1
E00Z51
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX279AK
14 pin DIP (Plastic)
Description
The ICX279AK is an interline CCD solid-state
image sensor suitable for PAL color video cameras
with a diagonal 4.5mm (Type 1/4) system. Compared
with the current product ICX209AK, basic
characteristics such as sensitivity, smear and
dynamic range are improved drastically through the
adoption of EXview HAD CCD
TM
technology.
This chip features a field period readout system and
an electronic shutter with variable charge-storage time.
The package is a 10mm-square 14-pin DIP (Plastic).
EXview HAD CCD
TM
has different spectral
characteristics from the current CCD.
Features
High sensitivity (+5dB compared with the ICX209AK)
Low smear (20dB compared with the ICX209AK)
High D range (+2dB compared with the ICX209AK)
Horizontal register: 3.3 to 5.0V drive
Reset gate:
3.3 to 5.0V drive
No voltage adjustment
(Reset gate and substrate bias are not adjusted.)
High resolution, low smear and low dark current
Excellent antiblooming characteristics
Continuous variable-speed shutter
Recommended range of exit pupil distance: 20 to 100mm
Ye, Cy, Mg, and G complementary color mosaic filters on chip
Device Structure
Interline CCD image sensor
Image size:
Diagonal 4.5mm (Type 1/4)
Number of effective pixels: 752 (H)
582 (V) approx. 440K pixels
Total number of pixels:
795 (H)
596 (V) approx. 470K pixels
Chip size:
4.43mm (H)
3.69mm (V)
Unit cell size:
4.85m (H)
4.65m (V)
Optical black:
Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction:
Front 12 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 22
Vertical 1 (even fields only)
Substrate material:
Silicon
Optical black position
(Top View)
2
12
V
H
Pin 1
Pin 8
40
3
EXview HAD CCD is a trademark of Sony Corporation.
EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of
HAD (Hole-Accumulation-Diode) sensor.
TM
Diagonal 4.5mm (Type 1/4) CCD Image Sensor for PAL Color Video Cameras
2
ICX279AK
Block Diagram and Pin Configuration
(Top View)
V
OUT
GND
V
1
V
2
V
3
V
4
V
DD
GND
SUB
V
L
RG
H
1
H
2
NC
Cy
Cy
Mg
G
Cy
Mg
Cy
Cy
Mg
G
Cy
Mg
Ye
Ye
G
Mg
Ye
G
Ye
Ye
G
Mg
Ye
G
7
6
5
4
3
2
1
8
9
10
11
12
13
14
Note)
Note) : Photo sensor
Horizontal Register
V
e
r
tical Register
Pin No.
Symbol
Description
Pin No. Symbol
Description
1
2
3
4
5
6
7
V
4
V
3
V
2
V
1
NC
GND
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Signal output
8
9
10
11
12
13
14
V
DD
GND
SUB
V
L
RG
H
1
H
2
Supply voltage
GND
Substrate clock
Protective transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
Pin Description
Absolute Maximum Ratings
1
+24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
Item
V
DD
, V
OUT
, RG
SUB
V
1
, V
3
SUB
V
2
, V
4
, V
L
SUB
H
1
, H
2
, GND
SUB
V
DD
, V
OUT
, RG GND
V
1
, V
2
, V
3
, V
4
GND
H
1
, H
2
GND
V
1
, V
3
V
L
V
2
, V
4
, H
1
, H
2
, GND V
L
Voltage difference between vertical clock input pins
H
1
H
2
H
1
, H
2
V
4
Against
SUB
Against GND
Against V
L
Between input clock
pins
Storage temperature
Operating temperature
40 to +8
50 to +15
50 to +0.3
40 to +0.3
0.3 to +18
10 to +18
10 to +6
0.3 to +28
0.3 to +15
to +15
5 to +5
13 to +13
30 to +80
10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
C
C
1
Ratings
Unit
Remarks
3
ICX279AK
Bias Conditions
1
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same power supply as the V
L
power supply for the V driver should be used.
2
Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated
within the CCD.
Supply voltage
Protective transistor bias
Substrate clock
Reset gate clock
Item
V
DD
V
L
SUB
RG
Symbol
15.0
1
2
2
Min.
V
Unit
Remarks
Typ.
Max.
14.55
15.45
DC Characteristics
Supply current
Item
I
DD
Symbol
4
Min.
Unit
Remarks
Typ.
