ICX259AL
Diagonal 6mm (Type 1/3) CCD Image Sensor for CCIR B/W Video Cameras
Description
The ICX259AL is an interline CCD solid-state
image sensor suitable for CCIR B/W video cameras
with a diagonal 6mm (Type 1/3) system. Compared
with the current product ICX059CL, basic
characteristics such as sensitivity, smear, dynamic
range and S/N are improved drastically from visible
light region to near infrared light region through the
adoption of EXview HAD CCD
TM
technology.
This chip features a field period readout system and
an electronic shutter with variable charge-storage
time.
Features
Sensitivity in near infrared light region
(+8dB compared with the ICX059CL,
= 945nm)
High sensitivity (+7dB compared with the ICX059CL, no IR cut filter)
Low smear (20dB compared with the ICX059CL)
High D range (+5dB compared with the ICX059CL)
High S/N
High resolution and low dark current
Excellent antiblooming characteristics
Continuous variable-speed shutter
No voltage adjustment
(Reset gate and substrate bias are not adjusted.)
Reset gate:
5V drive
Horizontal register: 5V drive
Device Structure
Interline CCD image sensor
Image size:
Diagonal 6mm (Type 1/3)
Number of effective pixels: 752 (H)
582 (V) approx. 440K pixels
Total number of pixels:
795 (H)
596 (V) approx. 470K pixels
Chip size:
6.00mm (H)
4.96mm (V)
Unit cell size:
6.50m (H)
6.25m (V)
Optical black:
Horizontal (H) direction : Front 3 pixels, rear 40 pixels
Vertical (V) direction
: Front 12 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 22
Vertical 1 (even fields only)
Substrate material:
Silicon
1
E99526A99
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Pin 1
V
3
40
2
12
Pin 9
H
Optical black position
(Top View)
EXview HAD CCD is a trademark of Sony Corporation.
EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of
HAD (Hole-Accumulation-Diode) sensor.
TM
16 pin DIP (Plastic)
2
ICX259AL
Block Diagram and
Pin Configuration
(Top View)
6
7
N
C
V
1
V
2
V
3
V
4
V
D
D
G
N
D
S
U
B
V
L
R
G
H
2
2
3
4
G
N
D
8
1
V
O
U
T
N
C
10
11
12
14
9
16
13
15
N
C
5
H
1
Note)
Horizontal Register
V
e
r
t
i
c
a
l
R
e
g
i
s
t
e
r
Note) : Photo sensor
Pin No.
1
2
3
4
5
6
7
8
V
4
V
3
V
2
V
1
GND
NC
NC
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Signal output
9
10
11
12
13
14
15
16
V
DD
GND
SUB
V
L
RG
NC
H
1
H
2
Supply voltage
GND
Substrate clock
Protective transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
Symbol
Description
Pin No.
Description
Pin Description
Symbol
Absolute Maximum Ratings
1
+24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
Against
SUB
Against GND
Against V
L
Between input clock
pins
Storage temperature
Operating temperature
40 to +8
50 to +15
50 to +0.3
40 to +0.3
0.3 to +20
10 to +18
10 to +6
0.3 to +28
0.3 to +15
to +15
6 to +6
14 to +14
30 to +80
10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
C
C
V
DD
, V
OUT
,
RG
SUB
V
1
, V
3
SUB
V
2
, V
4
, V
L
SUB
H
1
, H
2
, GND
SUB
V
DD
, V
OUT
,
RG GND
V
1
, V
2
, V
3
, V
4
GND
H
1
, H
2
GND
V
1
, V
3
V
L
V
2
, V
4
, H
1
, H
2
, GND V
L
Voltage difference between vertical clock input pins
H
1
H
2
H
1
, H
2
V
4
Item
Ratings
Unit
Remarks
1
3
ICX259AL
Bias Conditions
Clock Voltage Conditions
Item
Readout clock voltage
V
VT
V
VH1
, V
VH2
V
VH3
, V
VH4
V
VL1
, V
VL2
,
V
VL3
, V
VL4
V
V
V
VH3
V
VH
V
VH4
V
VH
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
RG
V
RGLH
V
RGLL
V
RGL
V
RGLm
V
SUB
14.55
0.05
0.2
8.0
6.3
0.25
0.25
4.75
0.05
4.5
21.0
15.0
0
0
7.0
7.0
5.0
0
5.0
22.0
15.45
0.05
0.05
6.5
8.05
0.1
0.1
0.3
0.3
0.3
0.3
5.25
0.05
5.5
0.4
0.5
23.5
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
1
2
2
2
2
2
2
2
2
2
2
3
3
4
4
4
5
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Input through 0.1F
capacitance
Low-level coupling
Low-level coupling
Horizontal transfer
clock voltage
Reset gate clock
voltage
Substrate clock voltage
Vertical transfer clock
voltage
Symbol
Min.
Typ.
Max.
Unit
Waveform
diagram
Remarks
DC Characteristics
Item
Supply current
I
DD
4
6
mA
Symbol
Min.
Typ.
Max.
