5340 pixel
3 line CCD Linear Sensor (Color)
Description
The ILX548K is a reduction type CCD linear sensor
developed for color image scanner. This sensor reads
A4-size documents at a density of 600DPI.
Features
Number of effective pixels: 16020 pixels
(5340 pixels
3)
Pixel size:
4m
4m (4m pitch)
Distance between line: 32m (8 lines)
Single-sided readout
Ultra low lag/High sensitivity
Single 12V power supply
Maximum data rate:
5MHz/Color
Input clock pulse:
CMOS 5V drive
Number of output:
3 (R, G, B)
Package:
22 pin Cer-DIP (400mil)
22 pin Plastic DIP (400mil)
Absolute Maximum Ratings
Supply voltage
V
DD
15
V
Operating temperature
10 to +55
C
Pin Configuration (Top View)
Block Diagram
1
E00429-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX548K
22 pin DIP (Cer-DIP)
22 pin DIP (Plastic)
D74
D75
S5340
Red
Read out gate
CCD register
D70
D69
S1
D18
D19
D74
D75
S5340
Green
Read out gate
CCD register
D70
D69
S1
D18
D19
D74
D75
S5340
Blue
Read out gate
CCD register
D70
D69
S1
D18
D19
Driver
14
ROG-
R
Driver
12
ROG-
G
Driver
11
ROG-
B
Output
amplifier
22
19
V
OUT
-
R
Output
amplifier
3
V
OUT
-
G
Output
amplifier
20
2
4
1
V
OUT
-
B
GND
V
DD
RS
13
1
10
2
CLP
21
GND
1
22
RS
2
GND
3
V
OUT
-
G
4
V
DD
5
NC
6
NC
7
NC
8
NC
9
NC
10
2
11
21
20
19
18
17
16
15
14
13
12
ROG-
B
CLP
GND
V
OUT
-
B
V
OUT
-
R
NC
NC
NC
NC
ROG-
R
1
ROG-
G
5340
5340
B1
1
1
G
R
5340
For the availability of this product, please contact the sales office.
2
ILX548K
Unit
pF
pF
pF
pF
Max.
--
--
--
--
Typ.
500
10
10
10
Min.
--
--
--
--
Symbol
C
1
, C
2
C
RS
C
CLP
C
ROG
Item
Input capacity of
1,
2
Input capacity of
RS
Input capacity of
CLP
Input capacity of
ROG
Clock Characteristics
Unit
MHz
Max.
5
Typ.
1
Min.
--
Symbol
f
1
, f
2
, f
RS
, f
CLP
Item
Item
1,
2,
RS,
CLP
Clock Frequency
Unit
V
Max.
12.6
Typ.
12
Min.
11.4
Item
V
DD
Recommended Supply Voltage
Unit
V
V
Max.
5.25
0.1
Typ.
5.0
0
Min.
4.75
--
High level
Low level
1,
2,
RS,
CLP,
ROG
pulse voltage
Input Clock Pulse Voltage Condition
Pin Description
Pin
No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
RS
GND
V
OUT
-
G
V
DD
NC
NC
NC
NC
NC
2
ROG-
B
Clock pulse input
GND
Signal output (green)
12V power supply
NC
NC
NC
NC
NC
Clock pulse input
Clock pulse input
Pin
No.
Symbol
Description
12
13
14
15
16
17
18
19
20
21
22
ROG-
G
1
ROG-
R
NC
NC
NC
NC
V
OUT
-
R
V
OUT
-
B
GND
CLP
Clock pulse input
Clock pulse input
Clock pulse input
NC
NC
NC
NC
Signal output (red)
Signal output (blue)
GND
Clock pulse input
3
ILX548K
Unit
%
V
mV
mV
%
mA
%
V
Remarks
Note 3
Note 4
--
--
--
Note 8
Max.
3.6
4.5
3.5
20
--
--
--
--
5
12
--
50
--
--
--
Typ.
2.7
3.3
2.6
4
2.5
0.93
0.76
0.96
2
4
0.02
25
98
450
7.3
Min.
1.8
2.1
1.7
--
2
0.56
0.44
0.57
--
--
--
--
92
--
--
Symbol
R
R
R
G
R
B
PRNU
V
SAT
SE
R
SE
G
SE
B
V
DRK
DSNU
IL
I
VDD
TTE
Zo
V
OS
Item
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level
Electrooptical Characteristics (Note 1)
(Ta = 25C, V
DD
= 12V, f
RS
= 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm))
Notes)
1. In accordance with the given electrooptical characteristics, the black level is defined as the average value
of D18, D19 to D67.
2. For the sensitivity test light is applied with a uniform intensity of illumination.
3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
V
OUT
-
G
= 500mV (Typ.)
PRNU =
100 [%]
Where the 5340 pixels are divided into blocks of 100, the maximum output of each block is set to V
MAX
, the
minimum output to V
MIN
and the average output to V
AVE
.
4. Use below the minimum value of the saturation output voltage.
5. Saturation exposure is defined as follows.
SE =
Where R indicates R
R
, R
G
, R
B
, and SE indicates SE
R
, SE
G
, SE
B
.
6. Optical signal accumulated time
int stands at 5.5ms.
7. V
OUT
-
G
= 500mV (Typ.)
8. Vos is defined as indicated below.
V
OUT
indicates V
OUT
-
R
, V
OUT
-
G
and V
OUT
-
B
.