Max.
mA
6
Clock Voltage Conditions
Readout clock voltage
Vertical transfer clock
voltage
Horizontal transfer
clock voltage
Reset gate clock
voltage
Substrate clock voltage
Item
V
VT
V
VH1
, V
VH2
V
VH3
, V
VH4
V
VL1
, V
VL2
,
V
VL3
, V
VL4
V
V
V
VH3
V
VH
V
VH4
V
VH
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
RG
V
RGLH
V
RGLL
V
RGL
V
RGLm
V
SUB
Symbol
14.55
0.05
0.2
8.0
6.3
0.25
0.25
3.0
0.05
3.0
21.0
Min.
15.0
0
0
7.0
7.0
3.3
0
3.3
22.0
Typ.
15.45
0.05
0.05
6.5
8.05
0.1
0.1
0.3
0.3
0.3
0.3
5.25
0.05
5.5
0.4
0.5
23.5
Max.
Unit
1
2
2
2
2
2
2
2
2
2
2
3
3
4
4
4
5
Waveform
diagram
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Input through 0.1F
capacitance
Low-level coupling
Low-level coupling
Remarks
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
4
ICX279AK
Horizontal transfer clock equivalent circuit
Vertical transfer clock equivalent circuit
Reset gate clock equivalent circuit
H
1
H
2
C
H1
C
H2
C
HH
R
H
R
H
V
1
C
V12
V
2
V
4
V
3
C
V34
C
V23
C
V41
C
V13
C
V24
C
V1
C
V2
C
V4
C
V3
R
GND
R
4
R
1
R
3
R
2
R
RG
RG
C
RG
Clock Equivalent Circuit Constant
C
V1
, C
V3
C
V2
, C
V4
C
V12
, C
V34
C
V23
, C
V41
C
V13
C
V24
C
H1
, C
H2
C
HH
C
RG
C
SUB
R
1
, R
2
, R
3
, R
4
R
GND
R
H
R
RG
Symbol
Capacitance between vertical transfer clock
and GND
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock
and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Reset gate clock series resistor
Item
Min.
1200
680
220
150
82
75
22
36
5
180
82
15
12
51
Typ.
Max.
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Unit Remarks
5
ICX279AK
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
100%
90%
10%
0%
tr
tf
0V
twh
M
2
M
V
VT
V
VH1
V
VHH
V
VHL
V
VH
V
VLH
V
VL1
V
VLL
V
VHL
V
VHH
V
VL
V
VHH
V
VH
V
VLH
V
VLL
V
VL
V
VHL
V
VL3
V
VHL
V
VH3
V
VHH
V
VH2
V
VHH
V
VHH
V
VHL
V
VHL
V
VH
V
VLH
V
VL2
V
VLL
V
VL
V
VH
V
VL
V
VHL
V
VLH
V
VLL
V
VHL
V
VH4
V
VHH
V
VHH
V
VL4
V
1
V
3
V
2
V
4
6
ICX279AK
(3) Horizontal transfer clock waveform
(4) Reset gate clock waveform
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, V
RGL
is the average value of V
RGLH
and
V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval twh, then:
V
RG
= V
RGH
V
RGL
Negative overshoot level during the falling edge of RG is V
RGLm
.
(5) Substrate clock waveform
100%
90%
10%
0%
V
SUB
(A bias generated within the CCD)
tr
tf
twh
M
2
M
V
SUB
tr
twh
tf
90%
10%
twl
V
H
V
HL
Point A
twl
V
RG
V
RGH
V
RGL
V
RGLH
RG waveform
V
RGLL
H
1
waveform
twh
tr
tf
V
H
/2 [V]
V
RGLm
7
ICX279AK
Clock Switching Characteristics
Min.
twh
Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
2.3
26
26
11
1.5
2.5
28.5
28.5
5.38
13
1.8
26
26
28.5
28.5
5.38
51
0.5
6.5
6.5
0.01
0.01
3
9.5
9.5
0.5
15
0.5
6.5
6.5
0.01
0.01
3
250
9.5
9.5
0.5
Unit
s
ns
ns
s
ns
s
Remarks
During
readout
1
2
During drain
charge
Item
Readout clock
Vertical transfer
clock
During
imaging
During
parallel-serial
conversion
Reset gate clock
Substrate clock
Symbol
V
T
V
1
, V
2
,
V
3
, V
4
H
1
H
2
H
1
H
2
RG
SUB
Hor
i
z
ontal
t
r
ansf
er cloc
k
1
When vertical transfer clock driver CXD1267AN is used.
2
When V
H
= 3.0V. tf
tr 2ns, and the cross-point voltage (V
CR
) for the H
1
rising side of the H
1
and H
2
waveforms must be at least V
H
/2 [V].
3
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
Min.
two
Typ.
Max.
22
26
Unit
ns
Remarks
Item
Horizontal transfer clock
Symbol
H
1
, H
2
3
8
ICX279AK
Zone Definition of Video Signal Shading
Measurement System
Note) Adjust the amplifier gain so that the gain between [
A] and [
Y] , and between [
A] and [
C] equals 1.
