2592-pixel CCD Linear Image Sensor (B/W)
Description
The ILX505A is a reduction type CCD linear sensor
designed for facsimile, image scanner and OCR use.
This sensor reads A3 size documents at a density of
200 DPI (Dot Per Inch). A built-in timing generator
and clock-drivers ensure direct drive at 5V logic for
easy use.
Features
Number of effective pixels: 2592 pixels
Pixel size: 11m
11m (11m pitch)
Built-in timing generator and clock-drivers
Ultra low lag
High sensitivity
Maximum clock frequency: 5MHz
Absolute Maximum Ratings
Supply voltage
V
DD1
11
V
V
DD2
6
V
Operating temperature
10 to +55
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
1
E92Y22D78-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX505A
22 pin DIP (Ceramic)
1
V
OUT
2
GND
3
GND
4
SHSW
5
CLK
6
V
DD1
7
GND
8
V
DD2
9
T1
10
EXRS
11
ROG
12
GND
22
21
20
19
18
17
16
15
14
13
V
DD2
NC
V
DD1
RSSW
V
GG
GND
GND
V
DD1
NC
NC
1
2592
For the availability of this product, please contact the sales office.
2
ILX505A
Block Diagram
V
OUT
GND
GND
SHSW
CLK
V
DD1
GND
V
DD2
T1
NC
ROG
GND
V
DD2
EXRS
V
DD1
RSSW
V
GG
GND
GND
V
DD1
NC
NC
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
1
Read out gate
CCD analog shift register
Clock-drivers
Clock pulse generator
Sample-and-hold pulse
generator
Mode
selector
Read out gate
pulse generator
Output amplifier
Sample-and-hold
circuit
D39
D38
D37
D36
D35
D34
S2592
S2591
S2
S1
D33
D15
D14
3
ILX505A
Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
V
OUT
GND
GND
SHSW
CLK
V
DD1
GND
V
DD2
T1
EXRS
ROG
GND
NC
NC
V
DD1
GND
GND
V
GG
RSSW
V
DD1
NC
V
DD2
Description
Signal output
GND
GND
with S/H
GND
Switch
without S/H
V
DD2
Clock pulse
9V power supply
GND
5V power supply
Test pin (V
DD2
)
External RS pulse input. Must be connected to
V
DD2
when the internal RS pulse is used.
Clock pulse
GND
NC
NC
9V power supply
GND
GND
Output circuit gate bias
Reset pulse switchover pin
9V power supply
NC
5V power supply
{
4
ILX505A
Item
V
DD1
V
DD2
Min.
8.5
4.75
Typ.
9.0
5.0
Max.
9.5
5.25
Unit
V
V
Recommended Voltage
Note) Rules for raising and lowering power supply voltage
To raise power supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V).
To lower voltage, first lower V
DD2
(5V) and then V
DD1
(9V).
Internal RS
Externel RS
10 pin EXRS
V
DD2
RS
19 pin RSSW
GND
V
DD2
Mode in Use
Mode Description
Note) When the external RS mode is in use, operation of use internal S/H is not guaranteed. Pin 4 must be
connected to 5V DC power supply.
5
ILX505A
Item
Sensitivity 1
Sensitivity 2
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Dynamic range
Saturation exposure
9V supply current
5V supply current
Total transfer efficiency
Output impedance
Offset level
Min.
16.8
--
--
1.5
--
--
--
--
--
--
--
92.0
--
--
Typ.
21
53
2.0
1.8
0.3
0.5
0.02
6000
0.085
14.0
5.0
97.0
600
4.5
Max.
25.2
--
8.0
--
2.0
3.0
--
--
--
20.0
10.0
--
--
--
Unit
V/(lx s)
V/(lx s)
%
V
mV
mV
%
--
lx s
mA
mA
%
V
Remarks
Note 1
Note 2
Note 3
--
Note 4
Note 4
Note 5
Note 6
Note 7
--
--
--
--
Note 8
Symbol
R1
R2
PRNU
V
SAT
V
DRK
DSNU
IL
DR
SE
I
VDD1
I
VDD2
TTE
Z
O
V
OS
Electro-optical Characteristics
(Ta = 25C, V
DD1
= 9V, V
DD2
= 5V, Clock frequency: 1MHz,
Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm)),
When Internal RS (Pin 19 = GND, Pin 10 = V
DD2
)
Notes)
1) For the sensitivity test light is applied with a uniform intensity of illumination.
2) W lamp (2854K)
3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1.
PRNU =
100 [%]
The maximum output of all the valid pixels is set to V
MAX
, the minimum output to V
MIN
and the average
output to V
AVE
.
4) Integration time is 10ms.
5) V
OUT
= 500mV
6) DR = V
SAT
/V
DRK
7) SE = V
SAT
/R1
8) V
OS
is defined as indicated below.
Signal is observed at PNP-type emitter follower out.