(V
MAX
V
MIN
)/2
V
AVE
V
SAT
R
Sensitivity
Saturation exposure
Red
Green
Blue
Red
Green
Blue
V/(lx s)
Note 2
lx s
Note 5
Note 6
Note 7
;
;
V
OS
V
OUT
GND
;
;
;
;
4
ILX548K
Clock Timing Chart 1
5
1
0
5
ROG
0
5
2
0
5
RS
0
5
CLP
V
OUT
0
;
;
;
;
;;
;
;
;
;
;
;
1
2
3
4
5415
D1
D2
D3
D17
D18
D19
D67
D68
D69
S1
S2
S5338
S5339
S5340
D70
D71
D74
D75
Optical b
lac
k (50 pix
els)
Dumm
y signal (69 pix
els)
1-line output per
iod (5415 pix
els)
Note)
The tr
ansf
er pulses (
1,
2) m
ust ha
v
e
more than 5415 cycles
.
V
OUT
indicates
V
OUT
-
R
, V
OUT
-G
, V
OUT
-
B.
R
OG indicates
R
OG-
R
,
R
OG-
G
,
R
OG-
B
.
5
ILX548K
Clock Timing Chart 2
ROG
1
2
t1
t2
t4
t5
t3
t7
t6
Clock Timing Chart 3
1
2
V
OUT
RS
t12
t8
t9
t6
t7
t11
t10
t14
t15
t13
CLP
t16
t17
;
;;
;;
;
6
ILX548K
Clock Pulse Recommended Timing
Unit
ns
s
s
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Max.
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Typ.
100
5
2
5
5
20
20
50
1
20
20
50
20
100
100
50
20
20
Min.
50
3
1
0
0
0
0
30
0
0
--
--
40
40
10
0
0
Symbol
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
t16
t17
Item
ROG,
1 pulse timing
ROG pulse high level period
ROG,
1 pulse timing
ROG pulse rise time
ROG pulse fall time
1 pulse rise time/
2 pulse fall time
1 pulse fall time/
2 pulse rise time
RS pulse high level period
RS pulse rise time
RS pulse fall time
Signal output delay time
CLP pulse high level period
CLP pulse timing
CLP pulse rise time
CLP pulse fall time
1
These timing is the recommended condition under f
RS
= 1MHz.
7
ILX548K
Application Circuit
CLP
IC1
100
ROG-
R
ROG-
G
100
IC1
RS
2
IC1
2
1
RS
2
GND
3
V
OUT
-
G
4
V
DD
5
NC
6
NC
7
NC
NC
9
NC
10
2
20
19
18
16
ROG-
B
CLP
GND
V
OUT
-
B
V
OUT
-
R
NC
NC
NC
NC
ROG-
R
1
ROG-
G
IC1: 74AC04
Tr1: 2SC2785
0.1
F
47
F/16V
12V
2
1
100
Data rate f
RS
= 1MHz
100
ROG-
B
IC1
15
17
8
21
22
14
13
12
11
100
Tr1
Tr1
V
OUT
-
G
5.1k
100
100
Tr1
V
OUT
-
B
5.1k
V
OUT
-
R
5.1k
100
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility fo
r
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same
.
8
ILX548K
Example of Representative Characteristics (V
DD
= 12V, Ta = 25C)
Wavelength [nm]
Relative sensitivity
550
600
650
400
0
0.2
0.4
0.6
0.8
1.0
450
500
700
Spectral sensitivity characteristics (Standard characteristics)
Dark voltage rate vs. Ambient temperature
(Standard characteristics)
Output voltage rate vs. Integration time
(Standard characteristics)
Offset level vs. Supply voltage
(Standard characteristics)
Offset level vs. Ambient temperature
(Standard characteristics)
Ta Ambient temperature [
C]
Dark voltage rate
30
40
50
10
0
0.1
1
100
10
10
20
60
Ta Ambient temperature [
C]
Vos
Offset level [V]
20
30
40
50
10
0
2
4
6
8
10
0
10
60
V
DD
Supply voltage [V]
Vos
Offset level [V]
12
11.4
0
2
4
6
10
8
12.6
int Integration time [ms]
Output voltage rate
5
1
0.1
1
10
10
Vos
V
DD
0.7
Vos
Ta
1mV/
C
Ta = 25
C
9
ILX548K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
(6) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(7) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
39N
Lower ceramic layer
Upper ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
;;
;;;
;;;
;;;
;;;
;
;
;;
;
;
;
Plastic portion
Cover glass
39N
Ceramic portion
Adhesive
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
;;
;
;
;
;
;
;
;
;
;
;
;
;;
;
;
;
;
;
;
;
10
ILX548K
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
11
ILX548K
Package Outline
Unit: mm
1
22
5.0
0.5
H
V
No.1 Pixel (Green)
11
12
0
to 9
(AT STAND OFF)
0.25
0.3
1. The height from the bottom to the sensor surface is 1.61 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
32.0 0.5
10.0
0.5
10.16
4.0
0.5
2.54
0.51
2.7
3.4
0.5
22pin DIP (400mil)
21.36 (4m
5340Pixels)
6.22 0.5
Cer-DIP
TIN PLATING
42 ALLOY
3.0g
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
LS-D15(E)
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
H
V
1
11
12
22
Plastic,Ceramic
GOLD PLATING
42ALLOY
0.25
2.54
2.1
6.22 0.3
10.16
0.51
0.3
0
to 9
10.0
0.3
No.1 Pixel (Green)
21.36 (4mX5340Pixels)
32.0 0.3
5.0
0.3
4.0
0.5
2.8
0
.
5
1. The height from the bottom to the sensor surface is 1.61 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
22pin DIP (400mil)
2.21g
LS-D13-01(E)
Sony Corporation
PDF 
ZIP