ChipFind - документация

Электронный компонент: ICX249AL

Скачать:  PDF   ZIP
1
Description
The ICX249AL is an interline CCD solid-state image
sensor suitable for CCIR black-and-white video
cameras with a diagonal 8mm (Type 1/2) system.
Sensitivity, smear, D-range, S/N and other
characteristics from visible light area to near infrared
light area, have been greatly improved compared
with the ICX039DLA through the adoption of EXview
HAD CCD
TM
technology.
This chip features a field period readout system and
an electronic shutter with variable charge-storage time.
This chip is compatible with and can replace the
ICX039DLA.
Features
Sensitivity in the near infrared light area
(+12dB compared with the ICX039DLA,
= 945nm)
High sensitivity
(+9dB compared with the ICX039DLA, without IR cut filter)
Low smear (15dB compared with the ICX039DLA)
High D range (+2dB compared with the ICX039DLA)
High S/N
High resolution and low dark current
Excellent antiblooming characteristics
Continuous variable-speed shutter
Substrate bias:
Adjustment free (external adjustment also possible with 6 to 14V)
Reset gate pulse:
5Vp-p adjustment free (drive also possible with 0 to 9V)
Horizontal register:
5V drive
Device Structure
Interline CCD image sensor
Image size:
Diagonal 8mm (Type 1/2)
Number of effective pixels:
752 (H)
582 (V) approx. 440K pixels
Total number of pixels:
795 (H)
596 (V) approx. 470K pixels
Chip size:
7.95mm (H)
6.45mm (V)
Unit cell size:
8.6m (H)
8.3m (V)
Optical black:
Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction:
Front 12 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 22
Vertical 1 (even fields only)
Substrate material:
Silicon
ICX249AL
E98729A99
Diagonal 8mm (Type 1/2) CCD Image Sensor for CCIR Black-and-White Video Cameras
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
20 pin DIP (Cer-DIP)
Pin 1
V
3
40
2
12
Pin 11
H
Optical black position
(Top View)
TM
EXview HAD CCD is a trademark of Sony Corporation EXview HAD CCD is a CCD that drastically improves light efficiency by including
near infrared light region as a basic structure of HAD (Hole-Accnmulation Diode) sensor.
2
ICX249AL
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
V
4
V
3
V
2
SUB
GND
V
1
V
L
GND
V
DD
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Substrate clock
GND
Vertical register transfer clock
Protective transistor bias
GND
Output circuit supply voltage
Signal output
11
12
13
14
15
16
17
18
19
20
V
GG
V
DSUB
V
SS
GND
GND
RD
RG
NC
H
1
H
2
Output circuit gate bias
Substrate bias circuit supply voltage
Output circuit source
GND
GND
Reset drain bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Note)
Note) : Photo sensor
G
N
D
V
L
V
1
G
N
D
S
U
B
V
2
V
3
V
4
V
G
G
V
D
S
U
B
V
S
S
G
N
D
G
N
D
R
D
R
G
N
C
Horizontal Register
V
e
r
t
i
c
a
l