Unit
Remarks
Item
Supply voltage
Protective transistor bias
Substrate clock
Reset gate clock
V
DD
V
L
SUB
RG
14.55
15.0
1
2
2
15.45
V
Symbol
Min.
Typ.
Max.
Unit
Remarks
1
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same power supply as the V
L
power supply for the V driver should be used.
2
Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated
within the CCD.
4
ICX259AL
R
H
R
H
H
2
H
1
C
H1
C
H2
C
HH
V
1
C
V12
V
2
V
4
V
3
C
V34
C
V23
C
V41
C
V13
C
V24
C
V1
C
V2
C
V4
C
V3
R
GND
R
4
R
1
R
3
R
2
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
R
RG
RG
C
RG
Reset gate clock equivalent circuit
Item
Capacitance between vertical transfer
clock and GND
C
V1
, C
V3
C
V2
, C
V4
C
V12
, C
V34
C
V23
, C
V41
C
V13
C
V24
C
H1
, C
H2
C
HH
C
RG
C
SUB
R
1
, R
3
R
2
, R
4
R
GND
R
H
R
RG
1200
1000
680
330
100
100
75
30
5
270
82
120
100
15
50
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Capacitance between vertical transfer
clocks
Capacitance between horizontal
transfer clock and GND
Capacitance between horizontal
transfer clocks
Capacitance between reset gate clock
and GND
Capacitance between substrate clock
and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Reset gate clock series resistor
Symbol
Min.
Typ.
Max.
Unit
Remarks
Clock Equivalent Circuit Constant
5
ICX259AL
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II
II
100%
90%
10%
0%
V
VT
tr
twh
tf
M
0V
M
2
V
1
V
3
V
2
V
4
V
VHH
V
VH
V
VHL
V
VHH
V
VHL
V
VH1
V
VL1
V
VLH
V
VLL
V
VL
V
VHH
V
VH3
V
VHL
V
VH
V
VHH
V
VHL
V
VL3
V
VL
V
VLL
V
VLH
V
VHH
V
VHH
V
VH
V
VHL
V
VHL
V
VH2
V
VLH
V
VL2
V
VLL
V
VL
V
VHH
V
VHH
V
VHL
V
VH4
V
VHL
V
VH
V
VL
V
VLH
V
VLL
V
VL4
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
6
ICX259AL
tr
twh
tf
90%
10%
twl
V
H
V
HL
(3) Horizontal transfer clock waveform
Point A
twl
V
RG
V
RGH
V
RGL
V
RGLH
RG waveform
V
RGLL
H
1
waveform
twh
tr
tf
V
H
/2 [V]
V
RGLm
(4) Reset gate clock waveform
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, V
RGL
is the average value of V
RGLH
and
V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval twh, then:
V
RG
= V
RGH
V
RGL
Negative overshoot level during the falling edge of RG is V
RGLm
.
(5) Substrate clock waveform
90%
100%
10%
0%
V
SUB
tr
twh
tf
M
M
2
V
SUB
(A bias generated within the CCD)
7
ICX259AL
Clock Switching Characteristics
Item
Readout clock
Vertical transfer
clock
Reset gate clock
Substrate clock
V
T
V
1
, V
2
,
V
3
, V
4
H
1
H
2
H
1
H
2
RG
SUB
2.3
26
26
11
1.5
2.5
28.5
28.5
5.38
13
1.8
26
26
28.5
28.5
5.38
51
0.5
6.5
6.5
0.01
0.01
3
9.5
9.5
0.5
15
0.5
6.5
6.5
0.01
0.01
3
250
9.5
9.5
0.5
s
ns
ns
s
ns
s
During
readout
1
2
During drain
charge
Symbol
twh
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
Unit
Remarks
1
When vertical transfer clock driver CXD1267AN is used.
2
tf
tr 2ns, and the cross-point voltage (V
CR
) for the H
1
rising side of the H
1
and H
2
waveforms must be
at least V
H
/2 [V].
H
o
r
i
z
o
n
t
a
l
t
r
a
n
s
f
e
r
c
l
o
c
k
During
imaging
During
parallel-serial
conversion
Item
Horizontal transfer clock
H
1
, H
2
22
26
ns
3
Symbol
two
Min.
Typ.
Max.
Unit
Remarks
3
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
8
ICX259AL
6
8
582 (V)
12
12
752 (H)
V
10
H
8
H
8
V
10
Effective pixel region
Ignored region
Zone 0,
I
Zone
II,
II
'
Image Sensor Characteristics
(Ta = 25C)
Item
Sensitivity 1
Sensitivity 2
Saturation signal
Smear
Video signal shading
Dark signal
Dark signal shading
Flicker
Lag
S1
S2
Vsat
Sm
SH
Vdt
Vdt
F
Lag
720
2200
1000
1000
3200
115
98
20
25
2
1
2
0.5
mV
mV
mV
dB
%
%
mV
mV
%
%
1
2
3
4
5
5
6
7
8
9
Ta = 60C
Zone 0 and
I
Zone 0 to
II
'
Ta = 60C
Ta = 60C
Symbol
Min.
Typ.
Max.
