2700
3 pixel CCD Linear Sensor (Color)
Description
The ILX547K is a reduction type CCD linear sensor
developed for color image scanner. This sensor
reads A4-size documents at a density of 300DPI.
The distance between lines is only 4 line (32m). The
power supply of this device is single 5V.
Features
Number of effective pixels: 8100 pixels
(2700 pixels
3)
Pixel size:
8m
8m (8m pitch)
Distance between line:
32m (4 lines)
Maximum data rate:
6MHz (2MHz
3)
Built-in clamp circuit
Low lag/High sensitivity
Single 5V power supply
Input clock pulse:
CMOS 5V drive
Number of output:
3 (R, G, B)
Package:
22 pin Plastic DIP (400mil)
Absolute Maximum Ratings
Supply voltage
V
DD
6
V
Operating temperature
10 to +60
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
Block Diagram
1
E99908-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX547K
22 pin DIP (Plastic)
Amplifier (R)
CLP
V
OUT
(B)
V
OUT
(G)
V
OUT
(R)
V
REF
V
DD
RS
GND
1
ROG
2
Sensor (R)
ROG
driver
CCD analog shift register (R)
Reset out gate (R)
Amplifier (G)
Amplifier (B)
,
Sensor (G)
CCD analog shift register (G)
Reset out gate (G)
Sensor (B)
CCD analog shift register (B)
Reset out gate (B)
Timing
generator
1
2
3
11
12
13
19
20
21
22
1
22
V
REF
2
V
OUT
(G)
3
GND
4
NC
5
NC
6
NC
7
NC
8
NC
9
NC
10
NC
11
21
20
19
18
17
16
15
14
13
12
ROG
V
OUT
(R)
V
OUT
(B)
V
DD
RS
NC
NC
NC
NC
NC
1
2
2700
2700
R1
1
1
G
B
2700
For the availability of this product, please contact the sales office.
2
ILX547K
Unit
pF
pF
pF
Max.
--
--
--
Typ.
900
60
10
Min.
--
--
--
Symbol
C
1
, C
2
C
RS
C
ROG
Item
Input capacity of
1,
2
Input capacity of
RS
Input capacity of
ROG
Input Pin Capacity
Unit
MHz
Max.
2
Typ.
1
Min.
--
Symbol
f
1
, f
2
, f
RS
Item
Item
Frequency of
1,
2,
RS
Clock Frequency
Unit
V
Max.
5.25
Typ.
5
Min.
4.75
Item
V
DD
Recommended Supply Voltage
Unit
V
V
Max.
5.25
0.1
Typ.
5.0
0
Min.
4.75
--
High level
Low level
1,
2,
RS,
ROG pulse voltage
Input Clock Pulse Voltage
Pin Description
Pin
No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
V
REF
V
OUT
(G)
GND
NC
NC
NC
NC
NC
NC
NC
ROG
Reference voltage
Signal output (G)
GND
NC
NC
NC
NC
NC
NC
NC
Clock pulse input
Pin
No.
Symbol
Description
12
13
14
15
16
17
18
19
20
21
22
2
1
NC
NC
NC
NC
NC
RS
V
DD
V
OUT
(B)
V
OUT
(R)
Clock pulse input
Clock pulse input
NC
NC
NC
NC
NC
Clock pulse input
Power supply
Signal output (B)
Signal output (R)
3
ILX547K
Unit
%
V
mV
mV
%
mA
%
V
Remarks
Note 3
Note 4
--
--
--
Note 8
Max.
7.6
9.2
6.5
20
--
--
--
--
3
10
--
15
--
--
--
Typ.
5.6
6.8
4.8
4
1.5
0.27
0.22
0.31
0.5
3
1
9.5
98
430
3.6
Min.
3.6
4.4
3.1
--
1.2
0.16
0.13
0.19
--
--
--
--
92
--
--
Symbol
R
R
R
G
R
B
PRNU
V
SAT
SE
R
SE
G
SE
B
V
DRK
DSNU
IL
I
VDD
TTE
Zo
V
OS
Item
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level
Electrooptical Characteristics (Note 1)
(Ta = 25C, V
DD
= 5V, f
RS
= 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm))
Notes)
1. In accordance with the given electrooptical characteristics, the black level is defined as the average value
of the signal level of the optical black pixels.
