1
E02120B35
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX413AQ
34 pin DIP (Plastic)
Description
The ICX413AQ is a diagonal 28.40mm (Type 1.8)
interline CCD solid-state image sensor with a square
pixel array and 6.15M effective pixels. Frame readout
allows all pixels' signals to be output independently
within approximately 1/3.08 second. Adoption of a
design specially suited for frame readout ensures a
high saturation signal level.
High sensitivity and low dark current are achieved
through the adoption of R, G and B primary color
mosaic filters and HAD (Hole-Accumulation Diode)
sensors.
This chip is suitable for applications such as
electronic still cameras, etc.
Features
Frame readout mode
High horizontal and vertical resolution
Square pixel
Horizontal drive frequency: 25.0MHz
R, G, B primary color mosaic filters on chip
High sensitivity, low dark current
Device Structure
Interline CCD image sensor
Optical size:
Diagonal 28.40mm (Type 1.8)
Total number of pixels:
3110 (H)
2030 (V) approx. 6.31M pixels
Number of effective pixels: 3040 (H)
2024 (V) approx. 6.15M pixels
Number of active pixels:
3032 (H)
2016 (V) approx. 6.11M pixels
Number of recommended recording pixels:
3000 (H)
2000 (V) approx. 6M pixels
Chip size:
25.10mm (H)
17.64mm (V)
Unit cell size:
7.80m (H)
7.80m (V)
Optical black:
Horizontal (H) direction: Front 20 pixels, rear 50 pixels
Vertical (V) direction:
Front 4 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 31
Vertical 1 (even fields only)
Substrate material:
Silicon
Optical black position
(Top View)
2
4
V
H
Pin 1
Pin 18
50
20
Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing
newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor.
Diagonal 28.40mm (Type 1.8) Frame Readout CCD Image Sensor with Square Pixel for Color Cameras
2
ICX413AQ
Note)
Note) : Photo sensor
Horizontal register
V
e
r
tical register
10
9
8
7
6
5
4
3
2
1
V
2
GND
NC
V
3
NC
V
4
NC
NC
GND
V
L
17
16
15
14
13
12
11
V
SUB
GND
NC
V
1
NC
NC
NC
25
26
27
28
29
30
31
32
33
34
18
19
20
21
22
23
24
LH
H
1C
H
2C
GND
H
1B
H
2B
GND
H
1A
H
2A
GND
VSS
V
OUT
GND
RG
GND
V
DD
GND
B
G
B
G
B
G
R
G
R
G
B
G
B
G
B
G
R
G
R
G
G
R
G
R
Block Diagram and Pin Configuration
(Top View)
Pin Description
Pin
No.
Symbol
Description
Pin
No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
V
L
GND
NC
NC
V
4
NC
V
3
NC
GND
V
2
NC
NC
NC
V
1
NC
GND
V
SUB
Protective transistor bias
GND
Vertical register transfer clock
Vertical register transfer clock
GND
Vertical register transfer clock
Vertical register transfer clock
GND
Substrate bias
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
VSS
V
OUT
GND
RG
GND
V
DD
GND
LH
H
1C
H
2C
GND
H
1B
H
2B
GND
H
1A
H
2A
GND
Output amplifier source
Signal output
GND
Reset gate clock
GND
Supply voltage
GND
Horizontal register final stage transfer clock
Horizontal register transfer clock
Horizontal register transfer clock
GND
Horizontal register transfer clock
Horizontal register transfer clock
GND
Horizontal register transfer clock
Horizontal register transfer clock
GND
3
ICX413AQ
Absolute Maximum Ratings
Item
Against
SUB
Against GND
Against V
L
Between input
clock pins
Storage temperature
Guaranteed temperature of performance
Operating temperature
40 to +10
50 to +15
50 to +0.3
40 to +0.3
0.3 to +18
10 to +18
10 to +7
0.3 to +28
0.3 to +15
to +15
7 to +7
17 to +17
30 to +80
10 to +60
10 to +75
V
V
V
V
V
V
V
V
V
V
V
V
C
C
C
1
Ratings
Unit
Remarks
1
+24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
V
DD
, V
OUT
,
RG
SUB
V
1
, V
3
SUB
V
2
, V
4
, V
L
SUB
LH
, H
1
, H
2
, GND
SUB (
=
A, B, C
)
V
DD
, V
OUT
,
RG GND
V
1
, V
2
, V
3
, V
4
GND
LH
, H
1
, H
2
GND (
=
A, B, C
)
V
1
, V
3
V
L
V
2
, V
4
, LH
, H
1
, H
2
, GND V
L
(
=
A, B, C
)
Voltage difference between vertical clock input pins
H
1
H
2
(
=
A, B, C
)
H
1
, H
2
V
4
(
=
A, B, C
)
1
V
L
setting is the V
VL
voltage of the vertical clock waveform, or the same voltage as the V
L
power supply
for the V driver should be used.
