Diagonal 5.68mm (Type 1/3.2) Frame Readout CCD Image Sensor with Square Pixel for Color Cameras

Description

The ICX434DQN is a diagonal 5.68mm (Type

1/3.2) interline CCD solid-state image sensor with a
square pixel array and 2.02M effective pixels. Frame
readout allows all pixels' signals to be output
independently within approximately 1/7.5 second.
Also, the adoption of high frame rate readout mode
supports 30 frames per second which is four times
the speed in frame readout mode. This chip features
an electronic shutter with variable charge-storage
time. Adoption of a design specially suited for frame
readout ensures a saturation signal level equivalent
to when using field readout. High resolution and high
color reproductivity are achieved through the use of
R, G, B primary color mosaic filters. Further, high
sensitivity and low dark current are achieved through
the adoption of Super HAD CCD technology.

This chip is suitable for applications such as electronic

still cameras, PC input cameras, etc.

Features
· Supports frame readout
· High horizontal and vertical resolution
· Supports high frame rate readout mode: 30 frames/s
· Square pixel
· Horizontal drive frequency: 18MHz
· No voltage adjustments (reset gate and substrate bias are not adjusted.)
· R, G, B primary color mosaic filters on chip
· High color reproductivity, high sensitivity, low smear
· Continuous variable-speed shutter
· Low dark current, excellent anti-blooming characteristics
· 16-pin high-precision plastic package (top/bottom dual surface reference possible)

Device Structure
· Interline CCD image sensor
· Image size:

Diagonal 5.68mm (Type 1/3.2)

· Total number of pixels:

1688 (H)

1248 (V) approx. 2.11M pixels

· Number of effective pixels: 1636 (H)

1236 (V) approx. 2.02M pixels

· Number of active pixels:

1620 (H)

1220 (V) approx. 1.98M pixels

· Chip size:

5.27mm (H)

4.40mm (V)

· Unit cell size:

2.8µm (H)

2.8µm (V)

· Optical black:

Horizontal (H) direction: Front 4 pixels, rear 48 pixels
Vertical (V) direction:

Front 10 pixels, rear 2 pixels

· Number of dummy bits:

Horizontal 28
Vertical 1 (even fields only)

· Substrate material:

Silicon

E02202

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

ICX434DQN

16 pin SOP (Plastic)

Super HAD CCD is a trademark of Sony Corporation. The Super HAD CCD is a version of Sony's high performance CCD HAD (Hole-

Accumulation Diode) sensor with sharply improved sensitivity by the incorporation of a new semiconductor technology developed by Sony
Corpration.

Pin 1

Pin 9

Optical black position

(Top View)

ICX434DQN

Pin No.

Symbol

Description

Pin No.

Symbol

Description

GND

OUT

Vertical register transfer clock

GND

Signal output

GND

SUB

Supply voltage

GND

Substrate clock

Substrate bias

Protective transistor bias

Reset gate clock

Horizontal register transfer clock

Pin Description

Note)

: Photo sensor

OUT

GND

SUB

Horizontal register

Note)

Vertical register

Block Diagram and Pin Configuration
(Top View)

DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance
of 0.1µF.

Absolute Maximum Ratings

40 to +12

50 to +15

50 to +0.3

40 to +0.3

25 to

0.3 to +22

10 to +18

10 to +6.5

0.3 to +28

0.3 to +15

to +15

6.5 to +6.5

10to +16

30 to +80

10 to +60

10 to +75

°C

, V

OUT

SUB

, V

SUB

, V

SUB

, H

, GND

SUB

, V

OUT

RG, C

SUB

GND

, V

GND

, H

GND

, V

, H

, GND V

Voltage difference between vertical clock input pins

, H

Item

Ratings

Unit

Remarks

+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Against

SUB

Against GND

Against V

Between input clock
pins

Storage temperature

Guaranteed temperature of performance

+16V (Max.) is guaranteed for turning on or off power supply.

