SMSC USB2229/USB2230
DATASHEET
Revision 1.2 (05-09-05)
Datasheet
PRODUCT FEATURES
USB2229/USB2230
5th Generation Hi-Speed
USB Flash Media & IrDA
Controller with
Integrated Card Power
FETs
IrDA Controller
IrDA v1.1 FIR and SIR Compliant Controller, with
9.6K, 19.2K, 38.4K, 57.6K, 115.2K, 0.576Mbps,
1.152Mpbs and 4Mbps data rate support.
Flash Media Controller
Complete System Solution for interfacing
SmartMedia
TM
(SM) or xD Picture Card
TM
(xD)
1
,
Memory Stick
TM
(MS), High Speed Memory Stick
(HSMS), Memory Stick PRO (MSPRO), MS Duo
TM
,
Secure Digital (SD), High Speed SD, Mini-Secure
Digital (Mini-SD), TransFlash (SD),
MultiMediaCard
TM
(MMC), Reduced Size
MultiMediaCard (RS-MMC), NAND Flash, Compact
Flash
TM
(CF) and CF Ultra
TM
I & II, and CF form-
factor ATA hard drives to Hi-Speed USB
-- Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
Support for simultaneous operation of all above
devices. (only one at a time of each of the following
groups supported: CF or ATA drive, SM or XD or
NAND, SD or MMC)
On-Chip 4-Bit High Speed Memory Stick and MS
PRO Hardware Circuitry
On-Chip firmware reads and writes High Speed
Memory Stick and MS PRO
1-bit ECC correction performed in hardware for
maximum efficiency
Hardware support for SD Security Command
Extensions
On-chip power FETs with short circuit protection for
supplying flash media card power
USB Bus Power Certified
3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3
Complete USB Specification 2.0 Compatibility for Bus
Powered Operation
-- Includes Hi-Speed USB Transceiver
-- A Bi-directional Control and two Bi-directional Bulk
Endpoints are provided.
8051 8 bit microprocessor
-- Provides low speed control functions
-- 30 Mhz execution speed at 1 clock per instruction cycle
average
-- 12K Bytes of internal SRAM for general purpose
scratchpad
-- 768 Bytes of internal SRAM for general purpose
scratchpad or program execution while re-flashing
external ROM
-- Two, Double Buffered Bulk Endpoints
-- Two, Bi-directional 512 Byte Buffers for Bulk Endpoints
-- 64 Byte RX Control Endpoint Buffer
-- 64 Byte TX Control Endpoint Buffer
Internal or External Program Memory Interface
-- 76K Byte Internal Code Space or Optional 128K Byte
External Code Space using Flash, SRAM or EPROM
memory.
On Board 24Mhz Crystal Driver Circuit
Can be clocked by 48MHz external source
On-Chip 1.8V Regulator for Low Power Core
Operation
Internal PLL for 480Mhz Hi-Speed USB Sampling,
Configurable MCU clock
Supports firmware upgrade via USB bus if "boot
block" Flash program memory is used
12 GPIOs for special function use: LED indicators,
button inputs, power control to memory devices, etc.
-- Inputs capable of generating interrupts with either edge
sensitivity
Attribute bit controlled features:
-- Activity LED polarity/operation/blink rate
-- Full or Partial Card compliance checking
-- Bus or Self Powered
-- LUN configuration and assignment
-- Write Protect Polarity
-- SmartDetach
TM
- Detach from USB when no Card
Inserted for Notebook apps
-- Cover Switch operation for xD compliance
-- Inquiry Command operation
-- SD Write Protect operation
-- Older CF card support
-- Force USB 1.1 reporting
-- Internal or External Power FET operation
Compatible with Microsoft WinXP, WinME, Win2K
SP3, Apple OS10, Softconnex, and Linux Multi-LUN
Mass Storage Class Drivers
Win2K, Win98/98SE and Apple OS8.6 and OS9
Multi-LUN Mass Storage Class Drivers available from
SMSC
128 Pin TQFP Package (1.0mm height, 14mmx14mm
footprint); green, lead-free package also available.
1.xD Picture Card not applicable to USB2229.
ORDER NUMBER(S):
USB2229/USB2230-NE-03 FOR 128 PIN, TQFP PACKAGE; USB2229/USB2230-NU-03 FOR 128 PIN, TQFP
PACKAGE (GREEN, LEAD-FREE) PACKAGE
80 Arkay Drive
Hauppauge, NY 11788
(631)
435-6000
FAX (631) 273-3123
Copyright SMSC 2005. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently,
complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be
accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any
time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this
information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual
property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may
contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly
sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other
application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written
approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other
SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC's website at http://www.smsc.com. SMSC is a
registered trademark of Standard Microsystems Corporation ("SMSC"). Product names and company names are the trademarks of their respective
holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE,
AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE.
IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION,
WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR
OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER
OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
Revision 1.2 (05-09-05)
2
SMSC USB2229/USB2230
DATASHEET
5th Generation Hi-Speed USB Flash Media & IrDA Controller with Integrated Card Power FETs
Datasheet
SMSC USB2229/USB2230
3
Revision 1.2 (02-21-05)
DATASHEET
Table of Contents
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 3 Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1
128-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2
128-Pin List Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1
PIN Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2
Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 7 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.1
Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.2
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.3
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Chapter 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 9 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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