2
Do not apply a DC bias to the reset gate clock pins, because a DC bias is generated within the CCD.
DC Characteristics
Supply current
Item
I
DD
Symbol
7.0
Min.
Unit
Remarks
Typ.
Max.
mA
Bias Conditions
Supply voltage
Output amplifier source
Substrate voltage adjustment range
Protective transistor bias
Reset gate clock
Item
V
DD
V
SS
V
SUB
V
L
RG
Symbol
Min.
V
Unit
Remarks
Typ.
Max.
14.55
8.0
15.45
15.0
15.0
Ground with resistance of 750 to 900
1
2
4
ICX413AQ
Clock Voltage Conditions
Readout clock voltage
Vertical transfer clock
voltage
Horizontal transfer
clock voltage
Horizontal final stage
transfer clock voltage
Reset gate clock
voltage
Substrate clock voltage
Item
V
VT
V
VH1
, V
VH2
V
VH3
, V
VH4
V
VL1
, V
VL2
,
V
VL3
, V
VL4
V
V
V
VH3
V
VH
V
VH4
V
VH
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
CR
V
LHH
V
LHL
V
RG
V
RGLH
V
RGLL
V
RGL
V
RGLm
V
SUB
Symbol
14.55
0.05
0.2
8.5
0.25
0.25
5.75
0.05
5.75
0.05
4.75
22.0
Min.
15.0
0
0
8.0
8.0
6.0
0
3.0
6.0
0
5.0
23.0
Typ.
15.45
0.05
0.05
7.5
0.1
0.1
0.5
0.5
0.5
0.5
7.0
0.05
7.0
0.05
5.25
0.4
0.5
24.0
Max. Unit
1
2
2
2
2
2
2
2
2
2
2
3
3
3
4
4
5
5
5
6
Waveform
diagram
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Cross-point voltage
Low-level coupling
Low-level coupling
Remarks
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
5
ICX413AQ
Clock Equivalent Circuit Constant
H
1C
H
2C
C
H1
C
H2
C
HH
R
H
R
H
H
1B
H
2B
R
H
R
H
H
1A
H
2A
R
H
R
H
Vertical transfer clock equivalent circuit
Reset gate clock equivalent circuit
Horizontal transfer clock equivalent circuit
V
1
C
V12
V
2
V
4
V
3
C
V34
C
V23
C
V41
C
V1
C
V2
C
V4
C
V3
R
GND
R
4
R
1
R
3
R
2
C
V13
C
V24
C
RG
RG
R
RG
C
V1
, C
V3
C
V2
, C
V4
C
V12
, C
V34
C
V23
, C
V41
C
V13
C
V24
C
H1
C
H2
C
HH
C
LH
C
RG
C
SUB
R
1
, R
2
, R
3
, R
4
R
GND
R
H
R
LH
R
RG
Symbol
Capacitance between vertical transfer clock
and GND
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock
and GND
Capacitance between horizontal transfer clocks
Capacitance between horizontal final stage transfer
clock and GND
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Horizontal final stage transfer clock series resistor
Reset gate clock series resistor
Item
Min.
18000
15000
18000
10000
6800
8200
18
27
221
8
6
2700
18
3.9
2.2
39
39
Typ.