Operating temperature

ICX434DQN

Clock Voltage Conditions

Item

Readout clock voltage

VH1

, V

VH2

VH3

, V

VH4

VL1

, V

VL2

VL3

, V

VL4

VH3

VH4

VHH

VHL

VLH

VLL

RGLH

RGLL

RGL

RGLm

SUB

14.55

0.05

0.2

8.0

6.8

0.25

3.0

0.05

0.5

3.0

21.5

15.0

7.5

3.3

1.65

3.3

22.5

15.45

0.05

7.0

8.05

0.1

0.5

3.6

0.05

3.6

0.4

0.5

23.5

= (V

VH1

+ V

VH2

)/2

= (V

VL3

+ V

VL4

)/2

= V

n V

n (n = 1 to 4)

High-level coupling

Low-level coupling

Cross-point voltage

Low-level coupling

Horizontal transfer
clock voltage

Reset gate clock
voltage

Substrate clock voltage

Vertical transfer clock
voltage

Symbol

Min.

Typ.

Max.

Unit

Remarks

Bias Conditions

Item

Supply voltage

Protective transistor bias

Substrate clock

Reset gate clock

SUB

14.55

15.0

15.45

Symbol

Min.

Typ.

Max.

Unit

Remarks

DC Characteristics

Item

Supply current

6.5

Symbol

Min.

Typ.

Max.

Unit

Remarks

setting is the V

voltage of the vertical transfer clock waveform, or the same voltage as the V

power

supply for the V driver should be used.

Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated

within the CCD.

Waveform
diagram

ICX434DQN

Clock Equivalent Circuit Constant

Item

Capacitance between vertical transfer
clock and GND

V1A

, C

V3A

V1B

, C

V3B

, C

V1A2

, C

V3A4

V1B2

, C

V3B4

V23A

, C

V41A

V23B

, C

V41B

V1A3A

V1B3B

V1A3B

, C

V1B3A

V24

V1A1B

, C

V3A3B

SUB

, R

GND

680

1500

100

220

100

470

270

110

Capacitance between vertical transfer
clocks

Capacitance between horizontal transfer
clock and GND

Capacitance between horizontal transfer
clocks

Capacitance between reset gate clock
and GND

Capacitance between substrate clock
and GND

Vertical transfer clock series resistor

Vertical transfer clock ground resistor

Horizontal transfer clock series resistor

Symbol

Min.

Typ.

Max.

Unit

Remarks

GND

V1B3B

V41B

V41A

V1B

V1B3A

V1A1B

V1A

V1B2

V1A2

V24

V1A3A

V23A

V23B

V3A

V3A3B

V1A3B

V3B

V3A4

V3B4

Vertical transfer clock equivalent circuit

Horizontal transfer clock equivalent circuit

ICX434DQN

Drive Clock Waveform Conditions

(1) Readout clock waveform

(2) Vertical transfer clock waveform

100%

90%

10%

twh

, V

VHH

VHL

VHH

VHL

VH1

VL1

VLH

VLL

VHH

VH3

VHL

VHH

VHL

VL3

VLL

VLH

VHH

VHL

VH2

VLH

VL2

VLL

VHH

VHL

VH4

VHL

VLH

VLL

VL4

= (V

VH1

+ V

VH2

)/2

= (V

VL3

+ V

VL4

)/2

= V

n V

n (n = 1 to 4)

ICX434DQN

twh

90%

10%

twl

two

RGL

RGLL

RGLH

twl

RGH

RG waveform

RGLm

twh

(3) Horizontal transfer clock waveform

(4) Reset gate clock waveform

Point A

RGLH

is the maximum value and V

RGLL

is the minimum value of the coupling waveform during the period from

Point A in the above diagram until the rising edge of RG.

In addition, V

RGL

is the average value of V

RGLH

and V

RGLL

RGL

= (V

RGLH

+ V

RGLL

)/2

Assuming V

RGH

is the minimum value during the interval twh, then:

= V

RGH

RGL

Negative overshoot level during the falling edge of RG is V

RGLm

(5) Substrate clock waveform

SUB

90%

100%

10%

twh

(A bias generated within the CCD)

SUB

Cross-point voltage for the H

rising side of the horizontal transfer clocks H

and H

waveforms is V

The overlap period for twh and twl of horizontal transfer clocks H

and H

is two.

ICX434DQN

Clock Switching Characteristics (Horizontal drive frequency:18MHz)

Item

Readout clock

Vertical transfer
clock

Reset gate clock

Substrate clock

, V

SUB

1.36

1.7

1.56

19.5

5.56

3.6

19.5

5.56

0.5

8.5

0.01

0.5

8.5

0.01

250

0.5

µs

During
readout

When using
CXD1267AN

tr 2ns

During drain
charge

Symbol

twh

Min. Typ. Max.

