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Электронный компонент: SKY73010

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Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
103127C Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice October 21, 2004
1
DATA SHEET
SKY73010: 300 2500 MHz Direct Quadrature Modulator
Applications
QPSK/GMSK/QAM/DQPSK modulators
Single-sideband modulators
Image reject mixers
CDMA base stations
GSM/EDGE, TDMA/TDMA-EDGE, and Trans-European Trunked
Radio (TETRA) base stations
First upconverter in dual conversion receivers
Features
Broad RF and LO frequency range: 300 to 2500 MHz
Carrier suppression greater than 35 dBc
Sideband suppression greater than 45 dBc
Modulation bandwidth DC to 250 MHz
Noise floor less than 153 dBm/Hz
Broadband LO/RF flatness
RFLGATM (16-pin, 4 x 4 mm) Pb-free package (MSL3, 260 C
per JEDEC J-STD-020)
C1299
GND
GND
GND
LO
GND
QSIG
GND
GND
VCC
GND
VCC
1
16
15
14
6
7
8
2
3
4
5
13
12
11
10
9
PD
RF
QREF
IREF
ISIG
Figure 1. SKY73010 Pinout 16-Pin RFLGA Package
(Top View)
Description
The SKY73010 is an integrated quadrature modulator for direct
modulation of high frequency Amplitude Modulated (AM), Phase
Modulated (PM), or compound carriers. A SiGe Bipolar
Complementary Metal Oxide Semiconductor (BiCMOS) process is
used to offer excellent linearity, noise floor, and carrier
suppression performance.
The device package and pinout for the 16-pin RF Land Grid Array
(RFLGA) are shown in Figure 1. Figure 2 shows a functional block
diagram for the SKY73010. Signal pin assignments and functional
pin descriptions are provided in Table 1.
Skyworks offers this part as a lead (Pb)-free
"environmentally friendly" package that is RoHS
compliant (European Parliament for the Restriction
of Hazardous Substances).






ISIG
LO
RF OUT
IREF
QSIG
QREF
C1298
45
+45
Figure 2. SKY73010 Functional Block Diagram
DATA SHEET SKY73010
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
2
October 21, 2004 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103127C
Table 1. SKY73010 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1 GND
Ground
9 GND
Ground
2
GND
Ground
10
VCC
+5 VDC supply
3 GND
Ground
11 GND
Ground
4 LO
LO
input
12 GND
Ground
5 GND
Ground
13 QSIG
Q
input
6
VCC
+5 VDC supply
14
ISIG
I input
7
PD
Power down
15
IREF
I reference
8 RF
Ground
16 QREF
Q
reference
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The downset paddle of the SKY73010 direct quadrature
modulator has special electrical and thermal grounding
requirements. This pad is the main thermal conduit for heat
dissipation. Since the circuit board acts as the heat sink, it
must shunt as much heat as possible from the device. As
such, design the connection to the ground pad to dissipate the
maximum wattage produced to the circuit board. Multiple vias
to the grounding layer are required.
3. Two external output bypass capacitors are required on the
VCC pin. The values of these capacitors change with respect
to the desired RF frequency. One capacitor should be used for
low frequency bypassing and the other capacitor for high
frequency bypassing. Special attention should be given so
that the smaller value capacitor does not go into self-
resonance at the desired RF frequency.
Testing Procedure
The following In-Phase and Quadrature (I/Q) input settings were
used to measure the CDMA Adjacent Channel Power Reduction
(ACPR):
Pilot Channel Active
Sync Channel Active
Paging Channel Active
Six Traffic Channels Active
32x oversampling
Equifilter
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY73010 is rated to Moisture Sensitivity Level 3 (MSL3) at
260
C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for RFLGA
Packages, document number 103147.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73010 are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Table 4.
Typical performance characteristics are shown in Figures 3
through 7. Figure 8 provides a typical evaluation board schematic.
Package dimensions for the 16-pin RFLGA are shown in Figure 9,
and tape and reel dimensions are shown in Figure 10.
Electrostatic Discharge (ESD) Sensitivity
The SKY73010 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
DATA SHEET SKY73010
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
103127C Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice October 21, 2004
3
Table 2. SKY73010 Absolute Maximum Ratings
(T
A
= +25
C, unless otherwise noted)
Parameter Symbol
Min
Typical
Max
Units
+3 V supply voltage
VCC
4.5
6.0
V
Power dissipation
P
DIS
750
mW
LO input power
P
LOIN
0
+6
dBm
IF input voltage
1.5
Vpp
Thermal resistance
R
TH
44
C/W
Operating case temperature
T
OPR
40
+85
C
Storage case temperature
T
STG
40
+150
C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters
set at or below their nominal values.
