Description
The ICX205AL is a diagonal 8mm (Type 1/2)
interline CCD solid-state image sensor with a square
pixel array and 1.45M effective pixels. Progressive
scan allows all pixels' signals to be output
independently within approximately 1/7.5 second.
Also, the adoption of high frame rate readout mode
supports 30 frames per second. This chip features
an electronic shutter with variable charge-storage
time which makes it possible to realize full-frame still
image without a mechanical shutter. High sensitivity
and low dark current are achieved through the
adoption of HAD (Hole-Accumulation Diode) sensors.
This chip is suitable for applications such as
electronic still cameras, PC input cameras, etc.
Features
Progressive scan allows individual readout of the
image signals from all pixels.
High horizontal and vertical resolution (both approx.
1024TV-lines) still image without a mechanical shutter.
Supports high frame rate readout mode
(effective 256 lines output, 30 frame/s)
Square pixel
Horizontal drive frequency: 14.318MHz
No voltage adjustments
(reset gate and substrate bias are not adjusted.)
High resolution, high sensitivity, low dark current
Low smear, excellent antiblooming characteristics
Continuous variable-speed shutter
Device Structure
Interline CCD image sensor
Image size:
Diagonal 8mm (Type 1/2)
Total number of pixels:
1434 (H)
1050 (V) approx. 1.50M pixels
Number of effective pixels:
1392 (H)
1040 (V) approx. 1.45M pixels
Number of active pixels:
1360 (H)
1024 (V) approx. 1.40M pixels (7.959mm diagonal)
Chip size:
7.60mm (H)
6.20mm (V)
Unit cell size:
4.65m (H)
4.65m (V)
Optical black:
Horizontal (H) direction: Front 2 pixels, rear 40 pixels
Vertical (V) direction:
Front 8 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 20
Vertical 3
Substrate material:
Silicon
Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras
1
E98619A99
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX205AL
20 pin DIP (Cer-DIP)
Pin 1
V
2
40
2
8
Pin 11
H
Optical black position
(Top View)
2
ICX205AL
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
V
1
V
2A
V
2B
V
3
NC
NC
GND
NC
GND
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
GND
Signal output
11
12
13
14
15
16
17
18
19
20
V
DD
GND
SUB
NC
C
SUB
NC
V
L
RG
H
1
H
2
Supply voltage
GND
Substrate clock
Substrate bias
1
Protective transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
Pin Description
V
e
r
t
i
c
a
l
r
e
g
i
s
t
e
r
Note)
Horizontal register
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
V
D
D
G
N
D
S
U
B
N
C
C
S
U
B
N
C
V
L
R
G
H
1
H
2
V
O
U
T
G
N
D
N
C
G
N
D
N
C
N
C
V
3
V
2
B
V
2
A
V
1
Note)
: Photo sensor
Block Diagram and Pin Configuration
(Top View)
1
DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance
of 0.1F.
3
ICX205AL
Against
SUB
Against GND
Against V
L
Between input
clock pins
Storage temperature
Operating temperature
Absolute Maximum Ratings
40 to +10
50 to +15
50 to +0.3
40 to +0.3
25 to
0.3 to +18
10 to +18
10 to +15
0.3 to +28
0.3 to +15
to +15
16 to +16
16 to +16
30 to +80
10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
V
C
C
V
DD
, V
OUT
,
RG
SUB
V
2A
, V
2B
SUB
V
1
, V
3
, V
L
SUB
H
1
, H
2
, GND
SUB
C
SUB
SUB
V
DD
, V
OUT
,
RG, C
SUB
GND
V
1
, V
2A
, V
2B
, V
3
GND
H
1
, H
2
GND
V
2A
, V
2B
V
L
V
1
, V
3
, H
1
, H
2
, GND V
L
Voltage difference between vertical clock input pins
H
1
H
2
H
1
, H
2
V
3
Item
Ratings
Unit Remarks
1
+24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
+16V (Max.) is guaranteed for turning on or off power supply.