R
e
g
i
s
t
e
r
17
18
19
20
V
D
D
V
O
U
T
H
1
H
2
Block Diagram and Pin Configuration
(Top View)
Pin Description
3
ICX249AL
Item
0.3 to +50
0.3 to +18
55 to +10
15 to +20
to +10
to +15
to +17
17 to +17
10 to +15
55 to +10
65 to +0.3
0.3 to +30
30 to +80
10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
C
C
1
Ratings
Unit
Remarks
Absolute Maximum Ratings
1
+27V (Max.) when clock width < 10s, clock duty factor < 0.1%.
Substrate clock
SUB
GND
V
DD
, V
RD
, V
DSUB
, V
OUT
, V
SS
GND
Supply voltage
V
DD
, V
RD
, V
DSUB
, V
OUT
, V
SS
SUB
V
1
, V
2
, V
3
, V
4
GND
Clock input voltage
V
1
, V
2
, V
3
, V
4
SUB
Voltage difference between vertical clock input pins
Voltage difference between horizontal clock input pins
H
1
, H
2
V
4
RG
, V
GG
GND
RG
, V
GG
SUB
V
L
SUB
Pins other than GND and
SUB
V
L
Storage temperature
Operating temperature
4
ICX249AL
Item
V
DD
V
RD
V
GG
V
SS
V
L
V
DSUB
V
SUB
V
SUB
14.55
14.55
1.75
6.0
3
15.0
15.0
2.0
3
4
15.45
15.45
2.25
14.0
+3
V
V
V
V
%
V
RD
= V
DD
5
5
Symbol
Min.
Typ.
Max.
Unit
Remarks
Bias Conditions 2 [when used in substrate bias external adjustment mode]
Output circuit supply voltage
Reset drain voltage
Output circuit gate voltage
Output circuit source
Protective transistor bias
Substrate bias circuit supply voltage
Substrate voltage adjustment range
Substrate voltage adjustment precision
3
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same power supply as the V
L
power supply for the V driver should be used. (When CXD1267AN is used.)
4
Connect to GND or leave open.
5
The setting value of the substrate voltage (V
SUB
) is indicated on the back of the image sensor by a special
code. When adjusting the substrate voltage externally, adjust the substrate voltage to the indicated voltage.
The adjustment precision is 3%. However, this setting value has not significance when used in substrate
bias internal generation mode.
V
SUB
code -- one character indication
Code and optimal setting correspond to each other as follows.
DC Characteristics
Item
Output circuit supply current
I
DD
5.0
10.0
mA
Symbol
Min.
Typ.
Max.
Unit
Remarks
V
SUB
code
Optimal setting 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0
E
f
G
h
J
K
L
m
N
P
Q
R
S
T
U
V
W
<Example> "L"
V
SUB
= 9.0V
Item
V
DD
V
RD
V
GG
V
SS
V
L
V
DSUB
SUB
14.55
14.55
1.75
14.55
15.0
15.0
2.0
1
15.0
2
15.45
15.45
2.25
15.45
V
V
V
V
V
RD
= V
DD
Symbol
Min.
Typ.
Max.
Unit
Remarks
Bias Conditions 1 [when used in substrate bias internal generation mode]
Output circuit supply voltage
Reset drain voltage
Output circuit gate voltage
Output circuit source
Protective transistor bias
Substrate bias circuit supply voltage
Substrate clock
Grounded with 390
resistor
1
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same power supply as the V
L
power supply for the V driver should be used. (When CXD1267AN is used.)
2
Do not apply a DC bias to the substrate clock pin, because a DC bias is generated within the CCD.
Grounded with 390
resistor
5
ICX249AL
Item
Readout clock voltage
V
VT
V
VH1
, V
VH2
V
VH3
, V
VH4
V
VL1
, V
VL2
,
V
VL3
, V
VL4
V
V
| V
VH1
V
VH2
|
V
VH3
V
VH
V
VH4
V
VH
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
RGL
V
RG
V
RGLH
V
RGLL
V
SUB
14.55
0.05
0.2
9.6
8.3
0.25
0.25
4.75
0.05
4.5
23.0
15.0
0
0
9.0
9.0
5.0
0
1
5.0
24.0
15.45
0.05
0.05
8.5
9.65
0.1
0.1
0.1
0.5
0.5
0.5
0.5
5.25
0.05
5.5
0.8
25.0
V
V
V
V
Vp-p
V
V
V
V
V
V
V
Vp-p
V
V
Vp-p
V
Vp-p
1
2
2
2
2
2
2
2
2
2
2
2
3
3
4
4
4
5
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Low-level coupling
Horizontal transfer
clock voltage
Reset gate clock
voltage
1
Substrate clock voltage
Vertical transfer clock
voltage
Symbol
Min.
Typ. Max. Unit
Waveform
diagram
Remarks
Item
Symbol
Min.
Typ. Max. Unit
Waveform
diagram
Remarks
1
Input the reset gate clock without applying a DC bias. In addition, the reset gate clock can also be driven
with the following specifications.
Reset gate clock
voltage
V
RGL
V
RG
0.2
8.5
0
9.0
0.2
9.5
V
Vp-p
4
4
Clock Voltage Conditions
6
ICX249AL
Clock Equivalent Circuit Constant
Item
Capacitance between vertical transfer clock
and GND
C
V1
, C
V3
C
V2
, C
V4
C
V12
, C
V34
C
V23
, C
V41
C
H1
C
H2
C
HH
C
RG
C
SUB
R
1
, R
2
, R
3
, R
4
R
GND
1800
2200
450
270
64
62
47
8
400
68
15
pF
pF
pF
pF
pF
pF
pF
pF
pF

Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock
and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Symbol
Min.
Typ.
Max.
Unit Remarks
H
2
H
1
C
H1
C
H2
C
HH
V
1
C
V12
V
2
V
4
V
3
C
V34
C
V23
C
V41
C
V1
C
V2
C
V4
C
V3
R
GND
R
4
R
1
R
3
R
2
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
7
ICX249AL
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II
II
100%
90%
10%
0%
V
VT
tr
twh
tf
M
0V
M
2
V
1
V
3
V
2
V
4
V
VHH
V
VH
V
VHL
V
VHH
V
VHL
V
VH1
V
VL1
V
VLH
V
VLL
V
VL
V
VHH
V
VH3
V
VHL
V
VH
V
VHH
V
VHL
V
VL3
V
VL
V
VLL
V
VLH
V
VHH
V
VHH
V
VH
V
VHL
V
VHL
V
VH2
V
VLH
V
VL2
V
VLL
V
VL
V
VHH
V
VHH
V
VHL
V
VH4
V
VHL
V
VH
V
VL
V
VLH
V
VLL
V
VL4
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
8
ICX249AL
(3) Horizontal transfer clock waveform
tr
twh
tf
90%
10%
twl
V
H
V
HL
(4) Reset gate clock waveform
Point A
twl
V
RG
V
RGH
V
RGL
+ 0.5V
V
RGL
+2.5V
V
RGLH
RG waveform
V
RGLL
H
1
waveform
twh
tr
tf
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, V
RGL
is the average value of V
RGLH
and
V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval twh, then:
V
RG
= V
RGH
V
RGL
9
ICX249AL
(5) Substrate clock waveform
90%
100%
10%
0%
V
SUB
tr
twh
tf
M
M
2
V
SUB
Clock Switching Characteristics
Item
Readout clock
Vertical transfer
clock
During
imaging
During parallel-
serial
conversion
Reset gate clock
Substrate clock
V
T
V
1
, V
2
,
V
3
, V
4
H
H
1
H
2
RG
SUB
2.3
11
1.5
2.5
20
5.38
13
1.8
20
5.38
51
0.5
15
0.01
0.01
3
19
0.5
0.5
15
15
0.01
0.01
3
250
19
0.5
s
ns
ns
s
ns
s
During
readout
1
2
During drain
charge
Symbol
twh
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
Unit
Remarks
1
When vertical transfer clock driver CXD1267AN is used.
2
tf
tr 2ns.
Item
Horizontal transfer clock
H
1
, H
2
16
20
ns
3
Symbol
two
Min.
Typ.
Max.
Unit
Remarks
3
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
H
o
r
i
z
o
n
t
a
l
t
r
a
n
s
f
e
r
c
l
o
c
k
10
ICX249AL
Image Sensor Characteristics
(Ta = 25C)
Item
Sensitivity
Saturation signal
Smear
Video signal shading
Dark signal
Dark signal shading
Flicker
Lag
S
Vsat
Sm
SH
Vdt
Vdt
F
Lag
4500
900
5500
0.00005 0.00018
20
25
2
1
2
0.5
mV
mV
%
%
%
mV
mV
%
%
1
2
3
4
4
5
6
7
8
1
Ta = 60C
Zone 0 and
I
Zone 0 to
II
'
Ta = 60C
Ta = 60C
Symbol
Min.
Typ.
Max.
Unit
Measurement method
Remarks
Zone Definition of Video Signal Shading
6
8
582 (V)
12
12
752 (H)
V
10
H
8
H
8
V
10
Effective pixel region
Zone 0,
I
Zone
II
,
II
'
Ignored region
1
Sensitivity data is the conversion value by Measurement method 1.
11
ICX249AL
Image Sensor Characteristics Measurement Method
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions. (When used with substrate bias external adjustment, set the substrate voltage to the
value indicated on the device and connect V
DSUB
pin to GND or leare it open.)