2. For the sensitivity test light is applied with a uniform intensity of illumination.
3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
V
OUT
(G) = 500mV (Typ.)
PRNU =
100 [%]
Where the 2700 pixels are divided to blocks of 150, R, G and B pixels, respectively. The maximum output
of each block is set to V
MAX
, the minimum output to V
MIN
and the average output to V
AVE
.
4. Use below the minimum value of the saturation output voltage.
5. Saturation exposure is defined as follows.
SE =
Where R indicates R
R
, R
G
, R
B
, and SE indicates SE
R
, SE
G
, SE
B
.
6. Optical signal accumulated time
int stands at 10ms.
7. V
OUT
(G) = 500mV (Typ.)
8. Vos is defined as indicated bellow.
V
OUT
indicates V
OUT
(R), V
OUT
(G) and V
OUT
(B).
(V
MAX
V
MIN
)/2
V
AVE
V
SAT
R
Sensitivity
Saturation exposure
Red
Green
Blue
Red
Green
Blue
V/(lx s)
Note 2
lx s
Note 5
Note 6
Note 6
Note 7
V
OS
V
OUT
GND
,
4
ILX547K
Clock Timing Chart 1
5
0
5
0
5
0
5
0
R
O
G
1
2
R
S
V
O
U
T
1
2
D1
D2
D3
D1
2
D1
3
D1
4
D6
0
D6
1
D6
2
S1
S2
S2
69
8
S2
69
9
D2
70
0
D6
3
D6
4
3
27
64
,
O
p
t
i
c
a
l
b
l
a
c
k
(
4
8
p
i
x
e
l
s
)
D
u
m
m
y
s
i
g
n
a
l
(
6
2
p
i
x
e
l
s
)
E
f
f
e
c
t
i
v
e
p
i
c
t
u
r
e
e
l
e
m
e
n
t
s
s
i
g
n
a
l
(
2
7
0
0
p
i
x
e
l
s
)
1
-
l
i
n
e
o
u
t
p
u
t
p
e
r
i
o
d
(
2
7
6
4
p
i
x
e
l
s
)
N
o
t
e
)
T
h
e
t
r
a
n
s
f
e
r
p
u
l
s
e
s
(
1
,
2
)
m
u
s
t
h
a
v
e
m
o
r
e
t
h
a
n
2
7
6
4
c
y
c
l
e
s
.
5
ILX547K
Clock Timing Chart 2
ROG
1
2
t1
t2
t4
t5
t3
t7
t6
Clock Timing Chart 3
1
2
V
OUT
RS
t12
t13
t8
t11
t10
t6
t7
t9
,
,
6
ILX547K
Clock Pulse Recommended Timing
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Max.
--
--
--
10
10
60
60
--
--
30
30
--
--
Typ.
100
1000
1000
5
5
10
10
250
1
250
1
10
10
130
40
Min.
50
800
800
0
0
0
0
50
80
0
0
--
--
Symbol
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
Item
ROG,
1 pulse timing
ROG pulse high level period
ROG,
1 pulse timing
ROG pulse rise time
ROG pulse fall time
1 pulse rise time/
2 pulse fall time
1 pulse fall time/
2 pulse rise time
RS pulse high level period
RS,
1 pulse timing
RS pulse rise time
RS pulse fall time
Signal output delay time
1
These timing is the recommended condition under f
RS
= 1MHz.
7
ILX547K
Application Circuit
1
V
RE
F
2
V
OU
T
(G
)
3
GN
D
4
NC
5
NC
6
NC
7
NC
NC
9
NC
1
0
NC
2
0
1
9
1
8
1
6
RO
G
V
OU
T
(R
)
V
OU
T
(B
)
V
DD
RS
NC
NC
NC
NC
NC
1
2
2
B
u
f
f
e
r
1
1
0
0
I
N
B
u
f
f
e
r
1
:
I
C
1
:
7
4
A
C
0
4
5
V
B
u
f
f
e
r
1
0
.