Max.
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Unit Remarks
6
ICX413AQ
Drive Clock Waveform Conditions
(1) Readout clock waveform
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
(2) Vertical transfer clock waveform
100%
90%
10%
0%
tr
tf
0V
twh
M
2
M
V
VT
V
VH1
V
VHH
V
VHL
V
VH
V
VLH
V
VL1
V
VLL
V
VHL
V
VHH
V
VL
V
VH2
V
VHH
V
VHH
V
VHL
V
VHL
V
VH
V
VLH
V
VL2
V
VLL
V
VL
V
VHH
V
VH
V
VLH
V
VLL
V
VL
V
VHL
V
VL3
V
VHL
V
VH3
V
VHH
V
VH
V
VL
V
VHL
V
VLH
V
VLL
V
VHL
V
VH4
V
VHH
V
VHH
V
VL4
V
1
V
3
V
2
V
4
7
ICX413AQ
(3) Horizontal transfer clock waveform
Cross-point voltage for the H
1
rising side of the horizontal transfer clocks H
1
and H
2
waveforms is V
CR
.
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
(4) Horizontal final stage transfer clock waveform
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG.
In addition, V
RGL
is the average value of V
RGLH
and V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval with twh, then:
V
RG
= V
RGH
V
RGL
Negative overshoot level during the falling edge of RG is V
RGLm
.
(5) Reset gate clock waveform
V
HL
V
CR
twl
two
twh
V
H
V
H
2
tr
H
2
90%
10%
H
1
tf
RG waveform
V
RGLH
V
RGH
V
RGL
V
RGLL
V
RGLm
tr
twh
twl
tf
V
RG
Point A
10%
V
LHL
V
LHH
V
LH
tf
twh
twl
tr
90%
8
ICX413AQ
Clock Switching Characteristics (Horizontal drive frequency: 25MHz)
Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)
400
1.0
B
G
R
0.8
0.6
0.4
0.2
0
450
500
550
Wave Length [nm]
Relativ
e Response
600
650
700
(6) Substrate clock waveform
V
SUB
100%
90%
10%
0%
tr
tf
twh
M
2
M
V
SUB
1
The phase of horizontal final stage transfer clock amplitude level 50% and horizontal transfer clock H
2
amplitude level 50% must be matched.
s
s
ns
ns
ns
s
Min.
twh
Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
7.5
15
15
17
7
6
15
15
17
1.5
2
5
5
3
2
1.5
2
5
5
3
2
Unit
Remarks
During
readout
When using
CXD1268M
1
When draining
charge
Item
Readout clock
Vertical transfer
clock
Horizontal transfer
clock
Horizontal final
stage transfer clock
Reset gate clock
Substrate clock
Symbol
V
T
V
1
, V
2
,
V
3
, V
4
H
1
H
2
LH
RG
SUB
Min.
two
Typ. Max.
17
Unit
ns
Remarks
Item
Horizontal transfer
clock
Symbol
H
1
, H
2
9
ICX413AQ
Image Sensor Characteristics
(Ta = 25C)
1
After closing the mechanical shutter, the smear can be reduced to below the detection limit by performing
vertical register sweep operation.
2
Excludes vertical dark signal shading caused by vertical register high-speed transfer.
Zone Definition of Video Signal Shading
Item
G sensitivity
Sensitivity
comparison
Saturation signal
Smear
Video signal shading
Dark signal
Dark signal shading
Line crawl G
Line crawl R
Line crawl B
Lag
Symbol
Sg
Rr
Rb
Vsat
Sm
SHg
Vdt
Vdt
Lcg
Lcr
Lcb
Lag
Min.
800
0.42
0.23
900
Typ.
1000
0.57
0.38
110
Max.
