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Электронный компонент: CXG1012N

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E95444A57-TE
CXG1012N
High-Frequency SPDT Antenna Switch
SSOP-8P-L01 (Plastic)
Absolute Maximum Ratings (Ta=25 C)
Control voltage
Vctl
6
V
Operating temperature
Topr
35 to +85
C
Storage temperature
Tstg
65 to +150
C
Operating Condition
Control voltage
0/3
V
Description
The CXG1012N is an antenna switch MMIC. This
IC is designed using the Sony's GaAs J-FET process
and operates at a single positive power supply.
Features
Single positive power supply operation
Insertion loss
0.5 dB (Typ.) at 2.0 GHz
Medium power switching
P1dB (Typ.)
29 dBm
at 2.0 GHz
V
CTL
(H)=3.0V
33 dBm
at 2.0 GH
Z
V
CTL
(H)=4.0 V
Application
Antenna switch for digital cordless telephones
Structure
GaAs J-FET MMIC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
For the availability of this product, please contact the sales office.
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CXG1012N
Insertion loss
Isolation
Insertion loss
Isolation
Input VSWR
Output VSWR
Switching time
Control pin current
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
IL1
f=1.0 GHz
0.3
0.6
dB
ISO1
30
35
dB
IL2
f=2.0 GHz
0.5
0.8
dB
ISO2
20
23
dB
VSWRIN
1.3
1.5
VSWROUT
1.3
1.5
TSW
100
ns
I
CTL
70
150
A
Electrical Characteristics
V
CTL
(L) =0V, V
CTL
(H) =3V, Pin=21.5dBm
(Ta=25 C)
1 dB gain compression
point output
1 dB gain compression
point output
P1dB (3)
V
CTL
(H) =3 V
P1dB (4)
V
CTL
(H) =4 V
High
Low
Port1-Port2 ON
Port1-Port3 OFF
Low
High
Port1-Port2 OFF
Port1-Port3 ON
VCTLA VCTLB
Block Diagram
Package outline/Pin Configuration
Port1
Port2
Port3
CTLB
Port1
GND
CTLA
GND
GND
Port2
Port3
1
8
8-pin SSOP (plastic)
(Ta=25 C)
26
29
dBm
30
33
dBm
V
CTL
(L) =0V, f =2.0GHz
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CXG1012N
Recommended Circuit
Example of Representative Characteristics (Ta=25 C)
100pF
100pF
CTLB
Port1
CTLA
Port3
Port2
100pF
100pF
100pF
CXG1012N
1
2
3
4
5
6
7
8
0
2
4
6
0
10
20
30
20
24
28
36
32
40
Insertion loss (dB)
Isolation (dB)
V
CTL
(H) =3V
V
CTL
(H) =4V
V
CTL
(H) =5V
V
CTL
(H) =3
V
V
CTL
(H) =4V
V
CTL
(H) =5V
Insertion loss
3
2
1
0
5
4
3
2
1
0
50
40
30
20
10
0
Frequency (GHz)
Insertion loss (dB)
Isolation (dB)
Insertion loss, isolation vs. Frequency
Insertion loss
Isolation
Insertion loss, isolation vs. Input power
Input power (dBm)
Isolation
--4--
CXG1012N
Package Outline Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER / PALLADIUM
COPPER ALLOY
PACKAGE STRUCTURE
SSOP-8P-L01
PLATING
SSOP008-P-0044
0.04g
8PIN SSOP (PLASTIC)
0.24 0.07
+ 0.08
0.65
3.0 0.1
4.4
0.1
1.25 0.1
+ 0.2
0.1
A
6.4
0.2
B
0.24 0.07
+ 0.08
(0.22)
0.17 0.015
+ 0.025
(0.15)
0.1 0.05
0.25
0 to 10
0.6
0.15
(0.5)
1
4
5
8
0.13 M
DETAIL B
A
DETAIL
NOTE: Dimension "
" does not include mold protrusion.