(V
MAX
V
MIN
)/2
V
AVE
OS
GND
D32
D33
S1
D31
V
OS
6
ILX505A
Clock Timing Diagram
(For internal RS mode)
ROG
CLK
V
OUT
5
0
5
0
1
2
3
4
2631
1
2
D2
D1
D3
D4
D5
D6
D11
D12
D13
D14
D15
D31
D32
D33
S1
S2
S3
S4
S2589
S2590
S2591
S2592
D34
D35
D36
D37
D38
D39
1-line output period (2631 pixels)
Dummy signal (33 pixels)
Effective picture
elements signal
(2592 pixels)
Dummy signal
(6 pixels)
Optical black
(18 pixels)
Internal S/H is not in use
7
ILX505A
Clock Timing Diagram
(For external RS mode)
ROG
CLK
V
OUT
5
0
5
0
1
2
3
4
2631
1
2
D2
D3
D4
D5
D6
D11
D12
D13
D14
D15
D31
D32
D33
S1
S2
S3
S4
S2589
S2590
S2591
S2592
D34
D35
D36
D37
D38
D39
1-line output period (2631 pixels)
Dummy signal (33 pixels)
Effective picture
elements signal
(2592 pixels)
Dummy signal
(6 pixels)
Optical black
(18 pixels)
5
0
RS
8
ILX505A
CLK, V
OUT
Timing (For internal RS mode)
t1
t2
t3
t4
t17
t10
CLK
V
OUT
Item
CLK pulse rise/fall time
CLK pulse duty
1
CLK V
OUT
1
CLK V
OUT
2
Min.
0
40
50
30
Typ.
10
50
80
75
Max.
--
60
110
120
Unit
ns
%
ns
ns
Symbol
t1, t2
--
t10
t17
1
100
t3/(t3 + t4)
9
ILX505A
CLK,
RS, V
OUT
Timing (For external RS mode)
t1
t2
t3
t4
t10
CLK
V
OUT
t8
t9
RS
t7
t6
t11
t5
Item
CLK,
RS pulse rise/fall time
CLK pulse duty
1
CLK
RS pulse timing
CLK
RS pulse timing
RS pulse period
CLK V
OUT
RS V
OUT
Min.
0
40
0
50
50
50
30
Typ.
10
50
100
100
100
80
50
Max.
--
60
--
--
--
110
70
Unit
ns
%
ns
ns
ns
ns
ns
Symbol
t1, t2, t8, t9
--
t6
t7
t5
t10
t11
1
100
t3/(t3 + t4)
10
ILX505A
ROG,
CLK Timing
t12
CLK
t16
t15
t13
t14
ROG
Item
ROG,
CLK pulse timing
ROG pulse rise/fall time
ROG pulse period
Min.
500
0
500
Typ.
1000
10
1000
Max.
--
--
--
Unit
ns
ns
ns
Symbol
t12, t16
t13, t15
t14
11
ILX505A
Spectral sensitivity characteristics
(Standard characteristics)
400
500
600
700
800
900
1000
Wavelength [nm]
1
2
3
4
5
6
7
8
9
10
0
Relative sensitivity
0
0.2
0.4
0.6
0.8
1.0
0
X-MTF
MTF of main scanning direction
(Standard characteristics)
Normalized spatial frequency
0.2
0.4
0.6
0.8
1.0
0
Spatial frequency [cycles/mm]
9.1
18.2
27.3
36.4
45.5
0
0.2
0.4
0.6
0.8
1.0
0
Y-MTF
MTF of sub scanning direction
(Standard characteristics)
Normalized spatial frequency
0.2
0.4
0.6
0.8
1.0
0
Spatial frequency [cycles/mm]
9.1
18.2
27.3
36.4
45.5
= 560nm
= 560nm
Ta = 25C
Example of Representative Characteristics
12
ILX505A
Application Circuit
1
2
3
4
5
6
7
8
9
10
11
12
22
21
20
19
18
17
16
15
14
13
(D)
(A)
5V
9V
CLK
ROG
3k
2SA1175
(A)
(A)
(D)
(A)
(D)
(D)
(D)
(D)
(D)
(D)
(A)
(A)
(A)
(A)
(A)
(A)
(D)
10
1000p
10
1000p
10
10
1000p
10
1000p
5V
1000p
10
9V
100
V
OUT
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
Internal S/H is in use. Pin 4 must be connected to 5V DC power supply when S/H is not used.
Internal RS mode is used. For the external RS mode, connect Pin 19 and Pin 4 to 5V DC power supply and
input a proper clock pulse into Pin 10.
When noise influence into output signal is large, connect pins indicated by (A) to the analog power supply
and pins indicated by (D) to the digital power supply, and also use a decoupling capacitor of large
capacitance.
13
ILX505A
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Regulation for raising and lowering the power supply voltage
When raising the supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V). Similarly, lower V
DD2
(5V) first and
then V
DD1
(9V).
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air
is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
14
ILX505A
Package Outline
Unit: mm
PACKAGE STRUCTURE
22pin DIP (400mil)
V
H
41.6
0.5
7.6
0.8
5.0 0.5
11
1
12
22
No.1 Pixel
40.2
9.0
10.16
0 to 9
0.25
0.51
2.54
4.0 0.5
3.3 0.5
10.0 0.5
0.3
2.6
28.512 (11
m X 2592Pixels)
1.
The height from the bottom to the sensor surface is 1.61
0.3mm.
2.
The thickness of the cover glass is 0.7mm, and the refractive
index is 1.5.
(AT STAND OFF)
M
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
Cer-DIP
TIN PLATING
42 ALLOY
3.9g
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ZIP