1
E00X48-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX553A
22 pin DIP (Plastic)
Description
The ILX553A is a reduction type CCD linear sensor
developped for DPPC, multifunction printers. This
sensor reads A4-size documents at a density of 600
DPI at high speed of 16MH
Z
.
Features
Number of effective pixels: 5150 pixels
Pixel size:
7m
7m (7m pitch)
Clamp circuit is on-chip
Ultra high sensitivity/Ultra low lag
Maximum data rate:
16MHz
Single 12V power supply
Input clock pulse:
CMOS 5V drive
Package:
22 pin Plastic DIP (400mil)
Absolute Maximum Ratings
Supply voltage
V
DD
15
V
Operating temperature
10 to +60
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
5150-pixel CCD Linear Sensor (B/W)
Block Diagram
GND
GND
GND
GND
V
OUT
V
DD
GND
1
GND
GND
GND
GND
GND
LH
RS
GND
CLP
ROG
2
GND
GND
GND
1
5150
1
2
3
4
5
6
7
8
9
10
11
22
21
20
19
18
17
16
15
14
13
12
CCD register
Read out gate
Dr
iv
er
V
DD
D14
D15
D63
S1
D64
S5150
D
6
LH
20
2
15
RO
G
16
1
8
RS
19
CLP
17
V
OUT
5
2
ILX553A
Item
Min.
1,
2,
LH,
RS,
CLP,
ROG
pulse voltage
4.75
0
Typ.
5.0
--
Max.
5.25
0.1
Unit
V
V
Input Clock Pulse Voltage Condition
High level
Low level
Item
Min.
1,
2,
LH,
RS,
CLP
--
Typ.
1
Max.
16
Unit
MHz
Clock Frequency
Symbol
f
1
, f
2
, f
LH
, f
RS
, f
CLP
Item
Min.
Input capacity of
1,
2
Input capacity of
LH
1
Input capacity of
RS
1
Input capacity of
CLP
1
Input capacity of
ROG
--
--
--
--
--
Typ.
400
10
10
10
10
Max.
--
--
--
--
--
Unit
pF
pF
pF
pF
pF
Clock Characteristics
Symbol
C
1
, C
2
C
LH
C
RS
C
CLP
C
ROG
Item
Min.
V
DD
11.4
Typ.
12.0
Max.
12.6
Unit
V
Recommended Supply Voltage
Pin Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
GND
GND
GND
GND
V
OUT
V
DD
GND
1
GND
GND
GND
GND
GND
GND
GND
Signal out
12V power supply
GND
Clock pulse input
GND
GND
GND
Pin No.
Symbol
Description
12
13
14
15
16
17
18
19
20
21
22
GND
GND
GND
2
ROG
CLP
GND
RS
LH
GND
GND
GND
GND
GND
Clock pulse input
Clock pulse input
Clock pulse input
GND
Clock pulse input
Clock pulse input
GND
GND
3
ILX553A
Electrooptical Characteristics (Note 1)
Ta = 25C, V
DD
= 12V, f
R
= 2MHz, Input clock = 5Vp-p,
Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)
Item
Min.
Sensitivity
Sensitivity nonuniformity
Saturation output voltage
Saturation exposure
Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level
11.8
--
1
--
--
--
--
--
92
--
--
Typ.
14.8
4
2
0.14
0.3
0.6
0.02
15
98
230
6.2
Max.
17.8
10
--
--
2
3
--
30
--
--
--
Unit
V/(lx s)
%
V
lx s
mV
mV
%
mA
%
V
Symbol
R
PRNU
V
SAT
SE
R
V
DRK
DSNU
IL
I
VDD
TTE
Z
O
V
OS
Remarks
Note 2
Note 3
Note 4
Note 5
Note 6
Note 7
--
--
--
Note 8
Notes
1) In accordance with the given electrooptical characteristics, the even black level is defined as the average
value of D14, D15, to D62.
2) For the sensitivity test light is applied with a uniform intensity of illumination.
3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
V
OUT
= 500mV (Typ.)
PRNU =
100 [%]
The maximum output of 5150 pixels is set to V
MAX
, the minimum output to V
MIN
and the average output to
V
AVE
.
4) Use below the minimum value of the saturation output voltage.
5) Saturation exposure is defined as follows.
SE =
6) Optical signal accumulated time
int stands at 10ms.
7) V
OUT
= 500mV (Typ.)
8) V
OS
is defined as indicated bellow.
