly recommendations for the test board with fixture
click here
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
5
EDS-102932 Rev B
Preliminary
XD010-24S-D2F 1930-1990 MHz 10W
Package Outline Drawing
Recommended PCB Cutout and Landing Pads for the D2F Package
Note 3: Dimensions are in inches