256 LBGA/LBGN PACKAGE OUTLINE
SINGLE (LID) MOLDED
MATRIX MOLDED & SAWED
Min
Nominal
Max
Remark
A
1.10
-
1.50
Overall Package Height
A1
0.25
-
0.50
Standoff
A2
0.49
-
0.75
Mold Thickness
D
16.80
17.00
17.20
X Board Length
D1
-
15.00
-
X Distance Between End Ball Centers
D2
14.80
15.00
15.20
X Lid Length (see Note 4)
E
16.80
17.00
17.20
Y Board Length
E1
-
15.00
-
Y Distance Between End Ball Centers
E2
14.80
15.00
15.20
Y Lid Length (see Note 4)
b
0.40
0.50
0.70
Ball Diameter
e
1.00 Basic
Pitch
ccc
-
-
0.20
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Maximum radial true position tolerance of each ball is 0.125 mm at maximum material condition. Dimension
"b (max)" is 0.70mm for all devices, which start production after 2004, and is 0.60mm for all devices, which
started production prior to 2005, until the end of their product life.
3. Details of ball A1 identifier are optional but must be located within the zone indicated.
4. Single molded (Lid) version of the package is optional - see dashed line.
5. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
Rev. 8/23/05
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
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