12
V
10
12
8
6
Ignored region
Effective pixel region
Zone 0,
I
Zone
II
,
II
'
V
10
H
8
H
8
752 (H)
582 (V)
CCD
C.D.S
LPF1
AMP
CCD signal output
Y signal output
Chroma signal output
(3dB down 6.3MHz)
(3dB down 1MHz)
[
C]
S/H
S/H
LPF2
[
Y]
[
A]
Image Sensor Characteristics
(Ta = 25C)
Item
Sensitivity
Sensitivity ratio
Saturation signal
Smear
Video signal shading
Uniformity between video
signal channels
Dark signal
Dark signal shading
Flicker Y
Flicker R-Y
Flicker B-Y
Line crawl R
Line crawl G
Line crawl B
Line crawl W
Lag
Symbol
S
R
MgG
R
YeCy
Ysat
Sm
SHy
Sr
Sb
Ydt
Ydt
Fy
Fcr
Fcb
Lcr
Lcg
Lcb
Lcw
Lag
Min.
640
0.93
1.15
900
Typ.
800
108
Max.
1.35
1.53
100
20
25
10
10
2
1
2
5
5
3
3
3
3
0.5
Unit
mV
mV
dB
%
%
%
%
mV
mV
%
%
%
%
%
%
%
%
Measurement method
1
2
2
3
4
5
5
6
6
7
8
9
9
9
10
10
10
10
11
Remarks
Ta = 60C
Zone 0 and
I
Zone 0 to
II
'
Ta = 60C
Ta = 60C
9
ICX279AK
Image Sensor Characteristics Measurement Method
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output
or chroma signal output of the measurement system.
Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals
As shown in the left figure, fields are read out. The charge is
mixed by pairs such as A1 and A2 in the A field. (pairs such
as B in the B field)
As a result, the sequence of charges output as signals from
the horizontal shift register (Hreg) is, for line A1, (G + Cy),
(Mg + Ye), (G + Cy), and (Mg + Ye).
These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed
by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words,
the approximation:
Y = {(G + Cy) + (Mg + Ye)}
1/2
= 1/2 {2B + 3G + 2R}
is used for the Y signal, and the approximation:
R Y = {(Mg + Ye) (G + Cy)}
= {2R G}
is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are
(Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye).
The Y signal is formed from these signals as follows:
Y = {(G + Ye) + (Mg + Cy)}
1/2
= 1/2 {2B + 3G + 2R}
This is balanced since it is formed in the same way as for line A1.
In a like manner, the chroma (color difference) signal is approximated as follows:
(B Y) = {(G + Ye) (Mg + Cy)}
= {2B G}
In other words, the chroma signal can be retrieved according to the sequence of lines from R Y and (B Y)
in alternation. This is also true for the B field.
Cy
Ye
Cy
Ye
G
Mg
G
Mg
Cy
Ye
Cy
Ye
Mg
G
Mg
G
B
A1
A2
Hreg
Color Coding Diagram
10
ICX279AK
Definition of standard imaging conditions
1) Standard imaging condition
I
:
Use a pattern box (luminance 706cd/m
2
, color temperature of 3200K halogen source) as a subject. (Pattern
for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter
and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity testing luminous intensity.
2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
3) Standard imaging condition
III
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens (exit pupil distance 33mm) with CM500S (t = 1.0mm) as an IR cut filter. The
luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity
Set to standard imaging condition
I
. After selecting the electronic shutter mode with a shutter speed of
1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following
formula.
S = Ys
[mV]
2. Sensitivity ratio
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the Mg signal output (S
Mg
[mV]) and G signal output (S
G
[mV]), and Ye
signal output (S
Ye
[mV]) and Cy signal output (S
Cy
[mV]) at the center of the screen with frame readout
method. Substitute the values into the following formula.
R
MgG
= S
Mg
/
SG
R
YeCy
= S
Ye
/S
Cy
3. Saturation signal
Set to standard imaging condition
II
. After adjusting the luminous intensity to 10 times the intensity with
average value of the Y signal output, 200mV, measure the minimum value of the Y signal.
4. Smear
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped
and the charge drain is executed by the electronic shutter at the respective H blankings, measure the
maximum value (YSm [mV]) of the Y signal output and substitute the value into the following formula.
Sm = 20
log
[dB] (1/10V method conversion value)
250
50
1
10
1
500
YSm
200
11
ICX279AK
5. Video signal shading
Set to standard imaging condition
III
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity
so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and
minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula.
SHy = (Ymax Ymin)/200
100 [%]
6. Uniformity between video signal channels
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin
[mV]) values of the R Y and B Y channels of the chroma signal and substitute the values into the
following formula.