Unit
Measurement method
Remarks
Zone Definition of Video Signal Shading
9
ICX259AL
Image Sensor Characteristics Measurement Method
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black (OB) level is used as the reference for the signal output, and the value measured at point [
A] in the
drive circuit example is used.
Definition of standard imaging conditions
1) Standard imaging condition
I
:
Use a pattern box (luminance: 706cd/m
2
, color temperature of 3200K halogen source) as a subject.
(Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut
filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity testing luminous intensity.
2) Standard imaging condition
II
:
Indicate the state which removes an IR cut filter of standard imaging condition
I
.
3) Standard imaging condition
III
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity 1
Set to standard imaging condition
I
. After selecting the electronic shutter mode with a shutter speed of
1/250s, measure the signal output (Vs
1
) at the center of the screen and
substitute the value into the following formula.
2. Sensitivity 2
Set to standard imaging condition
II
. After selecting the electronic shutter mode with a shutter speed of
1/1000s, measure the signal output (Vs
2
) at the center of the screen and
substitute the value into the following formula.
3. Saturation signal
Set to standard imaging condition
III
. After adjusting the luminous intensity to 10 times the intensity with the
average value of the signal output, 200mV, measure the minimum value of the signal output.
4. Smear
Set to standard imaging condition
III
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with the average value of the signal output, 200mV. When the readout clock is
stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure
the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula.
S1 = Vs
1
[mV]
50
250
S2 = Vs
2
[mV]
50
1000
Sm = 20
log
[dB] (1/10V method conversion value)
500
1
200
YSm
10
1
10
ICX259AL
5. Video signal shading
Set to standard imaging condition
III
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity
so that the average value of the signal output is 200mV. Then measure the maximum (Vmax [mV]) and
minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula.
SH = (Vmax Vmin)/200
100 [%]
6. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
7. Dark signal shading
After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
8. Flicker
Set to standard imaging condition
III
. Adjust the luminous intensity so that the average value of the signal
output is 200mV, and then measure the difference in the signal level between fields (
Vf [mV]). Then
substitute the value into the following formula.
F = (
Vf/200)
100 [%]
9. Lag
Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/200)
100 [%]
Vlag (lag)
Signal output 200mV
Light
FLD
V1
Strobe light
timing
Output
11
ICX259AL
C
X
D
1
2
6
7
A
N
1
2
3
4
5
6
7
8
9
1
0
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
2
2
/
1
6
V
0
.
1
7
.
0
V
3
.
3
/
1
6
V
1
/
3
5
V
0
.
1
1
M
I
C
X
2
5
9
(
B
O
T
T
O
M
V
I
E
W
)
1
4
1
3
1
2
1
1
1
0
9
1
2
3
4
5
6
7
H
1
H
2
RG
V
L
SU
B
GN
D
V
DD
V
4
V
3
V
2
V
1
GN
D
NC
V
OU
T
2
2
/
2
0
V
C
C
D
O
U
T
1
5
V
X
S
U
B
X
V
2
X
V
1
X
S
G
1
X
V
3
X
S
G
2
X
V
4
H
1
H
2
R
G
2
2
0
0
p
1
0
0
k
3
.
3
/
2
0
V
0
.
0
1
1
0
0
3
.
9
k
2
S
K
5
2
3
[
A
]
8
1
5
1
6
NC
NC
Drive Circuit
12
ICX259AL
0
0.2
0.4
0.6
0.8
1.0
400
500
600
700
800
900
1000
Wave Length [nm]
R
e
l
a
t
i
v
e
R
e
s
p
o
n
s
e
0.1
0.3
0.5
0.7
0.9
Unit : s
Odd Field
Even Field
V1
V2
V3
V4
V1
V2
V3
V4
2.6
2.6
2.6 2.6
1.5
33.6
0.2
Spectral Sensitivity Characteristics
(excludes both lens characteristics and light source characteristics)
Sensor Readout Clock Timing Chart
13
ICX259AL
F
L
D
V
D
B
L
K
H
D
V
1
V
2
V
3
V
4
C
C
D
O
U
T
62
0
62
5
1
2
3
4
5
15
20
25
31
0
32
0
33
5
33
0
34
0
5
8
1
5
8
2
1
3
5
2
4
6
1
3
5
2
4
6
5
8
2
5
8
1
2
1
4
3
6
5
10
31
5
32
5
2
1
4
3
6
5
Drive Timing Chart (Vertical Sync)
14
ICX259AL
74
5
75
0
1
3
5
10
20
30
40
1
2
3
5
10
20
22
1
2
3
1
2
3
10
20
H
D
B
L
K
H
1
H
2
R
G
V
1
V
2
V
3
V
4
S
U
B
75
2
Drive Timing Chart (Horizontal Sync)
15
ICX259AL
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
Compressive strength
50N
Cover glass
Plastic package
50N
1.2Nm
Torsional strength
16
ICX259AL
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
exceeding the normal using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
d) This CCD image sensor has sensitivity in the near infrared area. Its focus may not match in the same
condition under visible light /near infrared light because of aberration. Incident light component of long
wavelength which transmits the silicon substrate may have bad influence upon image.
17
ICX259AL
Package Outline
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