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black (OB) level is used as the reference for the signal output, and the value measured at point [
A] in the
drive circuit example is used.
Definition of standard imaging conditions
1) Standard imaging condition
I
:
Use a pattern box (luminance: 706cd/m
2
, color temperature of 3200K halogen source) as a subject.
(Pattern for evaluation is not applicable.) Use a testing standard lens and image at F8. The luminous
intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous
intensity. (IR cut filter is not applicable.)
2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens and the luminous intensity is adjusted to the value indicated in each testing
item by the lens diaphragm. (IR cut filter is not applicable.)
1. Sensitivity
Set to standard imaging condition
I
. After selecting the electronic shutter mode with a shutter speed of
1/500s, measure the signal output (Vs) at the center of the screen and substitute the value into the
following formula.
2. Saturation signal
Set to standard imaging condition
II
. After adjusting the luminous intensity to 10 times the intensity with the
average value of the signal output, 200mV, measure the minimum value of the signal output.
3. Smear
Set to standard imaging condition
II
. Adjust the luminous intensity to 500 times the intensity with the
average value of the signal output, 200mV. When the readout clock is stopped and the charge drain is
executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV])
of the signal output and substitute the value into the following formula.
4. Video signal shading
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the signal
output is 200mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal
output and substitute the values into the following formula.
SH = (Vmax Vmin)/200
100 [%]
Sm =
100 [%] (1/10V method conversion value)
200
VSm
500
1
10
1
S = Vs
[mV]
50
500
12
ICX249AL
5. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
6. Dark signal shading
After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
7. Flicker
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the signal
output is 200mV, and then measure the difference in the signal level between fields (
Vf [mV]). Then
substitute the value into the following formula.
F = (
Vf/200)
100 [%]
8. Lag
Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/200)
100 [%]
Vlag (lag)
Signal output 200mV
Light
FLD
V1
Strobe light
timing
Output
13
ICX249AL
1
5
V
X
S
U
B
X
V
2
X
V
1
X
S
G
1
X
V
3
X
S
G
2
X
V
4
H
2
H
1
R
G
0
.
0
1
9
V
3
.
3
/
1
6
V
1
M
1
1
0
0
k
1
/
3
5
V
2
2
/
1
6
V
2
2
/
2
0
V
C
X
D
1
2
6
7
A
N
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
1
2
3
4
5
6
7
8
9
1
0
1
2
3
4
5
6
7
8
9
1
0
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
3
9
0
4
7
/
6
.
3
V
3
.
3
/
2
0
V
0
.
0
1
0
.
0
1
1
8
0
k
1
/
6
.
3
V
2
7
k
3
.
9
k
C
C
D