1
4
ICX205AL
Clock Voltage Conditions
Item
Readout clock voltage
V
VT
V
VH02A
V
VH1
, V
VH2A
,
V
VH2B
, V
VH3
V
VL1
, V
VL2A
,
V
VL2B
, V
VL3
V
1
, V
2A
,
V
2B
, V
3
| V
VL1
V
VL3
|
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
RG
V
RGLH
V
RGLL
V
RGL
V
RGLm
V
SUB
14.55
0.05
0.2
8.4
7.6
4.75
0.05
3.0
22.15
15.0
0
0
8.0
8.0
5.0
0
3.3
23.0
15.45
0.05
0.05
7.6
8.4
0.1
0.9
1.3
1.0
0.9
5.25
0.05
5.5
0.4
0.5
23.85
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
1
2
2
2
2
2
2
2
2
2
3
3
4
4
4
5
V
VH
= V
VH02A
V
VL
= (V
VL1
+ V
VL3
)/2
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Low-level coupling
Low-level coupling
Horizontal transfer
clock voltage
Reset gate clock
voltage
Substrate clock voltage
Vertical transfer clock
voltage
Symbol
Min.
Typ.
Max.
Unit
Waveform
diagram
Remarks
Bias Conditions
Item
Supply voltage
Protective transistor bias
Substrate clock
Reset gate clock
V
DD
V
L
SUB
RG
14.55
15.0
1
2
2
15.45
V
Symbol
Min.
Typ.
Max.
Unit
Remarks
DC Characteristics
Item
Supply current
I
DD
5.5
mA
Symbol
Min.
Typ.
Max.
Unit
Remarks
1
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same power supply as the V
L
power supply for the V driver should be used.
2
Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated
within the CCD.
5
ICX205AL
Clock Equivalent Circuit Constant
Item
Capacitance between vertical transfer clock and
GND
C
V1
C
V2A
C
V2B
C
V3
C
V12A
, C
V2B1
C
V2A3
, C
V32B
C
V13
C
H1
, C
H2
C
HH
C
RG
C
SUB
R
1
R
2A
, R
3
R
2B
R
GND
R
H
R
RG
2200
1800
6800
3300
1200
1200
2200
47
100
8
680
36
56
43
30
15
20
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock
and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Reset gate clock series resistor
Symbol
Min.
Typ.
Max.
Unit
Remarks
R
H
R
H
H
2
H
1
C
H1
C
H2
C
HH
V
1
C
V12A
V
2A
V
2B
V
3
C
V32B
C
V2A3
C
V2B1
C
V13
C
V1
C
V2A
C
V2B
C
V3
R
GND
R
2B
R
1
R
3
R
2A
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
R
RG
RG
C
RG
Reset gate clock equivalent circuit
6
ICX205AL
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II
II
100%
90%
10%
0%
V
VT
tr
twh
tf
M
0V
M
2
V
1
V
3
V
2A
, V
2B
V
VH1
V
VHH
V
VH
V
VHL
V
VLH
V
VL1
V
VL01
V
VL
V
VLL
V
VH3
V
VHH
V
VH
V
VHL
V
VLH
V
VL03
V
VL
V
VLL
V
V1
= V
VH1
V
VL01
V
V2A
= V
VH02A
V
VL2A
V
V2B
= V
VH02B
V
VL2B
V
V3
= V
VH3
V
VL03
V
VH
= V
VH02A
V
VL
= (V
VL01
+ V
VL03
)/2
V
VL3
= V
VL03
V
VLH
V
VL2A
, V
VL2B
V
VLL
V
VL
V
VH
V
VHH
V
VH02A
, V
VH02B
V
VH2A
, V
VH2B
V
VHL
V
T
Note) Readout clock is used by composing vertical transfer clocks V
2A
and V
2B
.
7
ICX205AL
twh
tf
tr
90 %
10 %
V
HL
twl
H
1
two
H
2
V
RGL
V
RGLL
V
RGLH
twl
V
RGH
RG waveform
V
RGLm
tr
twh
tf
V
CR
(3) Horizontal transfer clock waveform
Cross-point voltage for the H
1
rising side of the horizontal transfer clocks H
1
and H
2
waveforms is V
CR
.
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
(4) Reset gate clock waveform
Point A
V
RG
V
H
V
H
2
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG.
In addition, V
RGL
is the average value of V
RGLH
and V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval twh, then:
V
RG
= V
RGH
V
RGL
.
Negative overshoot level during the falling edge of RG is V
RGLm
.