Horizontal transfer clock H

, H

12 19.5

Item

Symbol

two

Unit

Remarks

Min. Typ. Max.

Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.

twl

Unit

Remarks

Horizontal transfer

lock

During
imaging

During
parallel-serial
conversion

400

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

450

500

550

Wave Length [nm]

Relativ

e Response

600

650

700

Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)

ICX434DQN

Image Sensor Characteristics

(Ta = 25°C)

Item

G sensitivity

Sensitivity
comparison

Saturation signal

Smear

Video signal shading

Dark signal

Dark signal shading

Line crawl G

Line crawl R

Line crawl B

Lag

Vsat

SHg

Vdt

Lcg

Lcr

Lcb

Lag

200

0.46

0.33

420

250

0.72

0.59

3.8

0.5

1/30s accumulation

Ta = 60°C

Frame readout mode

High frame rate readout mode

Zone 0 and

Zone 0 to

II'

Ta = 60°C, 15 frame/s

Ta = 60°C, 15 frame/s,

Symbol

Min.

Typ.

Max.

Unit

Measurement

method

Remarks

Zone Definition of Video Signal Shading

1636 (H)

Zone 0,

Zone

Ignored region

Effective pixel region

1236 (V)

Measurement System

CCD

C.D.S

S/H

AMP

CCD signal output [

Gr/Gb channel signal output [

S/H

R/B channel signal output [

Gr/Gb

R/B

Note) Adjust the amplifier gain so that the gain between [

A] and [

B], and between [

A] and [

C] equals 1.

After closing the mechanical shutter, the smear can be reduced to below the detection limit by performing

vertical register sweep operation.

Excludes vertical dark signal shading caused by vertical register high-speed transfer.

ICX434DQN

Readout modes

The diagram below shows the output methods for the following two readout modes.

OUT

Frame readout mode

High frame rate readout mode

1st field

2nd field

Note) Blacked out portions in the diagram indicate pixels which are not read out.

Output starts from the line 2 in high frame rate readout mode

1. Frame readout mode

In this mode, all pixel signals are divided into two fields and output.
All pixel signals are read out independently, making this mode suitable for high resolution image capturing.

2. High frame rate readout mode

All effective area signals are output in 1/4 the period for frame readout mode by reading out two lines for
every eight lines. The number of output lines is 309 lines.
This readout mode emphasizes processing speed over vertical resolution.

Image Sensor Characteristics Measurement Method

Color coding of this image sensor & Readout

The primary color filters of this image sensor are arranged in the
layout shown in the figure on the left (Bayer arrangement).
Gr and Gb denote the G signals on the same line as the R signal
and the B signal, respectively.
For frame readout, the A1 and A2 lines are output as signals in the
A field, and the B1 and B2 lines in the B field.

Horizontal register

Color Coding Diagram

ICX434DQN

Measurement conditions

1) In the following measurements, the device drive conditions are at the typical values of the bias and clock

voltage conditions, and the frame readout mode is used.

2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical

black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb
channel signal output or the R/B channel signal output of the measurement system.

Definition of standard imaging conditions

1) Standard imaging condition

Use a pattern box (luminance: 706cd/m

, color temperature of 3200K halogen source) as a subject. (Pattern

for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter
and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity testing luminous intensity.

2) Standard imaging condition

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.

3) Standard imaging condition

III

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens (exit pupil distance 33mm) with CM500S (t = 1.0mm) as an IR cut filter. The
luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. G sensitivity, sensitivity comparison

Set to standard imaging condition

. After selecting the electronic shutter mode with a shutter speed of

1/100s, measure the signal outputs (V

, V

and V

) at the center of each Gr, Gb, R and B channel

screen, and substitute the values into the following formulas.

= (V

+ V

)/2

Sg = V

100/30 [mV]

Rr = V

Rb = V

2. Saturation signal

Set to standard imaging condition

. After adjusting the luminous intensity to 20 times the intensity with the

average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal
outputs.

3. Smear

Set to standard imaging condition

. With the lens diaphragm at F5.6 to F8, first adjust the average value of

the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R
signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 times
the intensity with the average value of the Gr signal output, 150mV. After the readout clock is stopped and
the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum
value (V

[mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into the

following formula.

