Description
The ILX524K is a reduction type CCD linear sensor
developed for color image scanner. This sensor
reads legal-size documents at a density of 300 DPI.
Features
Number of effective pixels:
8100 pixels (2700 pixels
3)
Pixel size:
8m
8m (8m pitch)
Distance between line: 64m (8 Lines)
Single-sided readout
Ultra low lag / High sensitivity
Single 12V power supply
Input clock pulse:
CMOS 5V drive
Number of output
3 (R, G, B)
Package:
22 pin cer-DIP (400 mil)
Absolute Maximum Ratings
Supply voltage
V
DD
15
V
Operating temperature
10 to +55
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
Block Diagram
1
ILX524K
E95815-PK
2700
3pixel CCD Linear Sensor (Color)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
22 pin DIP (Cer-DIP)
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2700
R
1
2700
G
1
2700
B
1
V
OUT-G
V
OUT-B
V
DD
NC
NC
NC
V
DD
2
NC
ROG
-B
ROG
-G
V
OUT-R
GND
RS
LH
GND
NC
NC
1
NC
ROG
-R
GND
D14
D15
D63
S1
D64
D75
Read Out Gate
CCD Register
S2700
Driver
D14
D15
D63
S1
D64
D75
Read Out Gate
CCD Register
S2700
Driver
D14
D15
D63
S1
D64
D75
Read Out Gate
CCD Register
S2700
Driver
Driver
Blue
Green
Red
ROG
-B
ROG
-G
ROG
-R
V
OUT-B
V
OUT-G
V
OUT-R
V
DD
LH
V
DD
2
GND
RS
GND
1
GND
20
4
16
15
13
12
10
11
8
5
3
2
1
22
21
For the availability of this product, please contact the sales office.
2
ILX524K
Pin Description
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
V
OUT-R
GND
RS
LH
GND
NC
NC
1
NC
ROG-
R
GND
Signal out (red)
GND
Clock pulse input
Clock pulse input
GND
NC
NC
Clock pulse input
NC
Clock pulse input
GND
12
13
14
15
16
17
18
19
20
21
22
ROG-
G
ROG-
B
NC
2
V
DD
NC
NC
NC
V
DD
V
OUT-B
V
OUT-G
Clock pulse input
Clock pulse input
NC
Clock pulse input
12V power supply
NC
NC
NC
12V power supply
Signal out (blue)
Signal out (green)
Recommended Supply Voltage
Item
V
DD
Min.
11.4
Typ.
12.0
Max.
12.6
Unit
V
Clock Characteristics
Symbol
C
1, C
2
C
LH
C
RS
C
ROG
Min.
--
--
--
--
Typ.
400
10
10
10
Max.
--
--
--
--
Unit
pF
pF
pF
pF
Item
Input capacity of
1,
2
Input capacity of
LH
Input capacity of
RS
Input capacity of
ROG
Input Clock Pulse Voltage Condition
High level
Low level
Min.
4.75
--
Typ.
5.0
0
Max.
5.25
0.1
Unit
V
V
Item
1,
2,
LH,
RS,
ROG pulse voltage
It indicates that
ROG-
R
,
ROG-
G
,
ROG-
B
as
ROG.
Clock Frequency
Min.
--
Typ.
1
Max.
5
Unit
MHz
Item
Symbol
1,
2,
LH,
RS
f
1, f
2, f
LH
, f
RS
3
ILX524K
Electrooptical Characteristics (Note 1)
Ta = 25C, V
DD
= 12V, f
RS
= 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)
Item
Symbol
Min.
Typ.
Max.
Unit
Remarks
Sensitivity
Sensitivity nonuniformity
Saturation output voltage
Saturation
exposure
Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level
Dynamic range
R
R
R
G
R
B
PRNU
V
SAT
SE
R
SE
G
SE
B
V
DRK
DSNU
IL
I
VDD
TTE
Z
O
V
OS
DR
1.3
2.1
1.6
--
2
0.74
0.46
0.58
--
--
--
--
92
--
--
1000
2.0
3.2
2.5
4
3.2
1.6
1
1.28
0.3
1.5
0.02
26
98
250
6.5
10670
2.7
4.3
3.4
20
--
--
--
--
2
5
--
50
--
--
--
--
V/(lx s)
%
V
lx s
mV
mV
%
mA
%
V
--
Note 2
Note 3
Note 4
Note 5
Note 6
Note 6
Note 7
--
--
--
Note 8
Note 9
Red
Green
Blue
Red
Green
Blue
Note
1) In accordance with the given electrooptical characteristics, the black level is defined as the average value
of D2, D3 to D12.
2) For the sensitivity test light is applied with a uniform intensity of illumination.
3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
V
OUT-G
= 500mV (Typ.)
PRNU =
100 [%]
Where the 2700 pixels are divided into blocks of 100. The maximum output of each block is set to V
MAX
,
the minimum output to V
MIN
and the average output to V
AVE
.
4) Use below the minimum value of the saturation output voltage.