O
U
T
[
A
]
1
0
0
H
2
H
1
NC
RG
RD
GN
D
GN
D
Vs
s
V
DS
UB
V
GG
V
4
V
3
V
2
SU
B
GN
D
V
1
V
L
GN
D
V
DD
V
OU
T
I
C
X
2
4
9
A
L
(
B
O
T
T
O
M

V
I
E
W
)
Drive Circuit 1 (substrate bias internal generation mode)
14
ICX249AL
1
5
V
X
S
U
B
X
V
2
X
V
1
X
S
G
1
X
V
3
X
S
G
2
X
V
4
H
2
H
1
R
G
0
.
0
1
9
V
3
.
3
/
1
6
V
1
M
1
5
k
4
7
k
1
5
k
0
.
1
3
9
k
0
.
1
2
7
0
k
2
7
k
5
6
k
0
.
1
1
0
0
k
1
/
3
5
V
1
/
3
5
V
1
/
3
5
V
2
2
/
1
6
V
2
2
/
2
0
V
C
X
D
1
2
6
7
A
N
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
1
2
4
5
6
7
8
9
1
0
1
2
3
4
5
6
7
8
9
1
0
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
3
9
0
4
7
/
6
.
3
V
3
.
3
/
2
0
V
0
.
0
1
0
.
0
1
1
8
0
k
1
/
6
.
3
V
2
7
k
3
.
9
k
C
C
D

O
U
T
[
A
]
1
0
0
H
2
H
1
NC
RG
RD
GN
D
GN
D
Vs
s
V
DS
UB
V
GG
V
4
V
3
V
2
SU
B
GN
D
V
1
V
L
GN
D
V
DD
V
OU
T
3
I
C
X
2
4
9
A
L
(
B
O
T
T
O
M

V
I
E
W
)
Drive Circuit 2 (substrate bias external adjustment mode)
15
ICX249AL
Spectral Sensitivity Characteristics
(Includes lens characteristics, excludes light source characteristics)
1000
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
500
600
700
800
900
400
Wave Length [nm]
R
e
l
a
t
i
v
e

R
e
s
p
o
n
s
e
Sensor Readout Clock Timing Chart
unit: s
Odd Field
Even Field
V1
V2
V3
V4
V1
V2
V3
V4
2.5
2.6 2.5 2.5
1.5
33.6
0.2
16
ICX249AL
Drive Timing Chart (Vertical Sync)
F
L
D
V
D
B
L
K
H
D
V
1
V
2
V
3
V
4
C
C
D
O
U
T
62
0
62
5
1
2
3
4
5
15
20
25
31
0
32
0
33
5
33
0
34
0
5
8
1
5
8
2
1
3
5
2
4
6
1
3
5
2
4
6
5
8
2
5
8
1
2
1
4
3
6
5
10
31
5
32
5
2
1
4
3
6
5
17
ICX249AL
Drive Timing Chart (Horizontal Sync)
74
5
75
0
1
3
5
10
20
30
40
1
2
3
5
10
20
22
1
2
3
1
2
3
10
20
H
D
B
L
K
H
1
H
2
R
G
V
1
V
2
V
3
V
4
S
U
B
75
2
18
ICX249AL
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation,
use either an elastic load, such as a spring plate, or an adhesive.
Compressive strength
39N
0.9Nm
Upper ceramic
Lower ceramic
29N
Low melting
point glass
29N
Shearing strength
Tensile strength
Torsional strength
19
ICX249AL
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to other locations as a precaution.
d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not
to perform the following actions as this may cause cracks.
Applying repeated bending stress to the outer leads.
Heating the outer leads for an extended period with a soldering iron.
Rapidly cooling or heating the package.
Applying any load or impact to a limited portion of the low melting point glass using tweezers or other
sharp tools.
Prying at the upper or lower ceramic using the low melting point glass as a fulcrum.
Note that the same cautions also apply when removing soldered products from boards.
e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.
(reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
exceeding the normal using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) This CCD image sensor has sensitivity in the near infrared area. Its focus may not match in the same
condition under visible light /near infrared light because of aberration.
20
ICX249AL
P
A
C
K
A
G
E

