Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
1
Specifications subject to change without notice. 10/99A
2330 GHz Variable Gain Amplifier
Features
30 dB Gain
30 dB Attenuation Range
+16 dBm Output Power
3 dB Noise Figure
Rugged, Reliable Package
100% RF and DC Testing
Block Diagram
AB028V1-14
Description
The AB028V1-14 is a broadband millimeterwave variable
gain amplifier in a rugged package. The amplifier is
designed for use in millimeterwave communication and
sensor systems as the receiver front-end or transmitter
gain stage when high gain, wide dynamic range, and low
noise figure are required. The robust ceramic and metal
package provides excellent electrical performance,
excellent thermal performance, and a high degree of
environmental protection for long-term reliability. A single
supply voltage simplifies bias requirements. All amplifiers
are screened at the operating frequencies prior to
shipment for guaranteed performance. Amplifier is
targeted for millimeterwave point-to-point and point-to-
multipoint wireless communications systems.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Bandwidth
BW
23
2233
32
GHz
Small Signal Gain - Max Gain State (V
C
= -1.5 V)
G
27
30
dB
Noise Figure - Max Gain State (V
C
= -1.5 V)
NF
3
3.6
dB
Output Power at 1 dB Gain Comp. - Max Gain State (V
C
= -1.5 V)
P
1 dB
14
16
dBm
Input Return Loss
RL
I
15
dB
Output Return Loss
RL
O
15
dB
Attenuation Range
G
RANGE
25
30
dB
Temperature Coefficient of Gain
dG/dT
-0.035
dB/C
RF
Electrical Specifications at 25C (V
D1
= V
D2
= V
D3
= +5.5 V)
0.011
(0.28 mm)
0.018 (0.46 mm)
0.008
(0.20 mm)
0.024
(0.61 mm)
0.057
(1.45 mm)
0.0265
(0.67 mm)
TO LAUNCH
SURFACE
PIN 1
INDICATOR
0.025 (0.64 mm)
0.055
(1.40 mm)
0.470 (11.94 mm)
0.450
(11.43 mm)
0.225
(5.72 mm)
0.235
(5.60 mm)
AB028V1-14
YYWW
Variable
Attenuator
LNA
Driver
Parameter
Symbol
Min.
Typ.
Max.
Unit
Drain Current 1
I
D1
20
mA
Drain Current 2
I
D2
22
mA
Drain Current 3
I
D3
70
mA
Total Drain Current
I
D1
+ I
D2
+I
D3
112
160
mA
Control Current
I
C
< 1
A
DC
2330 GHz Variable Gain Amplifier
AB028V1-14
2
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/99A
-10
0
10
20
30
40
50
15
20
25
30
35
Frequency (GHz)
Gain vs. Frequency
Gain (dB)
90C
25C
Low Gain State
-55C
Frequency (GHz)
Noise Figure vs. Frequency
2
3
4
5
6
20
25
30
35
NF (dB)
Gain vs. V
C
-10
0
10
20
30
40
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0
Control Voltage (V)
Gain (dB)
@ 28 GHz
Frequency (GHz)
Return Loss vs. Frequency
-30
-20
-10
0
20
25
30
35
Return Loss (dB)
S
22
High
Gain
State
S
22
Low
Gain
State
S
11
High
Gain
State
S
11
Low
Gain
State
Typical Performance Data
Pin Out
RF In
PIN 1
INDICATOR
V
D2
V
C
V
D3
V
D1
GND
N/C
RF Out
Characteristic
Value
Operating Temperature (T
OP
)
-55C to +90C
Storage Temperature (T
ST
)
-65C to +150C
Bias Voltage (V
D1
)
6 V
DC
Bias Voltage (V
D2
)
6 V
DC
Bias Voltage (V
D3
)
7 V
DC
Control Voltage (V
C
)
-7 V
DC
Power In (P
IN
)
0 dBm
Absolute Maximum Ratings
2330 GHz Variable Gain Amplifier
AB028V1-14
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
3
Specifications subject to change without notice. 10/99A
Typical S-Parameters
High Gain State
Low Gain State
Frequency
S
11
S
21
S
12
S
22
(GHz)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
10.0
-0.5
38.9
-48.1
-107.1
-48.2
-78.5
-0.4
19.5
15.0
-0.6
-82.0
-28.3
-33.3
-46.4
-81.5
-0.6
-86.4
20.0
-3.1
166.3
18.7
-129.6
-42.1
-82.0
-1.6
165.6
21.0
-5.0
138.7
26.6
104.9
-42.5
-84.3
-5.1
137.9
22.0
-8.9
113.7
29.1
-22.9
-42.7
-86.0
-6.4
131.1
23.0
-13.0
98.6
31.1
-135.0
-42.3
-85.9
-9.1
90.0
24.0
-19.6
92.4
32.7
110.1
-42.3
-92.1
-25.3
11.8
25.0
-21.9
120.1
32.8
-2.6
-42.4
-90.4
-12.0
177.5
26.0
-18.8
116.3
31.8
-109.1
-42.5
-76.9
-9.6
130.3
27.0
-19.2
56.8
31.1
153.4
-42.0
-81.9
-13.1
83.1
28.0
-20.2
-50.7
30.9
54.7
-42.5
-79.1
-17.6
124.0
29.0
-21.4
-140.6
30.1
-49.3
-41.6
-70.8
-13.3
71.0
30.0
-15.6
175.7
29.6
-151.4
-40.2
-64.8
-13.8
49.1
31.0
-13.0
169.2
29.3
99.4
-39.7
-62.8
-17.7
-82.5
32.0
-7.6
104.6
28.3
-33.3
-36.7
-73.1
-9.1
130.4
33.0
-5.4
66.5
21.1
-178.9
-34.5