5) Saturation exposure is defined as follows.
SE =
Where R indicates R
R
, R
G
, R
B
, and SE indicates SE
R
, SE
G
, SE
B
.
6) Optical signal accumulated time
int stands at 10ms.
7) V
OUT-G
= 500mV (Typ.)
8) Vos is defined as indicated bellow.
V
OUT
indicates V
OUT-R
, V
OUT-G
, and V
OUT-B
.
9) Dynamic range is defined as follows.
DR =
When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical
signal accumulated time is in proportion to the dark voltage.
(V
MAX
V
MIN
) /2
V
AVE
V
OS
V
OUT
GND
V
SAT
R
V
SAT
V
DRK
4
ILX524K
2
1
3
4
2775
D1
D2
D3
D13
D14
D15
D61
D62
D63
S1
S2
S2698
S2699
S2700
D64
D65
D70
D71
D75
Optical black (49 pixels)
Dummy signal (63 pixels)
1-line output period (2775 pixels)
ROG
1
LH
2
RS
V
OUT
5
0
5
0
5
0
5
0
Clock Timing Chart 1
Note)
The transfer pulses (
1,
2,
LH) must have more than 2775 cycles.
V
OUT
indicates V
OUT-R
, V
OUT-G
, V
OUT-B
.
5
ILX524K
Clock Timing Chart 2
t4
t5
t2
t1
t3
t7
t6
ROG
1
2
Clock Timing Chart 3
t7
1
LH
2
V
OUT
t6
t9
t10
t11
t13
t12
t8
RS
6
ILX524K
Clock Pulse Recommended Timing
Symbol
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
t
13
Min.
50
800
800
0
0
0
0
45
45
0
0
--
--
Typ.
100
1000
1000
5
5
20
20
250
250
10
10
10
10
Max.
--
--
--
10
10
60
60
--
--
30
30
--
--
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Item
ROG,
1 pulse timing
ROG pulse high level period
ROG,
1 pulse timing
ROG pulse rise time
ROG pulse fall time
1 pulse rise time /
2 pulse fall time
1 pulse fall time /
2 pulse rise time
RS pulse high level period
RS,
LH pulse timing
RS pulse rise time
RS pulse fall time
Signal output delay time
These timing is the recommended condition under f
RS
= 1MHz.
7
ILX524K
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
V
OUT-R
GND
RS
LH
GND
NC
NC
1
NC
ROG
-R
GND
V
OUT-G
V
OUT-B
V
DD
NC
NC
NC
V
DD
2
NC
ROG
-B
ROG
-G
IC1
2
100
100
100
Tr1
V
OUT-R
0.1
F
47
F/16V
12V
5.1k
V
OUT-G
RS
LH
1
ROG
-R
Tr1
100
100
Tr1
5.1k
5.1k
V
OUT-B
2
IC1
2
ROG
-B
ROG
-G
IC1: 74AC04
Tr1: 2SC2785
Data rate f
RS
= 1MHz.
Application Circuit
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
8
ILX524K
Example of Representative Characteristics (V
DD
= 12V, Ta = 25C)
1
0.8
0.6
0.4
0.2
0
450
400
550
500
650
600
700
Wavelength [nm]
Relative sensitivity
Spectral sensitivity characteristics (Standard characteristics)
1
0
Ta Ambient temperature [C]
Output voltage rate
Dark signal output temperature characteristics
(Standard characteristics)
10
5
0.5
0.1
10
20
30
40
50
60
1
int Integration time [ms]
Output voltage rate
Integration time output voltage characteristics
(Standard characteristics)
1
0.5
0.1
5
10
V
DD
[V]
V
OS
Offset level [V]
Offset level vs. V
DD
characteristics
(Standard characteristics)
12
12
10
8
6
4
2
0
11.4
12.6
Ta = 25C
Ta Ambient temperature [C]
V
OS
Offset level [V]
Offset level vs. temperature characteristics
(Standard characteristics)
12
10
8
6
4
2
0
0
10
20
30
40
50
60
V
OS
V
DD
0.3
V
OS
Ta
0.5mV/C
9
ILX524K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of
the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
29N
29N
0.9Nm
(2)
(3)
(4)
39N
Low-melting glass
(1)
Upper ceramic layer
lower ceramic layer
10
ILX524K
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
11
ILX524K
Package Outline
Unit: mm
1
22
5.0 0.5
H
V
No.1 Pixel (Green)
11
12
0 to 9
(AT STAND OFF)
0.25
0.3
1.
The height from the bottom to the sensor surface is 1.61
0.3mm.
2.
The thickness of the cover glass is 0.8mm, and the refractive index is 1.5.
32.0
0.5
10.0 0.5
9.0
10.16
4.0 0.5
2.54
0.51
2.7
3.5 0.5
22pin DIP (400mil)
21.6 (8
m
2700Pixels)
6.53
0.8
30.6
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
Cer-DIP
TIN PLATING
42 ALLOY
3.0g
M
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