1200
0.72
0.53
90
20
25
4
2
10
10
10
0.5
Unit
mV
mV
dB
%
mV
mV
%
%
%
%
Measurement
method
1
1
2
3
4
5
6
7
7
7
8
Remarks
1/30s accumulation
Ta = 60C
Frame readout mode,
1
Zone 0 and
I
Zone 0 to
II
'
Ta = 60C, 3.08 frame/s
Ta = 60C, 3.08 frame/s,
2
4
V
10
4
4
4
Ignored region
Effective pixel region
Zone 0,
I
Zone
II
,
II
'
V
10
H
8
H
8
3040 (H)
2024 (V)
Measurement System
CCD
C.D.S
S/H
S/H
AMP
CCD signal output [
A]
Gr/Gb channel signal output [
B]
R/B channel signal output [
C]
Note) Adjust the amplifier gain so that the gain between [
A] and [
B], and between [
A] and [
C] equals 1.
10
ICX413AQ
Image Sensor Characteristics Measurement Method
Measurement conditions
(1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions, and the frame readout mode is used.
(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb
signal output or the R/B signal output of the measurement system.
Color coding of this image sensor & Readout
The primary color filters of this image sensor are arranged in the
layout shown in the figure on the left (Bayer arrangement).
Gr and Gb denote the G signals on the same line as the R signal
and the B signal, respectively.
For frame readout, the A1 and A2 lines are output as signals in
the A field, and the B1 and B2 lines in the B field.
Gb
B
Gb
B
R
Gr
R
Gr
Gb
B
Gb
B
R
Gr
R
Gr
B2
B1
A2
A1
Horizontal register
Color Coding Diagram
11
ICX413AQ
Definition of standard imaging conditions
(1) Standard imaging condition
I
:
Use a pattern box (luminance: 706cd/m
2
, color temperature of 3200K halogen source) as a subject.
(Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR
cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined
as the standard sensitivity testing luminous intensity.
(2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is
adjusted to the value indicated in each testing item by the lens diaphragm.
1.
G sensitivity, sensitivity comparison
Set to the standard imaging condition
I
. After setting the electronic shutter mode with a shutter speed
of 1/100s, measure the signal outputs (V
Gr
, V
Gb
, V
R
and V
B
) at the center of each Gr, Gb, R and B channel
screen, and substitute the values into the following formulas.
V
G
= (V
Gr
+ V
Gb
)/2
Sg = V
G
[mV]
Rr = V
R
/V
G
Rb = V
B
/V
G
2.
Saturation signal
Set to the standard imaging condition
II:
After adjusting the luminous intensity to 20 times the intensity
with the average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and
B signal outputs.
3.
Smear
Set to the standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, first adjust the average
value of the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal
output, R signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to
500 times the intensity with the average value of the Gr signal output, 150mV.
After the readout clock is stopped and the charge drain is executed by the electronic shutter at the
respective H blankings, measure the maximum value (Vsm [mV]) independent of the Gr, Gb, R and B
signal outputs, and substitute the values into the following formula.
Sm = 20
log
(
Vsm
)
[dB] (1/10V method conversion value)
4.
Video signal shading
Set to the standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjusting the luminous
intensity so that the average value of the Gr signal output is 150mV. Then measure the maximum value
(Grmax [mV]) and minimum value (Grmin [mV]) of the Gr signal output and substitute the values into the
following formula.
SHg = (Grmax Grmin)/150
100 [%]
100
30
1
10
1
500
Gra + Gba + Ra + Ba
4
12
ICX413AQ
5.
Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature of 60C
and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
6.
Dark signal shading
After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
7.
Line crawl
Set to the standard imaging condition
II
. Adjusting the luminous intensity so that the average value of the
Gr signal output is 150mV, and then insert R, G and B filters and measure the difference between G signal
lines (
Glr,
Glg,
Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab).
Substitute the values into the following formula.
Lci =
100 [%] (i = r, g, b)
8.
Lag
Adjust the Gr channel output generated by the strobe light to 150mV. After setting the strobe light so that
it strobes with the following timing, measure the residual signal amount (Vlag). Substitute the value into
the following formula.
