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Despite our busy schedule, we are
confident that we succeeded in re-
sponding to our customers' input
to the greatest extent possible in
the development of these new
products. Even though the design
period was short, we put careful
detailed attention into every single
element in these products. We are
sure our customers will be fully sat-
isfied. It's good to be able to relax
again now that this project is done.
V
O
I
C
E
Optical Pickup Chipset with CD/DVD Recording Photodetector IC (PDIC)
Supports High-Speed Writing to both CD and DVD Media
CXA2677GA
CXA2676GA
The signal processing required for DVD is far more com-
plex than that for CD.
Sony has now developed an optical pickup chipset, the
CXA2677GA and CXA2676GA, that is appropriate for this
complex signal processing.
These devices adopt a newly-developed LGA type small
package and can contribute to the development of ul-
trathin pickups.
CXA2677GA
RF/Servo PDIC
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Supports high-speed CD/DVD write operations
(CD-R:
52-speed, DVD-R:
8-speed)
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WPP1 (A + B) and WPP2 (C + D) outputs, which are
optimal for DVD address bit detection
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Band limiter function for write operations
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Eight-section photodiode for DPP
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16-pin LGA COB small package
CXA2676GA
Laser front monitor PDIC
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Two-channel structure (Vin1, Vin2)
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Chip capacitors (1005) included
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8-pin LGA COB small package
CXA2677GA
The CXA2677GA is a photodetector IC
(PDIC) that was developed as the photo-
detector element for optical pickups used
in DVD
R/RW drives. It features two
additional pins: WPP1 (A + B) and WPP2
(C + D). This allows the generation of the
WRF signal used in earlier (CXA2660N)
CD-R/RW systems with the WPP1 +
WPP2 signal and the detection of address
bit signal unique to DVD
R/RW with the
WPP1 WPP2 signal. Also, it adopts a
three-stage structure with a write mode
and two read modes with high gain and
low gain mode settings.
The band limiter function used in write
mode provides an average value signal
with high precision.
CXA2676GA
The CXA2676GA adopts a two-channel
structure to allow the power of the CD
laser and the DVD laser to be set individu-
ally. It achieves fast response characteris-
tics, namely a slew rate of 250 V/
s and a
settling time of 7 ns. These characteristics
are adequate to support write speeds of
52
for CD-R and
8 for DVD-R.
LGA COB (chip on board)
Small Package
To increase the number of pins while re-
taining the package dimensions (4.5
3.2
mm) of the earlier chip on board (COB)
package, Sony developed a new land grid
array (LGA) package that positions the
contacts in a two-dimensional array on the
reverse side of the package. This allows
these devices to provide increased func-
tionality without increasing the mounting
area. This package is optimal for devel-
oping ultrathin pickups, that is, pickups
for use in 9.5 mm ultrathin drives.
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Vout
Vcc
Vc
GND
Low
High
Photodiode
SW
Vin1
Vin2
IVout
VR2
VR1
2
8
1
7
4
5
3
6
3
0.8
4.5
0.1
Chip
Top view
Bottom view
Back side contact
(LGA)
Substrate
Transparent resin
(includes scattering materials)
3.2
0.1
1.25
0.1
0.35
0.2
0.8
1.6
Acceptance area
LA
N
D
1
6
0.
5
Unit: mm
0.7 mm
Photosensitive area position:
At the package center
7
8
Vc
IVout
Vin1
Vout
SW
Vin2
Vcc
GND
1
3
4
5
6
2
6
9
1
10
11
16
8
7
Vcc
Vc
GND
SW
RF+
Ao
Vc
Bo
Co
Do
RF
WPP1
WPP2
3
3
A
Ao
Vc
A'
4
Bo
3
B
Vc
B'
14
Co
3
C
Vc
C'
13
Do
3
D
Vc
D'
15
Eo
3.5
E
Vc
5
Fo
3.5
F
Vc
12
Go
3.5
G
Vc
2
Ho
3.5
H
Vc
Ao
Bo
Co
Do
B'
Vc
Vcc
Vc
C'
A'
Vc
D'
0.8
0.8
LA
N
D
1
6
0.
5
4.5
0.1
3.2
0.1
Colorless transparent resin
1.25
0.1
0.35
0.2
A B
D
G
H
E
F
C
Top view
Bottom view
Chip
Back side contact
(LGA)
Substrate
Unit: mm
H
120
G
F
120
E
150
120
D
120
35
35
C
A
B
Unit:
m
12
13
14
15
16
Go
Vc
Vcc
SW
WPP2
RF+
WPP1
Do
Co
Eo
RF
GND
Ho
Ao
Bo
Fo
1
2
3
4
6
7
8
9
10
11
5
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Figure 1 CXA2676GA Block Diagram
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Figure 2 CXA2677GA Block Diagram
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Figure 3
CXA2676GA Pin
Configuration
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Figure 4
CXA2677GA Pin
Configuration
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Figure 5 CXA2676GA Acceptance Pattern Dimensions
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Figure 6 CXA2677GA Acceptance Pattern Dimensions
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Figure 7 CXA2676GA Package Dimensions
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Figure 8 CXA2677GA Package Dimensions
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