1
F
4
7
F
/
1
6
V
1
0
F
/
1
6
V
V
O
U
T
(
G
)
5
V
2
S
K
5
2
3
O
U
T
1
.
5
k
R
S
V
O
U
T
(
B
)
B
u
f
f
e
r
1
V
O
U
T
(
R
)
2
1
2
2
D
a
t
a
r
a
t
e
f
R
S
=
1
M
H
z
1
0
0
I
C
1
R
O
G
I
C
1
1
5
1
7
8
2
1
2
2
1
4
1
3
1
2
1
1
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility fo
r
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same
.
8
ILX547K
Example of Representative Characteristics (V
DD
= 5V, Ta = 25C)
Wavelength [nm]
R
e
l
a
t
i
v
e
s
e
n
s
i
t
i
v
i
t
y
550
600
650
400
0
0.2
0.4
0.6
0.8
1.0
450
500
700
Spectral sensitivity characteristics (Standard characteristics)
Dark voltage rate vs. Ambient temperature
(Standard characteristics)
Output voltage rate vs. Integration time
(Standard characteristics)
Offset level vs. Supply voltage
(Standard characteristics)
Offset level vs. Ambient temperature
(Standard characteristics)
Ta Ambient temperature [
C]
D
a
r
k
v
o
l
t
a
g
e
r
a
t
e
30
40
50
10
0
0.1
1
100
10
10
20
60
Ta Ambient temperature [
C]
V
o
s
O
f
f
s
e
t
l
e
v
e
l
[
V
]
20
30
40
50
10
0
1
2
3
4
5
0
10
60
V
DD
Supply voltage [V]
V
o
s
O
f
f
s
e
t
l
e
v
e
l
[
V
]
5
4.75
0
1
2
3
5
4
5.25
int Integration time [ms]
O
u
t
p
u
t
v
o
l
t
a
g
e
r
a
t
e
5
1
0.1
1
10
10
Vos
V
DD
0.8
Vos
Ta
1mV/
C
9
ILX547K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
Plastic portion
Cover glass
39N
Ceramic portion
Adhesive
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
,
,
,
,
,
,
,
,
,
,
,
,
,
,
10
ILX547K
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
11
ILX547K
Package Outline
Unit: mm
P
A
C
K
A
G
E
S
T
R
U
C
T
U
R
E
P
A
C
K
A
G
E
M
A
T
E
R
I
A
L
L
E
A
D
T
R
E
A
T
M
E
N
T
L
E
A
D
M
A
T
E
R
I
A
L
P
A
C
K
A
G
E
M
A
S
S
D
R
A
W
I
N
G
N
U
M
B
E
R
P
l
a
s
t
i
c
,
C
e
r
a
m
i
c
G
O
L
D
P
L
A
T
I
N
G
4
2
A
L
L
O
Y
2
.
2
1
g
H
V
1
1
1
1
2
2
2
0
to
9
3
2
.
0
0
.
3
10
.0
0
.3
0.2
5
2
.
5
4
5.0
0
.3
10
.1
6
0
.
5
1
6
.
8
0
.
3
2
1
.
6
(
8
m
X
2
7
0
0
P
i
x
e
l
s
)
9.0
3
0
.
6
2.1
0
2.8
0
0
.5
4.0
0
.5
N
o
.
1
P
i
x
e
l
(
G
r
e
e
n
)
0
.
3
M
2
2
p
i
n
D
I
P
(
4
0
0
m
i
l
)
L
S
-
D
8
-
0
1
(
E
)
1
.
T
h
e
h
e
i
g
h
t
f
r
o
m
t
h
e
b
o
t
t
o
m
t
o
t
h
e
s
e
n
s
o
r
s
u
r
f
a
c
e
i
s
1
.
6
1
0
.
3
m
m
.
2
.
T
h
e
t
h
i
c
k
n
e
s
s
o
f
t
h
e
c
o
v
e
r
g
l
a
s
s
i
s
0
.
7
m
m
,
a
n
d
t
h
e
r
e
f
r
a
c
t
i
v
e
i
n
d
e
x
i
s
1
.
5
.
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