SMSC EMC1033
PRODUCT PREVIEW
Revision 1.0 (04-15-05)
Data Brief
PRODUCT FEATURES
EMC1033
1C Triple SMBus
Sensor with Resistance
Error Correction
General Description
The EMC1033 is an SMBus temperature sensor that
monitors up to three temperature zones and can
generate two system interrupts. With 1
C
measurement
accuracy, the EMC1033 provides a low-cost solution for
critical temperature monitoring applications. Features
include automatic resistance error correction and
programmable ideality factor configuration eliminating
both major sources of temperature measurement error.
1
The EMC1033 generates two separate interrupts with
programmable thermal trip points. The
THERM
output
operates as a thermostat with programmable threshold
and hysteresis. The
ALERT
output can be configured
as a maskable SMBus alert with programmable
window comparator limits, or as a second
THERM
output. Both interrupts are maintained in an 8-pin
package while a third temperature zone is added with
the anti-parallel diode technique. This allows the
EMC1033 to be pin compatible with the ADT7461,
ADM1032, LM99, and the MAX6649 with the advantage
of a third temperature zone.
Features
Resistance Error Correction
Ideality Factor Configuration
Select 1 of 4 SMBus addresses with external resistor
Remote Thermal Zones
--
1.0C Accuracy (40C to 80C)
-- 0.125
C resolution
Internal Thermal Zone
--
3.0C Accuracy (0C to 85C)
Maskable Interrupt using
ALERT
One-shot Command during standby
Programmable temperature conversion rate
Extended temperature
(-64
C to 191C)
available
Over-limit filtering with consecutive counter
Small 8-lead SOIC or TSSOP package
Applications
Desktop and Notebook Computers
Thermostats
Smart batteries
Industrial/Automotive
Simplified Block Diagram
1.Patents pending.
EMC1033
Internal
Temp Diode
Switching
Current
SMCLK
Internal Temp
Register
Di
g
i
t
a
l
M
u
x
Di
gi
t
a
l
M
u
x
Li
m
i
t
Com
par
at
or
High Limit Registers
THERM Hysterisis Register
Low Limit Registers
THERM Limit Register
Address Pointer Register
Conversion Rate Register
Interrupt Masking
Status Register
Configuration Register
SMBu
s
I
n
t
e
r
f
a
c
e
Remote Temp
Register 1
Remote Temp
Register 2
ALERT
SMDATA
11-bit
delta-sigma
ADC
A
nal
og M
u
x
DP1
DN2
DN1
DP2
THERM
ORDER NUMBER(S):
EMC1033-ACM-TR FOR 8 PIN, SOIC PACKAGE (TAPE AND REEL)
EMC1033-ACZB-TR FOR 8 PIN, TSSOP PACKAGE (TAPE AND REEL)
Reel size is 4,000 pieces.
Evaluation Board available upon request. (EVB-EMC1033)
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
Copyright SMSC 2005. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete
information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no
responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without
notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does
not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC
or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard
Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request.
SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause
or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further
testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale
Agreement, may be obtained by visiting SMSC's website at http://www.smsc.com. SMSC is a registered trademark of Standard Microsystems
Corporation ("SMSC"). Product names and company names are the trademarks of their respective holders.
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ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
1C Triple SMBus Sensor with Resistance Error Correction
Revision 1.0 (04-15-05)
2
SMSC EMC1033
PRODUCT PREVIEW
1C Triple SMBus Sensor with Resistance Error Correction
SMSC EMC1033
3
Revision 1.0 (04-15-05)
PRODUCT PREVIEW
Package Outlines
Figure 1 8-Pin TSSOP Package Outline - 3x3mm Body 0.65mm Pitch
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 1 8-Pin TSSOP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
0.80
~
1.10
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.75
0.85
0.95
Body Thickness
D
2.80
3.00
3.20
X Body Size
E
4.65
4.90
5.15
Y Span
E1
2.80
~
3.20
Y body Size
H
0.08
~
0.23
Lead Foot Thickness
L
0.40
~
0.80
Lead Foot Length
L1
0.95 REF
Lead Length
e
0.65 BSC
Lead Pitch
0
o
~
8
o
Lead Foot Angle
W
0.22
~
0.38
Lead Width
ccc
~
~
0.10
Coplanarity
1C
T
r
iple SMBus Sensor
with
Resist
ance Err
o
r Cor
r
ectio
n
Revision 1.0 (0
4-15-
05)
4
SMS
C
EMC1033
PRODUCT
PREVIEW
Figure 2 8-Pin SOIC Package Outline and Parameters - 3.9mm Body, 1.27mm Pitch
A
INITIAL RELEASE
7/07/04
S.K.ILIEV
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETER.
2. TRUE POSITION SPREAD TOLERANCE IS 0.125mm AT MAXIMUM MATERIAL CONDITION.
3. PACKAGE BODY DIMENSION "D" DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
GATE BURRS. MAXIMUM MOLD FLASH, PROTRUSIONS OR GATE BURRS IS 0.15 mm PER
END. DIMENSION "E1" DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
MAXIMUM INTERLEAD FLASH OR PROTRUSION IS 0.25 mm PER SIDE. "D1" & "E1"
DIMENSIONS ARE DETERMINED AT DATUM PLANE "H".
4. DIMENSIONS "b" & "c" APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO
0.25 mm FROM THE LEAD TIP.
5. THE CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1 IDENTIFIER
MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.
A
A2
A1
L
L1
SEATING PLANE
SIDE VIEW
ccc C
0
0.25
GAUGE PLANE
H
3-D VIEW
D
8X b
e
TOP VIEW
E1
C
3
INDEX AREA
(D/2 X E1/2)
1
2
8
E
2
4
END VIEW
c
4
3
SEE DETAIL "A"
5
DETAIL "A"
SCALE: 3/1
DECIMAL
X.X
X.XX
X.XXX
MATERIAL
FINISH
STD COMPLIANCE
THIRD ANGLE PROJECTION
PRINT WITH "SCALE TO FIT"
DO NOT SCALE DRAWING
APPROVED
ANGULAR
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
AND TOLERANCES ARE:
DIM AND TOL PER ASME Y14.5M - 1994
DRAWN
CHECKED
NAME
SCALE
80 ARKAY DRIVE
HAUPPAUGE, NY 11788
USA
DWG NUMBER
TITLE
DATE
SHEET
REV
REVISION HISTORY
DESCRIPTION
REVISION
RELEASED BY
DATE
S.K.ILIEV
S.K.ILIEV
S.K.ILIEV
1
-
-
0.025
0.05
0.1
7/07/04
1:1
7/07/04
7/07/04
A
JEDEC: MS-012 / AA
1 OF 1
8 PIN SOIC, 3.9mm BODY WIDTH, 1.27mm PITCH
PACKAGE OUTLINE
MO-8-SOIC-4.9x3.9
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