(5) Substrate clock waveform
90%
100%
10%
0%
(A bias generated within the CCD)
tr
twh
tf
M
M
2
V
SUB
V
SUB
8
ICX205AL
Readout clock
Vertical transfer
clock
During
imaging
During
parallel-serial
conversion
Reset gate clock
Substrate clock
V
T
V
1
, V
2A
,
V
2B
, V
3
H
1
H
2
H
1
H
2
RG
SUB
2.3
20
20
11
2.5
25
25
13
2.2
20
20
25
25
51
0.5
10
10
0.01
0.01
3
15
15
0.5
15
0.5
10
10
0.01
0.01
3
450
15
15
0.5
s
ns
ns
s
ns
s
During readout
1
2
During drain
charge
H
o
r
i
z
o
n
t
a
l
t
r
a
n
s
f
e
r
c
l
o
c
k
Item
Symbol
twh
twl
tr
tf
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
Unit
Remarks
Horizontal transfer clock
H
1
, H
2
16
20
ns
Item
Symbol
two
Min. Typ. Max.
Unit
Remarks
1
When vertical transfer clock driver CXD1267AN
2 is used.
2
tf
tr 2ns, and the cross-point voltage (V
CR
) for the H
1
rising side of the H
1
and H
2
waveforms must be
at least V
H
/2 [V].
Clock Switching Characteristics
0
0.2
0.4
0.6
0.8
1
400
500
600
700
800
900
1000
Wave Length [nm]
R
e
l
a
t
i
v
e
R
e
s
p
o
n
s
e
Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)
9
ICX205AL
Image Sensor Characteristics
(Ta = 25C)
Item
Sensitivity
Saturation signal
Smear
Video signal shading
Dark signal
Dark signal shading
Lag
S
Vsat
Sm
SH
Vdt
Vdt
Lag
360
450
450
0.001
0.0025
20
25
16
4
0.5
mV
mV
%
%
%
mV
mV
%
1
2
3
4
4
5
6
7
1/30s accumulation
Ta = 60C
No electronic shutter
Zone 0 and
I
Zone 0 to
II'
Ta = 60C
Ta = 60C
Symbol
Min.
Typ.
Max.
Unit
Measurement
method
Remarks
Zone Definition of Video Signal Shading
8
8
1040 (V)
16
16
1392 (H)
V
10
H
8
H
8
V
10
Zone 0,
I
Zone
II
,
II
'
Effective pixel region
Ignored region
Measurement System
CCD
C.D.S
S/H
AMP
CCD signal output [
A]
Signal output [
B]
Note) Adjust the amplifier gain so that the gain between [
A] and [
B] equals 1.
10
ICX205AL
Image Sensor Characteristics Measurement Method
Readout modes
The diagram below shows the output methods for the following two readout modes.
7
6
5
4
3
2
1
V
OUT
12
11
10
9
8
16
15
14
13
7
6
5
4
3
2
1
V
OUT
12
11
10
9
8
15
14
13
16
Progressive scan mode
High frame rate readout mode
Note) Blacked out portions in the diagram indicate pixels which are not read out.
Output starts from the line 1 in high frame rate readout mode.
1. Progressive scan mode
In this mode, all pixel signals are output in non-interlace format in 1/7.5s.
The vertical resolution is approximately 1024TV-lines and all pixel signals within the same exposure period
are read out simultaneously, making this mode suitable for high resolution image capturing.
2. High frame rate readout mode
All effective areas are scanned in approximately 1/30s by reading out two out of eight lines (1st and 4th
lines, 9th and 12th lines). The vertical resolution is approximately 256TV-lines.
This readout mode emphasizes processing speed over vertical resolution.
11
ICX205AL
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the progressive scan
mode, bias and clock voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value measured at
point [
B] of the measurement system.
Definition of standard imaging conditions
1) Standard imaging condition
I
:
Use a pattern box (luminance : 706cd/m
2
, color temperature of 3200K halogen source) as a subject.
(pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut
filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity testing luminous intensity.
2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity
Set to standard imaging condition
I
. After selecting the electronic shutter mode with a shutter speed of
1/250s, measure the signal output (V
S
) at the center of the screen, and substitute the value into the
following formula.
S = V
S
[mV]
2. Saturation signal
Set to standard imaging condition
II
. After adjusting the luminous intensity to 10 times the intensity with the
average value of the signal output, 150mV, measure the minimum value of the signal output.
3. Smear
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, first adjust the luminous
intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the
readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H
blankings, measure the maximum value (Vsm [mV]) of the signal output and substitute the value into the
following formula.