Sr = | (Crmax Crmin)/200 |
100 [%]
Sb = | (Cbmax Cbmin)/200 |
100 [%]
7. Dark signal
Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
8. Dark signal shading
After measuring 7, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal
output and substitute the values into the following formula.
Ydt = Ydmax Ydmin [mV]
9. Flicker
1) Fy
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the difference in the signal level between fields (
Yf [mV]). Then
substitute the value into the following formula.
Fy = (
Yf/200)
100 [%]
2) Fcr, Fcb
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between
fields of the chroma signal (
Cr,
Cb) as well as the average value of the chroma signal output (CAr, CAb).
Substitute the values into the following formula.
Fci = (
Ci/CAi)
100 [%] (i = r, b)
12
ICX279AK
10. Line crawls
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference
between Y signal lines for the same field (
Ylw,
Ylr,
Ylg,
Ylb [mV]). Substitute the values into the
following formula.
Lci = (
Yli/200)
100 [%] (i = w, r, g, b)
11. Lag
Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following
formula.
Lag = (Ylag/200)
100 [%]
Light
Y signal output 200mV
Ylag (lag)
FLD
V1
Strobe light
timing
Output
13
ICX279AK
Drive Circuit
22/16V
0.1
7.0V
3.3/16V
1/35V
0.1
1M
H
1
H
2
RG
V
L
SUB
GND
V
DD
V
4
V
3
V
2
V
1
NC
V
OUT
22/20V
CCD OUT
15V
XSUB
XV2
XV1
XSG1
XV3
XSG2
XV4
H
1
H
2
RG
2200p
100k
3.3/20V
0.01
100
3.9k
2SK523
GND
ICX279
(BOTTOM VIEW)
CXD1267AN
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
14 13 12 11 10
9
8
14
ICX279AK
Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)
Sensor Readout Clock Timing Chart
Unit: s
Odd Field
Even Field
V1
V2
V3
V4
V1
V2
V3
V4
2.6
2.6 2.6 2.6
33.6
1.5
0.2
650
600
550
500
450
400
Wave Length [nm]
Relativ
e Response
1.0
0.8
0.6
0.4
0.2
0
700
Ye
G
Cy
Mg
15
ICX279AK
Drive Timing Chart (Vertical Sync)
FLD
VD
BLK
HD
V1
V2
V3
V4
CCD
OUT
620
625
1
2
3
4
5
15
20
25
310
320
335
330
340
581
582
1 3 5
2 4 6
1 3 5
2 4 6
582
581
2
1
4
3
6
5
10
315
325
2
1
4
3
6
5
16
ICX279AK
Drive Timing Chart (Horizontal Sync)
745
750
1
3
5
10
20
30
40
1 2 3
5
10
20
22
1 2 3 1 2 3
10
20
752
HD
BLK
H1
H2
RG
V1
V2
V3
V4
SUB
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ICX279AK
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load
more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to
limited portions. (This may cause cracks in the package.)
Plastic package
Cover glass
Compressive strength
50N
50N
1.2Nm
Torsional strength
18
ICX279AK
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-acrylate
instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such
a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-
off mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
are the same.
The cross section of lead frame can be seen on the side of the package for structure A.
Structure A
Structure B
Chip
Metal plate
(lead frame)
Package
Cross section of
lead frame
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ICX279AK
Son
y Cor
por
ation
2.5
7.0
2.5
1.0
0.5
5.0
14
5.0
1
8.9
7
10.0 0.1
8.9
10.0
0.1
8
10.16
0 to 9
0.25
8
14
7
1
1.7
1.7
7.0
2.5
1.0
3.35
0.15
2.6
3.5
0.3
1.27
0.3
0.46
1.27
14 pin DIP (400mil)
0.3
V
H
1. "A" is the center of the effective image area.
2. The two points "B" of the package are the horizontal reference.
The point "B'" of the package is the vertical reference.
3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference.
4. The center of the effective image area relative to "B" and "B'" is (H, V) = (5.0, 5.0) 0.15mm.
5. The rotation angle of the effective image area relative to H and V is 1.
6. The height from the bottom "C" to the effective image area is 1.41 0.10mm.
The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm.
7. The tilt of the effective image area relative to the bottom "C" is less than 25m.
The tilt of the effective image area relative to the top "D" of the cover glass is less than 25m.
8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
9. The notch of the package is used only for directional index, that must not be used for reference
of fixing.
C
D
B
A
B'
~
~
~
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
Plastic
GOLD PLATING
42 ALLOY
0.60g
DRAWING NUMBER
AS-D3-01(E)
Package Outline Unit: mm
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