Sm = 20

log

(

Vsm ÷

)

[dB] (1/10V method conversion value)

500

Gra + Gba + Ra + Ba

ICX434DQN

4. Video signal shading

Set to standard imaging condition

III

. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity

so that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and

minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula.

SHg = (Grmax Grmin)/150

100 [%]

5. Dark signal

Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and

the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

6. Dark signal shading

After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark

signal output and substitute the values into the following formula.

Vdt = Vdmax Vdmin [mV]

7. Line crawl

Set to standard imaging condition

. Adjusting the luminous intensity so that the average value of the Gr

signal output is 150mV, and then insert R, G and B filters and measure the difference between G signal

lines (

Glr,

Glg,

Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab).

Substitute the values into the following formula.

Lci =

Gli/Gai

100 [%] (i = r, g, b)

8. Lag

Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it

strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following

formula.

Lag = (Vlag/150)

100 [%]

Vlag (lag)

Gr signal output 150mV

Light

Strobe light

timing

Output

ICX434DQN

Drive Circuit

0.1

0.01

3.3

F/20V

0.1

4.7k

100k

CCD OUT

2SC4250

CXD3400N

ICX434DQN

(BOTTOM VIEW)

3.3

F/16V

F/35V

3.3V

7.5V

15V

GND

SUB

GND

OUT

SHT

V3B

V3A

V1B

V1A

GND

XSUB

XV3

XSG3B

XSG3A

XV1

XSG1B

XSG1A

XV4

XV1

VR1 (3.9k)

SUB

Cont.

ICX434DQN

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensors.

e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering

a) Make sure the package temperature does not exceed 80°C.

b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W

soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,

cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero-cross On/Off type and connect it to ground.

3) Dust and dirt protection

Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and

dirt. Clean glass plates with the following operations as required, and use them.

a) Perform all assembly operations in a clean room (class 1000 or less).

b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air

is recommended.)

c) Clean with a cotton bud and ethyl alcohol if grease stained. Be careful not to scratch the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching)

a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for

installation, use either an elastic load, such as a spring plate, or an adhesive.

Compressive strength

50N

Cover glass

Plastic package

50N

1.2Nm

Torsional strength

ICX434DQN

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,

and indicated values should be transferred to other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others

a) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high

luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the

image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In such

a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-

off mode should be properly arranged. For continuous using under cruel condition exceeding the normal

using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

ICX434DQN

CKA

GE STR

UCTURE

CKA

GE MA

TERIAL

LEAD TREA

TMENT

LEAD MA

TERIAL

CKA

GE MASS

DRA

WING NUMBER

Plastic

GOLD PLA

ING

0.50g

42 ALLO

AS-D21(E)

0.64

5.0

0.47

0.6

2.5

7.0

0.6

2.3

1.7

2.5

7.0

2.5

1.27

2.0

0.25

0.05

8.9

10.0

0.10

8.9

(0.6)

0° to 10°

10.0

0.10

12.0

0.15

0.3

0.30

0.15

1.0

0.10

2.50

0.15

16 pin SOP

"A"

is the center of the eff

ectiv

e image area.

The tw

o points

"B"

of the pac

kage are the hor

ontal ref

erence

The point

"B'"

of the pac

kage is the v

r
tical ref

erence

The bottom

"C"

of the pac

kage

, and the top of the co

er glass

"D"

are the height ref

erence

The center of the eff

ectiv

e image area relativ

e to

"B"

and

"B"

is (H,

V) = (5.0, 5.0)

0.07mm.

The rotation angle of the eff

ectiv

e image area relativ

e to H and

V is

1°.

The height from the bottom

"C"

to the eff

ectiv

e image area is 1.20

0.10mm.

The height from the top of the co

er glass

"D"

to the eff

ectiv

e image area is 1.30

0.15mm.

The tilt of the eff

ectiv

e image area relativ

e to the bottom

"
is less than 25

The tilt of the eff

ectiv

e image area relativ

e to the top

"D"

of the co

er glass is less than 25

The thic

kness of the co

er glass is 0.5mm, and the refr

activ

e inde

x is 1.5.

The notches on the bottom of the pac

kage are used only f

or directional inde

x, the

y m

ust

not be used f

or ref

erence of fixing.

Package Outline

Unit: mm

Sony Corporation

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