(V
MAX
V
MIN
)/2
V
AVE
V
SAT
R
V
OS
V
OUT
GND
4
ILX553A
Clock Timing Chart 1
5
0
5
1
D3
D1
D62
D61
D15
D14
D13
D2
D63
S2
S1
S5150
S5149
S5148
D65
D64
1
2
3
ROG
5
0
0
5
0
LH
2
RS
V
OUT
4
0
5
CLP
Optical black (49 pixles)
Dummy signal (63 pixles)
1-line output period (5220 pixles)
Note) The transfer pulses (
1,
2,
LH) must have more than 5220 cycles.
5
ILX553A
Clock Timing Chart 2
Clock Timing Chart 3
1
LH
ROG
1
LH
2
RS
V
OUT
2
CLP
t9
t10
t6
t5
t4
t6
t7
t7
t11
t8
t1
t3
t2
t14
t13
t15
t12
t17
t16
6
ILX553A
Clock Timing Chart 4
2
LH
0V
5V
1
2
0V
5V
Cross point
1 and
2
Cross point
LH and
2
1.5V (Min.)
2.0V (Min.)
1.5V (Min.)
0.5V (Min.)
7
ILX553A
Item
ROG,
1 pulse timing
ROG pulse high level period
ROG,
1 pulse timing
ROG pulse rise time
ROG pulse fall time
1 pulse rise time/
2 pulse fall time
1 pulse fall time/
2 pulse rise time
RS pulse high level period
RS,
CLP pulse timing
RS pulse rise time
RS pulse fall time
CLP pulse high level period
CLP,
LH pulse timing
CLP pulse rise time
CLP pulse fall time
Signal output delay time
Unit
ns
s
s
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1
These timing is the recommended condition under f
RS
= 1MHz.
Clock Pulse Recommended Timing
Symbol
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
t16
t17
Min.
50
3
1
0
0
0
0
10
10
0
0
20
5
0
0
--
--
Typ.
100
5
2
5
5
20
20
200
1
200
1
10
10
200
1
50
1
10
10
15
8
Max.
--
--
--
10
10
60
60
--
--
30
30
--
--
30
30
--
--
8
ILX553A
Application Circuit
Data rate f
RS
= 1MHz
LH
V
OUT
Tr1
100
2
IC1
1
5.1k
47F/16V
0.1F
12V
100
IC2
RS
100
CLP
100
IC2
IC1
ROG
100
2
2
GND
GND
LH
RS
GND
CLP
17
18
19
20
21
22
RO
G
2
GND
GND
GND
12
13
14
15
16
GND
GND
GND
GND
V
OUT
V
DD
1
2
3
4
5
6
GND
1
GND
GND
GND
7
8
9
10
11
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
IC1: 74AC04
IC2: 74HC04
Tr1: 2SC2785
9
ILX553A
Example of Representative Characteristics (V
DD
= 12V, Ta = 25C)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
500
600
700
Wavelength [nm]
Relativ
e sensitivity
Spectral sensitivity characteristics (Standard characteristics)
800
900
1000
10
5
1
0.5
0.1
0
10
20
Ta Ambient temperature [C]
Dark signal output temperature characteristics
(Standard characteristics)
Output v
o
ltage r
a
te
30
40
50
60
1
0.5
0.1
1
int integration time [ms]
Integration time output voltage characteristics
(Standard characteristics)
Output v
o
ltage r
a
te
5
10
10
Ta = 25C
8
6
4
2
0
11.4
V
OS
V
DD
Offset level vs. V
DD
characteristics
(Standard characteristics)
V
OS
Offset le
v
e
l [V]
12.0
12.6
10
8
6
4
2
0
0
Ta Ambient temperature [C]
V
DD
[V]
0.6
Offset level vs. Temperature characteristics
(Standard characteristics)
V
OS
Offset le
v
e
l [V]
30
20
10
40
50
60
V
OS
Ta
2mV/C
10
ILX553A
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the
following protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Plastic portion
Cover glass
39N
Ceramic portion
Adhesive
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
d) The notch of the plastic portion is used for directional index, and that can not be used for reference of
fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap
with the notch of the plastic portion.
11
ILX553A
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.
Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity
ionized air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to
scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
12
ILX553A
Son
y Cor
por
ation
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Plastic, Ceramic
GOLD PLATING
42 ALLOY
LS-B23-01(E)
1. The height from the bottom to the sensor surface is 2.38 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
The dimension of cover glass is 54.2
9.0mm or 53.0
7.3mm.
5.43g
M
1
22
11
12
10.6 0.3
10.16
55.7 0.3
2.54
0.51
0.25
7.3 or 9.0
53.00 or 54.2
3.58
H
V
22 pin DIP (400mil)
36.05 (7m X 5150pixels)
No.1 Pixel
10.0
0.3
0 to 9
4.28
0.5
0.3
4.0
0.5
5.0
0.3
Package Outline Unit: mm
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