-85.9
-3.0
61.5
34.0
-4.1
29.9
8.9
64.9
-37.8
-112.1
-1.9
18.4
35.0
-3.6
-1.2
-3.9
-24.0
-40.3
-94.7
-1.3
-16.1
38.0
-3.0
-72.9
-36.1
177.7
-41.1
-76.7
-1.3
-82.8
40.0
-3.1
-106.0
-32.8
-47.4
-39.6
-61.3
-1.5
-112.3
Frequency
S
11
S
21
S
12
S
22
(GHz)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
10.0
-0.6
33.6
-49.3
-66.4
-48.3
-84.4
-0.4
19.6
15.0
-0.6
-81.9
-45.9
-52.0
-46.4
-82.2
-0.6
-86.4
20.0
-2.9
165.9
-3.5
-126.1
-41.8
-82.2
-1.6
166.6
21.0
-5.0
137.6
3.3
97.3
-42.4
-82.6
-4.2
137.3
22.0
-9.3
113.0
4.8
-39.5
-42.4
-83.8
-7.8
124.1
23.0
-14.1
106.4
3.9
-155.3
-42.0
-86.5
-10.4
106.8
24.0
-17.1
112.2
3.0
101.7
-42.4
-91.7
-17.4
82.9
25.0
-19.1
103.2
2.5
3.9
-42.6
-88.7
-20.3
-168.5
26.0
-22.1
84.8
2.3
-92.7
-42.8
-80.9
-10.8
159.4
27.0
-27.2
46.6
1.8
167.8
-42.2
-80.1
-9.0
110.2
28.0
-37.6
-62.5
0.5
66.8
-41.6
-81.7
-12.3
60.5
29.0
-22.0
-151.1
-1.0
-31.9
-42.2
-72.9
-22.1
48.6
30.0
-16.7
-178.0
-2.2
-129.0
-40.5
-64.5
-17.6
87.0
31.0
-13.0
150.2
-2.1
118.0
-39.9
-66.3
-17.0
20.8
32.0
-9.0
112.4
-5.5
-31.5
-37.0
-72.2
-9.2
145.6
33.0
-5.8
70.6
-17.7
-153.3
-34.6
-85.3
-3.3
65.1
34.0
-3.7
33.4
-37.4
71.7
-37.7
-108.6
-1.8
18.4
35.0
-3.3
-0.8
-34.4
-70.0
-39.9
-98.7
-1.3
-16.2
38.0
-3.1
-73.3
-41.6
-96.0
-41.0
-76.7
-1.3
-82.7
40.0
-3.2
-105.9
-38.6
-68.8
-38.5
-55.2
-1.5
-112.2
2330 GHz Variable Gain Amplifier
AB028V1-14
4
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/99A
Co-Planar Millimeterwave Package
Handling/Mounting
Co-planar packages (Figure 1) require careful mounting
design to maintain optimal performance and to minimize
VSWR interactions. A connection to the ground pads on
either side of the RF line is optional and will depend on
the type of material and geometry of the interface at the
RF ports.
Handling
In general the co-planar ceramic package is quite rugged.
However, due to ceramic's brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
The Cu-Mo-Cu base of this package is very durable,
however, care should be exercised when attaching with
screw hardware on packages which come with screw
holes. Over-tightening of screws could deform the base,
which could cause cracks in the ceramic walls. Only
personnel trained in both ESD precautions, and handling
precautions should be allowed to handle these packages.
Microstrip Mounting
An example of a co-planar microstrip launch is illustrated
in Figure 2 using an equal height dielectric material. A hole
is cut into the circuit board to allow the package to be
mounted directly to the circuit ground plane. The hole
should be cut as close to the outer dimensions of the
package to minimize RF gap distances.
It is preferred to match (mirror) the geometry of the
package interface to achieve best results. Three
5 x 1/4 mil ribbon bonds will complete the connection
providing a minimum discontinuity connection. Multiple
bondwires are also acceptable.
Surface Mounting
Mounting of the package to the surface (Figure 3) of a
circuit can be accomplished by using a series of via holes
to provide ground for the package. Although, this method
is not preferred it can be done if careful design practices
are used. Via spacing and size may have a strong effect
on high frequency performance of the package.
Package Attachment
The package can be conductive epoxy attached to its
mounting surface using either a paste or film media. SnPb
eutectic attachment can also be used in situations were
heat removal is important. Some packages allow for
hardware mounting. Care should be taken to ensure good
ground contact is maintained.
RF/DC Bondwire Attachment
Standard thermosonic ball or ribbon attachment is used
to make the connections to the RF and DC interfaces.
When designing the layout, be aware that most bonding
machines have a limited reach and may require special
tooling to wire/ribbon bond in center of a large circuit.
Figure 1. Co-Planar Packages
RF Out
RF In
RF Out
RF In
Figure 2. Microstrip Mount
Package
Launch
Circuit
Board
Figure 3. Surface Mount
Package
Circuit
Board
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