Table 3. SKY73010 Recommended Operating Conditions
Parameter Symbol
Min
Typical
Max
Units
+5 V supply voltage
VCC
4.5
5.0
5.5
V
Current consumption
I
CC
90
110
mA
Operating case temperature
T
OPR
40
+85
C
Table 4. SKY73010 Electrical Characteristics (1 of 2)
(VCC = 5 V, IF = 2 MHz, LO input power = 3 dBm, T
C
= 25 C, unless otherwise noted)
Parameter Symbol
Test
Conditions Min
Typical
Max Units
Local Oscillator
Input frequency range
300
2500
MHz
Input power level
3
+3
dBm
Input
impedance
2.0:1 VSWR
I/Q Signal Reference Input
Input frequency range
DC
250
MHz
Reference voltage
3.6
4.1
V
RF Output (400 MHz)
Output 1 dB compression point
3
dBm
CDMA output channel power
12
dBm
CDMA ACPR
CDMA RF output power =
12 dBm
73 dBc
Optimized carrier suppression
Optimized I/Q DC offsets
50
dBc
Carrier suppression
28
35
dBc
Sideband suppression
30
35
dBc
Optimized sideband suppression
Optimized I/Q phase and
amplitude balance
50 dBc
Broadband noise floor
@ 20 MHz offset from
carrier
152
150
dBm/Hz
Output
impedance
2.0:1
DATA SHEET SKY73010
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
4
October 21, 2004 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103127C
Table 4. SKY73010 Electrical Characteristics (2 of 2)
(VCC = 5 V, IF = 2 MHz, LO input power = 3 dBm, T
C
= 25 C, unless otherwise noted)
Parameter Symbol
Test
Conditions Min
Typical
Max Units
RF Output (900 MHz)
Output 1 dB compression point
1.5
+1.5
dBm
CDMA output channel power
12
dBm
CDMA ACPR
CDMA RF output power =
12 dBm
72 dBc
Optimized carrier suppression
Optimized I/Q DC offsets
50
dBc
Carrier suppression
24
35
dBc
Sideband suppression
32
45
dBc
Optimized sideband suppression
Optimized I/Q phase and
amplitude balance
50 dBc
Broadband noise floor
@ 20 MHz offset from
carrier
153
150
dBm/Hz
Output
impedance
2.0:1
RF Output (1900 MHz)
Output 1 dB compression point
6.0
3.5
dBm
CDMA output channel power
18
dBm
CDMA ACPR
CDMA RF output power =
18 dBm
70 dBc
Optimized carrier suppression
Optimized I/Q DC offsets
50
dBc
Carrier suppression
20
28
dBc
Sideband suppression
28
40
dBc
Optimized sideband suppression
Optimized I/Q phase and
amplitude balance
50 dBc
Broadband noise floor
@ 20 MHz offset from
carrier
155
152
dBm/Hz
Output
impedance
2.0:1
DATA SHEET SKY73010
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
103127C Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice October 21, 2004
5
25.0
20.0
15.0
10.0
5.0
0.0
5.0
0
200
400
600
800
1000
1200
V
IN
(mVp-p)
P
OUT
(dBm)
450 MHz
900 MHz
1900 MHz
Figure 3. Continuous Wave (CW) Intermediate Frequency (IF)
Input Voltage vs Output Power
ACPR (dBc)
Channel P
OUT
(dBm)
80.0
75.0
70.0
65.0
60.0
55.0
50.0
45.0
40.0
25.0
20.0
15.0
10.0
5.0
0.0
885 kHz offset
1.26 MHz offset
Figure 5. 450 MHz CDMA ACPR vs Channel Output Power
ACPR (dBc)
Channel P
OUT
(dBm)
80.0
75.0
70.0
65.0
60.0
55.0
50.0
45.0
40.0
30.0
25.0
20.0
15.0
10.0
0.0
5.0
885 kHz offset
1.26 MHz offset
Figure 7. 1900 MHz CDMA ACPR vs Channel Output Power
P
OUT
(dBm)
8
6
4
2
0
2
4
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Figure 4. Output 1 dB Compression Points vs RF Frequency
ACPR (dBc)
Channel P
OUT
(dBm)
80.0
75.0
70.0
65.0
60.0
55.0
50.0
45.0
40.0
25.0
20.0
15.0
10.0
5.0
0.0
885 kHz offset
1.26 MHz offset
Figure 6. 900 MHz CDMA ACPR vs Channel Output Power