S
T
R
U
C
T
U
R
E
2
0
p
i
n

D
I
P

(
6
0
0
m
i
l
)
0
.
7
3
11
.5
5
3
0.5
5
9
.
0
7.5
5
V
H
1
8
.
0


0
.
4
1
1
0
1
1
2
0
15
.1
0
.3
15
.2
4
0
to
9
1.4
0.2
5
(
R
0
.
7
)
(
1
.
0
)
1
1
1
0
1
7
.
6
1
.
4
(4
.0
)
(
1
.
7
)
3.4
0
.3
0.7
3
1
4
.
6
4.0
0
.3
1.2
7
0
.
4
6
0
.
8
0.8
3
0.4
0
.
4
1
.
7
7
8
0
.
3
2
0
1
1
.
"
A
"

i
s

t
h
e

c
e
n
t
e
r

o
f

t
h
e

e
f
f
e
c
t
i
v
e

i
m
a
g
e

a
r
e
a
.
2
.
T
h
e

t
w
o

p
o
i
n
t
s

"
B
"

o
f

t
h
e

p
a
c
k
a
g
e

a
r
e

t
h
e

h
o
r
i
z
o
n
t
a
l

r
e
f
e
r
e
n
c
e
.
T
h
e

p
o
i
n
t

"
B
'
"

o
f

t
h
e

p
a
c
k
a
g
e

i
s

t
h
e

v
e
r
t
i
c
a
l

r
e
f
e
r
e
n
c
e
.
3
.
T
h
e

b
o
t
t
o
m

"
C
"

o
f

t
h
e

p
a
c
k
a
g
e

i
s

t
h
e

h
e
i
g
h
t

r
e
f
e
r
e
n
c
e
.
4
.
T
h
e

c
e
n
t
e
r

o
f

t
h
e

e
f
f
e
c
t
i
v
e

i
m
a
g
e

a
r
e
a
,

r
e
l
a
t
i
v
e

t
o

"
B
"

a
n
d

"
B
'
"

i
s
(
H
,

V
)

=

(
9
.
0
,

7
.
5
5
)


0
.
1
5
m
m
.
5
.
T
h
e

r
o
t
a
t
i
o
n

a
n
g
l
e

o
f

t
h
e

e
f
f
e
c
t
i
v
e

i
m
a
g
e

a
r
e
a

r
e
l
a
t
i
v
e

t
o

H

a
n
d

V

i
s


1

.
6
.
T
h
e

h
e
i
g
h
t

f
r
o
m

t
h
e

b
o
t
t
o
m

"
C
"

t
o

t
h
e

e
f
f
e
c
t
i
v
e

i
m
a
g
e

a
r
e
a

i
s

1
.
4
1


0
.
1
5
m
m
.
7
.
T
h
e

t
i
l
t

o
f

t
h
e

e
f
f
e
c
t
i
v
e

i
m
a
g
e

a
r
e
a

r
e
l
a
t
i
v
e

t
o

t
h
e

b
o
t
t
o
m

"
C
"

i
s

l
e
s
s

t
h
a
n

6
0
m
.
8
.
T
h
e

t
h
i
c
k
n
e
s
s

o
f

t
h
e

c
o
v
e
r

g
l
a
s
s

i
s

0
.
7
5
m
m
,

a
n
d

t
h
e

r
e
f
r
a
c
t
i
v
e

i
n
d
e
x

i
s

1
.
5
.
9
.
T
h
e

n
o
t
c
h

a
n
d

t
h
e

h
o
l
e

o
n

t
h
e

b
o
t
t
o
m

m
u
s
t

n
o
t

b
e

u
s
e
d

f
o
r

r
e
f
e
r
e
n
c
e

o
f

f
i
x
i
n
g
.
C
B
~
~
B
'
~
M
P
A
C
K
A
G
E

M
A
T
E
R
I
A
L
L
E
A
D

T
R
E
A
T
M
E
N
T
L
E
A
D

M
A
T
E
R
I
A
L
P
A
C
K
A
G
E

W
E
I
G
H
T
C
e
r
-
D
I
P
T
I
N

P
L
A
T
I
N
G
4
2

A
L
L
O
Y
2
.
6
g
A
Package Outline
Unit: mm