Sm =
100 [%] (1/10V method conversion value)
4. Video signal shading
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity
so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and
minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula.
SH = (Vmax Vmin)/150
100 [%]
5. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
250
30
Vsm
150
1
500
1
10
12
ICX205AL
6. Dark signal shading
After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
7. Lag
Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/150)
100 [%]
Vlag (Lag)
Signal output 150mV
Light
VD
V2A
Strobe light
timing
Output
13
ICX205AL
Drive Circuit
1
5
V
X
V
1
X
V
2
A
X
S
G
1
X
S
U
B
H
2
H
1
R
G
1
2
3
4
5
6
7
8
9
1
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
C
X
D
1
2
6
7
A
N
2
0
1
2
3
4
5
6
7
8
9
1
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
2
0
2
2
/
2
0
V
1
/
3
5
V
1
0
0
k
H
2
H
1
RG
V
L
NC
GN
D
V
DD
1
2
3
4
5
6
7
8
9
10
V
1
V
2A
V
2B
V
3
NC
GN
D
NC
V
OU
T
19
18
17
16
15
14
13
12
11
20
I
C
X
2
0
5
(
B
o
t
t
o
m
V
i
e
w
)
0
.
1
2
2
/
1
6
V
1
M
0
.
1
2
2
0
0
P
2
2
/
2
0
V
0
.
0
1
3
.
9
k
C
C
D
O
U
T
2
S
K
5
2
3
1
0
0
SU
B
C
SU
B
NC
8
.
0
V
X
V
3
X
V
2
B
X
S
G
2
GN
D
NC
C
X
D
1
2
6
7
A
N
0
.
1
14
ICX205AL
X
V
1
X
V
2
A
/
X
V
2
B
X
V
3
H
D
V
1
V
2
A
/
V
2
B
V
3
5
5
.
8
s
(
8
0
0
b
i
t
s
)
3
.
4
9
s
(
5
0
b
i
t
s
)
1
3
9
n
s
(
2
b
i
t
s
)
X
S
G
1
/
X
S
G
2
S
e
n
s
o
r
r
e
a
d
o
u
t
c
l
o
c
k
s
X
S
G
1
a
n
d
X
S
G
2
a
r
e
u
s
e
d
b
y
c
o
m
p
o
s
i
n
g
X
V
2
A
a
n
d
X
V
2
B
.
Sensor Readout Clock Timing Chart Progressive Scan Mode
15
ICX205AL
H
D
V
1
V
2
A
V
3
5
5
.
8
s
(
8
0
0
b
i
t
s
)
1
3
9
n
s
(
2
b
i
t
s
)
V
2
B
3
.
4
9
s
(
5
0
b
i
t
s
)
5
.
0
s
(
7
2
b
i
t
s
)
X
V
1
X
V
2
A
/
X
V
2
B
X
V
3
X
S
G
1
X
S
G
2
S
e
n
s
o
r
r
e
a
d
o
u
t
c
l
o
c
k
X
S
G
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Sensor Readout Clock Timing Chart High Frame Rate Readout Mode
16
ICX205AL
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Drive Timing Chart (Vertical Sync) Progressive Scan Mode
17
ICX205AL
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Drive Timing Chart (Vertical Sync) High Frame Rate Readout Mode
18
ICX205AL
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Drive Timing Chart (Horizontal Sync) Progressive Scan Mode
19
ICX205AL
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Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode
20
ICX205AL
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
Compressive strength
39N
0.9Nm
Upper ceramic
Lower ceramic
29N
Low melting
point glass
29N
Shearing strength
Tensile strength
Torsional strength
21
ICX205AL
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation,
use either an elastic load, such as a spring plate, or an adhesive.
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to other locations as a precaution.
d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not
to perform the following actions as this may cause cracks.
Applying repeated bending stress to the outer leads.
Heating the outer leads for an extended period with a soldering iron.
Rapidly cooling or heating the package.
Applying any load or impact to a limited portion of the low melting point glass using tweezers or other
sharp tools.
Prying at the upper or lower ceramic using the low melting point glass as a fulcrum.
Note that the same cautions also apply when removing soldered products from boards.
e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.
(reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
exceeding the normal using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
22
ICX205AL
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A
Package Outline
Unit: mm
PDF 
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