Lag = (Vlag/150)
100 [%]
Gli
Gai
Light
VD
V1
Strobe light timing
Output
Vlag (lag)
Gr sinal ouitput 150mV
13
ICX413AQ
Drive
Timing Char
t (V
e
r
tical Sync Accum
ulation
Time Contr
ol b
y
Mec
hanical Shutter) Frame Readout Mode
2023
2021
2019
2017
9
7
5
3
1
3
1
2024
2022
2020
2018
10
8
6
4
2
4
2
1
10
135
138
139
1149
1153
1155
1264
1222
1227
2241
2
3
OPEN
VD
HD
V1
V2
V3
V4
V
SUB
Mechanical
shutter
CCD
OUT
"c"
"a"
"d"
"b"
Exposure per
iod
All pix
el output per
iod
CLOSE
14
ICX413AQ
Drive
Timing Char
t (V
e
r
tical Sync) Frame Readout Mode
V
e
rtical Sync "c" Enlar
g
ed,
"d" Enlar
g
e
d
"c":
135H/"d":
68H
60
60
60
60
60
60
60
60
60
60
60
60
60
60
#1
#2
#3
#4
60
60
60
60
"c":
#2030
"d":
#1015
60
60
H1
H2
V1
V2
V3
V4
54
534
534
1
3621
54
1
3621
15
ICX413AQ
H1
V1
V2
V3
V4
55
1
3621
1
3621
55
1800
2040
2040
2100
V1
V2
V3
V4
2040
2100
2340
2100
"b" Enlar
g
e
d
Drive
Timing Char
t (V
e
r
tical Sync "a" Enlar
g
ed,
"b" Enlar
g
ed)
"a" Enlar
g
e
d
16
ICX413AQ
Drive
Timing Char
t (Horizontal Sync)
60
60
60
60
60
60
60
60
H1
H2
V1
V2
V3
V4
SUB
1
1
50
3621
Ignored pix
e
l 4 bits
20
1
480
1
31
Ignored pix
e
l 4 bits
17
ICX413AQ
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensors.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W
soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,
cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero-cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operations as required, and use them.
a) Operate in clean environments (around class 1000 is appropriate).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high
luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the
image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In such a
case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off
mode should be properly arranged. For continuous using under cruel condition exceeding the normal using
condition, consult our company.
5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage
in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical
shocks.
18
ICX413AQ
Sony Corporation
P
a
c
k
a
g
e Outline
Unit:
mm
P
A
CKA
GE MA
TERIAL
LEAD TREA
TMENT
LEAD MA
TERIAL
P
A
CKA
GE MASS
DRA
WING NUMBER
Plastic
, Metal
GOLD PLA
T
ING
7.00g
42 ALLO
Y
AS-Z4(E)
1.50
1.50
17.60
R0.8
2.60 0.30
2.25 0.15
1.90 0.15
0.80
18.6 0.3
12.7 0.3
25.00
3 -
5.0 0.1
11.60
19.00
1.20 0.15
0.70 0.10
23.3 0.2
24.6
25.4 0.15
37.2 0.15
36.4
35.2 0.2
5.0 0.2
3.0
0.77
3.0
0.77
26.25
A
1.4 0.2
1.778
0.46
C
B'
17
1
~
B
34
18
17
1
V
H
1. "
A
" is the center of the effective image area.
2.
The two points "
B
" of the package are the horizontal reference.
The point "
B'
" of the package is the vertical reference.
3.
The metal area "
C
" of the package bottom, and the top of the cover glass "
D
"
are the height reference.
4.
The center of the effective image area relative to "
B
" and "
B'
" is
( H, V ) = ( 18.6, 12.7 ) 0.03mm
5.
The rotation angle of the effective image area relative to H and V is 1.
6.
The height from the bottom "
C
" to the effective image area is 1.40 0.15mm.
The height from the top of the cover glass "
D
" to the effective image area is 1.20 0.15mm.
7.
The tilt of the effective image area relative to the bottom "
C
" is less than 150m.
8.
The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
9.
The notches on the bottom of the package are used only for directional index, they must
not be used for reference of fixing.
10.
Metal par
t at the bottom of a pac
kage is stic
king out 0.1mm.
from the surrounding plastic par
t
.
~
~
+ 0.4
0
D
0 to 10
34 Pin DIP
Metal part
~
~
~
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