2048-pixel CCD Linear Image Sensor (B/W)
Description
The ILX503A is a reduction type CCD linear sensor
designed for facsimile, image scanner and OCR use.
This sensor reads B4 size documents at a density of
200 DPI (Dot Per Inch). A built-in timing generator
and clock-drivers ensure direct drive at 5V logic for
easy use.
Features
Number of effective pixels: 2048 pixels
Pixel size: 14m
14m (14m pitch)
Built-in timing generator and clock-drivers
Ultra low lag
Maximum clock frequency: 5MHz
Absolute Maximum Ratings
Supply voltage
V
DD1
11
V
V
DD2
6
V
Operating temperature
10 to +55
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
1
E92Y21E78-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX503A
22 pin DIP (Plastic)
1
V
OUT
2
GND
3
GND
4
SHSW
5
CLK
6
V
DD1
7
GND
8
V
DD2
9
T1
10
NC
11
ROG
12
GND
22
21
20
19
18
17
16
15
14
13
V
DD2
EXRS
V
DD1
RSSW
V
GG
GND
GND
V
DD1
NC
NC
1
2048
For the availability of this product, please contact the sales office.
2
ILX503A
Block Diagram
V
OUT
GND
GND
SHSW
CLK
V
DD1
GND
V
DD2
T1
NC
ROG
GND
V
DD2
EXRS
V
DD1
RSSW
V
GG
GND
GND
V
DD1
NC
NC
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
1
Read out gate
CCD analog shift register
Clock-drivers
Clock pulse generator
Sample-and-hold pulse
generator
Mode
selector
Read out gate
pulse generator
Output amplifier
Sample-and-hold
circuit
D39
D38
D37
D36
D35
D34
S2048
S2047
S2
S1
D33
D15
D14
3
ILX503A
Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
V
OUT
GND
GND
SHSW
CLK
V
DD1
GND
V
DD2
T1
NC
ROG
GND
NC
NC
V
DD1
GND
GND
V
GG
RSSW
V
DD1
EXRS
V
DD2
Description
Signal output
GND
GND
with S/H
GND
Switch
without S/H
V
DD2
Clock pulse
9V power supply
GND
5V power supply
Test pin (V
DD2
)
Clock pulse
GND
9V power supply
GND
GND
Output circuit gate bias
RS pulse external, internal selection
(External RS
V
DD2
, Internal RS
GND)
9V power supply
RS input pin during external RS pulse usage
5V power supply
{
4
ILX503A
Item
Input capacity of
CLK pin
Input capacity of
ROG pin
Input capacity of EXRS pin
Min.
--
--
--
Typ.
10
10
10
Max.
--
--
--
Unit
pF
pF
pF
Symbol
C
CLK
C
ROG
C
EXRS
Input Capacity of Pins
Parameter
Input clock high level
Input clock low level
Min.
4.5
0.0
Typ.
5.0
--
Max.
5.5
0.5
Unit
V
V
Recommended Input Pulse Voltage
Item
V
DD1
V
DD2
Min.
8.5
4.75
Typ.
9.0
5.0
Max.
9.5
5.25
Unit
V
V
Recommended Voltage
Note) Rules for raising and lowering power supply voltage
To raise power supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V).
To lower voltage, first lower V
DD2
(5V) and then V
DD1
(9V).
Mode Description
Pin condition
Internal
Externel
21 pin EXRS
V
DD2
V
DD2
RS
19 pin RSSW
GND
GND
V
DD2
4 pin SHSW
S/H
RS
GND
V
DD2
V
DD2
Yes
No
No
Mode Description
5
ILX503A
Item
Sensitivity 1
Sensitivity 2
Sensitivity 3
Sensitivity 4
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Dynamic range
Saturation exposure
9V supply current
5V supply current
Total transfer efficiency
Output impedance
Offset level
Min.
22.5
--
--
--
--
1.5
--
--
--
750
0.040
--
--
92.0
--
--
Typ.
30
95
20
500
2.0
1.8
0.3
0.5
0.02
6000
0.060
8.0
3.0
97.0
600
4.5
Max.
37.5
--
--
--
8.0
--
2.0
3.0
--
--
--
14.0
6.0
--
--
--
Unit
V/(lx s)
V/(lx s)
V/(lx s)
V/(lx s)
%
V
mV
mV
%
--
lx s
mA
mA
%
V
Remarks
Note 1
Note 2
Note 3
Note 4
Note 5
--
Note 6
Note 6
Note 7
Note 8
Note 9
--
--
--
--
Note 10
Symbol
R1
R2
R3
R4
PRNU
V
SAT
V
DRK
DSNU
IL
DR
SE
I
VDD1
I
VDD2
TTE
Z
O
V
OS
Electro-optical Characteristics
(Ta = 25C, V
DD1
= 9V, V
DD2
= 5V, Clock frequency: 1MHz,
Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm)),
When Internal RS (Pin 19 = GND, Pin 21 = V
DD2
)
Notes)
1) For the sensitivity test light is applied with a uniform intensity of illumination.
2) W lamp (2854K)
3) Light source: LED
= 570nm
4) Light source: LED
= 660nm
5) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1.
PRNU =
100 [%]
The maximum output is set to V
MAX
, the minimum output to V
MIN
and the average output to V
AVE
.
6) Integration time is 10ms.
7) V
OUT
= 500mV
8) DR = V
SAT
/V
DRK
When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in
propagation to optical accumulated time.
9) SE = V
SAT
/R1
10) V
OS
is defined as indicated below.
