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Электронный компонент: CXG1022

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E96547A71-TE
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Absolute Maximum Ratings (Ta=25 C)
Control voltage
Vctl
6
V
Operating temperature
Topr
35 to +85
C
Storage temperature
Tstg
65 to +150
C
Operating Condition
Control voltage
0/3
V
Description
The CXG1022TM is an antenna switch MMIC.
This IC is designed using the Sony's GaAs J-FET
process and operates at a single positive power
supply with an ultra-small package.
Features
Single positive power supply operation
Insertion loss
0.4 dB (Typ.)
at 2.0 GHz
Medium power switching
P1dB (Typ.)
29 dBm
at 2.0 GHz
V
CTL
(H)=3.0 V
33 dBm
at 2.0 GHZ
V
CTL
(H)=4.0 V
Ultra-small TSSOP package
Applications
Antenna switch for digital cordless telephones
Structure
GaAs J-FET MMIC
High-Frequency SPDT Antenna Switch
10 pin TSSOP (Plastic)
CXG1022TM
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CXG1022TM
Insertion loss
Isolation
Insertion loss
Isolation
Input VSWR
Output VSWR
Switching time
Control pin current
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
IL1
f=1.0 GHz
0.3
0.6
dB
ISO1
28
31
dB
IL2
f=2.0 GHz
0.4
0.8
dB
ISO2
23
26
dB
VSWRIN
1.3
1.5
VSWROUT
1.3
1.5
TSW
50
ns
I
CTL
50
100
A
Electrical Characteristics
V
CTL
(L) =0 V, V
CTL
(H) =3 V, P
IN
=21.5 dBm
(Ta=25 C)
1 dB gain compression
point output
1 dB gain compression
point output
V
CTL
(L) =0 V, f =2.0 GHz, R
RF
=200 k
(Ta=25 C)
Block Diagram
Pin Configuration
Port1
Port2
Port3
10pin TSSOP (PLASTIC)
CTLB
Port1
GND
CTLA
GND
Port3
GND
GND
Port2
GND
1
10
V
CTLA
High
Low
V
CTLB
Low
High
Port1-Port2 ON
Port1-Port3 OFF
Port1-Port2 OFF
Port1-Port3 ON
P1dB (3)
P1dB (4)
V
CTL
(H) =3 V
V
CTL
(H) =4 V
26
30
29
33
dBm
dBm
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CXG1022TM
Recommended Circuit
100pF
100pF
CTLA
CTLB
100pF
Port3
Port2
CXG1022TM
100pF
6
7
8
9
10
Port1
100pF
1
2
3
4
5
R
RF
R
RF
R
RF
(200k
) is used to stabilized the electrical characteristics at high power signal input
Example of Representative Characteristics (Ta=25 C)
0
2
4
6
20
24
28
32
36
40
30
20
10
0
V
CTL
(H)=5V
V
CTL
(H)=4V
V
CTL
(H)=3V
V
CTL
(H)=3V
V
CTL
(H)=4V
V
CTL
(H)=5V
0
3
4
5
2
1
30
20
10
0
40
50
0
1
2
3
Input power (dBm)
Isolation (dB)
Insertion loss (dB)
Insertion loss, isolation vs. Input power
Insertion loss
Isolation
Insertion loss, isolation vs. Frequency
Frequency (GHz)
Isolation (dB)
Insertion loss (dB)
Isolation
Insertion loss
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
0.22
0.5
5
1.2MAX
2.8 0.1
10 6
2.2
0.1
3.2
0.2
0.1 0.05
+ 0.15
0.45
0.15
0 to 10
1
A
(0.2)
0.22 0.07
+ 0.08
(0.1)
0.12 0.015
+ 0.025
DETAIL A
0.02g
TSSOP-10P-L01
10PIN TSSOP(PLASTIC)
0.1
0.1
M
NOTE: "
" Dimensions do not include mold protrusion.
0.25
Package Outline Unit : mm
CXG1022TM
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