(V
MAX
V
MIN
)/2
V
AVE
OS
GND
D32
D33
S1
D31
V
OS
6
ILX503A
Clock Timing Diagram
(For internal RS mode)
ROG
CLK
V
OUT
5
0
5
0
1
2
3
4
2087
1
2
D2
D1
D3
D4
D5
D6
D11
D12
D13
D14
D15
D31
D32
D33
S1
S2
S3
S4
S2045
S2046
S2047
S2048
D34
D35
D36
D37
D38
D39
1-line output period (2087 pixels)
Dummy signal (33 pixels)
Effective picture
elements signal
(2048 pixels)
Dummy signal
(6 pixels)
Optical black
(18 pixels)
Internal S/H is not in use (Pin 4
V
DD2
)
7
ILX503A
Clock Timing Diagram
(For external RS mode)
ROG
CLK
V
OUT
5
0
5
0
1
2
3
4
2087
1
2
D2
D3
D4
D5
D6
D11
D12
D13
D14
D15
D31
D32
D33
S1
S2
S3
S4
S2045
S2046
S2047
S2048
D34
D35
D36
D37
D38
D39
1-line output period (2087 pixels)
Dummy signal (33 pixels)
Effective picture
elements signal
(2048 pixels)
Dummy signal
(6 pixels)
Optical black
(18 pixels)
5
0
RS
8
ILX503A
CLK, V
OUT
Timing (For internal RS mode)
t1
t2
t3
t4
t17
t10
CLK
V
OUT
Item
CLK pulse rise/fall time
CLK pulse duty
1
CLK V
OUT
1
CLK V
OUT
2
Min.
0
40
50
30
Typ.
10
50
80
75
Max.
--
60
110
120
Unit
ns
%
ns
ns
Symbol
t1, t2
--
t10
t17
1
100
t3/(t3 + t4)
9
ILX503A
CLK,
RS, V
OUT
Timing (For external RS mode)
t1
t2
t3
t4
t18
t10
CLK
V
OUT
t8
t9
RS
t7
t6
t11
t5
Item
CLK,
RS pulse rise/fall time
CLK pulse duty
1
CLK
RS pulse timing
CLK
RS pulse timing
RS pulse period
CLK V
OUT
RS V
OUT
Min.
--
40
0
50
50
50
30
Typ.
10
50
100
100
100
80
50
Max.
50
60
--
--
--
110
70
Unit
ns
%
ns
ns
ns
ns
ns
Symbol
t1, t2, t8, t9
--
t6
t7
t5
t10
t11, t18
1
100
t3/(t3 + t4)
10
ILX503A
ROG,
CLK Timing
t12
CLK
t16
t15
t13
t14
ROG
Item
ROG,
CLK pulse timing
ROG pulse rise/fall time
ROG pulse period
Min.
500
0
500
Typ.
1000
10
1000
Max.
--
--
--
Unit
ns
ns
ns
Symbol
t12, t16
t13, t15
t14
11
ILX503A
Spectral sensitivity characteristics
(Standard characteristics)
400
500
600
700
800
900
1000
Wavelength [nm]
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
Relative sensitivity
0
0.2
0.4
0.6
0.8
1.0
0
X-MTF
Normalized spatial frequency
0.2
0.4
0.6
0.8
1.0
0
Spatial frequency [cycles/mm]
7.1
14.3
21.4
28.6
35.7
0
0.2
0.4
0.6
0.8
1.0
0
Y-MTF
MTF of main scanning direction
(Standard characteristics)
MTF of sub scanning direction
(Standard characteristics)
Normalized spatial frequency
0.2
0.4
0.6
0.8
1.0
0
Spatial frequency [cycles/mm]
7.1
14.3
21.4
28.6
35.7
Ta = 25C
Example of Representative Characteristics
12
ILX503A
0.1M
0.5
1
5
10
0.1
I
VDD1
, I
VDD2
V
DD1
, V
DD2
supply current [mA]
V
DD
1, V
DD
2 supply current vs. Clock frequency
(Standard characteristics)
Clock frequency [Hz]
1M
5M
I
VDD1
I
VDD2
0
0.5
1
5
10
0.1
Dark signal voltage rate
Dark signal voltage rate vs. Ambient temperature
(Standard characteristics)
Ta Ambient temperature [C]
10
20
30
40
50
13
ILX503A
Application Circuit
(When internal RS)
1
2
3
4
5
6
7
8
9
10
11
12
22
21
20
19
18
17
16
15
14
13
V
OUT
(D)
GND
(A)
GND
SHSW
CLK
(A)
V
DD1
(D)
GND
(D)
V
DD2
T1
NC
ROG
NC
GND
(D)
V
DD2
(D)
EXRS
V
DD1
(A)
RSSW
V
GG
GND
(A)
GND
(A)
V
DD1
(A)
NC
22 pin DIP
10
/16V
1
5V
9V
CLK
ROG
22
/10V
0.01
Output signal
3k
10
/16V
0.01
2SA1175
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
14
ILX503A
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Regulation for raising and lowering the power supply voltage
When raising the supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V). Similarly, lower V
DD2
(5V) first and
then V
DD1
(9V).
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air
is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
15
ILX503A
Package Outline
Unit: mm
PACKAGE STRUCTURE
22pin DIP (400mil)
V
H
41.6
0.5
7.35
0.8
5.0 0.5
11
1
12
22
No.1 Pixel
40.2
9.0
10.16
0 to 9
0.25
0.51
2.54
4.0 0.5
3.3 0.5
10.0 0.5
0.3
2.6
28.672 (14
m
2048Pixels)
1.
The height from the bottom to the sensor surface is 1.61
0.3mm.
2.
The thickness of the cover glass is 0.7mm, and the refractive
index is 1.5 .
(AT STAND OFF)
M
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
Cer-DIP
TIN PLATING
42 ALLOY
3.9g
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