10680 pixel

10680 pixel×

× 6line CCD Linear Sensor (Color)

6line CCD Linear Sensor (Color)

Description

The ILX585K is reduction type CCD linear sensor
developed for color image scanner.This sensor
reads A4-size documents at a density of 1200DPI
and 2400DPI

Sensor Line Features

Sensor Line Features
2400DPI staggered

2400DPI staggered

Number of effective pixels:

64080 pixels(10680pixels×6)

Pixel size: 4m×4m(4m pitch)

Distance between main line : 48 m(12 lines)
Distance between main line and Sub line: 8 m(2 lines)

Common Features

Single-sided readout

Ultra low lag
Single 12V power supply
Maximum data rate: 10MHz/Color
Input clock pulse: CMOS 5V drive
Number of output: 3(R,G,B)

Package: 24pin Plastic-DIP(400mil)

Absolute Maximum Ratings

Supply voltage V

Operating temperature - 10to 55

Pin Configuration(Top View)

ILX585K

24 pin DIP (Plastic)

10680

R (sub)

R (main)

G (sub)

G (main)

B (sub)

B (main)

OUT-R

OUT-B

ROG-

CLP

GND

OUT-G

ROG-

10680

GND

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples
illustrating the operation of the devices.
Sony cannot assume responsibility for any problems arising out of the use of these circuits.

02.07.30

ILX585K

02.07.30

Block Diagram

Main line (Blue)

D74

S5340

D75

D106

D40

Sub line (Blue)

D74'

S1'

S2'

S3'

S5340'

D75'

D106'

D40'

Main line (Green)

D74

S5340

D75

D106

D40

Sub line (Green)

D74'

S1'

S2'

S3'

S5340'

D75'

D106'

D40'

Main line (Red)

D74

S5340

D75

D106

D40

Sub line (Red)

D74'

S1'

S2'

S3'

S5340'

D75'

D106'

D40'

Readout gate

CCD register

Driver

OUT-B

OUT-G

OUT-R

GND

L1 SW

ROG

-R

ROG

-G

ROG

-B

CLP

(1200/2400DPI Sensor)

Sub line
Overflow Drain

ILX585K

02.07.30

Pin Description

Pin No.

Symbol

Description

OUT-R

OUT-G

ROG

-R

ROG

-G

ROG

-B

Clock pulse input

12V power supply

Signal output (red)

Signal output (green)

Clock pulse input

12V power supply

Clock pulse input

Pin No.

Symbol

Description

GND

OUT-B

GND

CLP

GND

Clock pulse input

GND

Switch(1200/2400dpi)

Clock pulse input

Signal output (blue)

GND

Clock pulse input

Unit

Max.

Typ.

Min.

11.4

Item

Recommended Supply Voltage

Unit

Max.

Typ.

3000

Min.

Symbol

, C

ROG

, C

Item

Input capacity of

ROG

Input capacity of

Clock Characteristics

12.6

ILX585K

02.07.30

Electrooptical Characteristics (Note 1, 2)
(Ta=25c,VDD=12V, ffRS=1MHz, Input clock=5Vp-p, Light source=3200K, IR cut filter CM500S (t = 1.0mm)

Sensitivity

Sensitivity nonuniformity

Saturation output voltage

Saturation
exposure

Saturation electrons

Dark voltage average

Dark signal nonuniformity

Supply current

Total transfer efficiency

Output impedance

Red

Green

Blue

Red

Green

Blue

PRNU

SAT

Nelec

DRK

DSNU

VDD

TTE

Unit

Remarks

Max.

Typ.

Min.

Symbol

Item

V/(lxs)

lxs

Ke-

Note 2

Note 3

Note 4

Note 5

at 2.0V

Note 6

Note 7

2.0

2.6

2.0

2.5

1.25

0.96

1.25

0.1

0.5

360

1.4

1.8

1.4

2.0

2.6

3.4

2.6

1.6

3.2

ILX585K

02.07.30

4. Use below the minimum value of the saturation output voltage.

5. Saturation exposure is defined as follows.

SE =

Where R indicates R

, R

and SE indicates SE

, SE

6. Optical signal accumulated time

int

stands at 4ms.

7. Supply current means the total current of this device.

8. Vos is defined as indicated bellow.

OUT

indicates V

OUT-R

, V

OUT-G

, and V

OUT-B

9. Random noise is defined on the output waveform with the external clamp and is defined as the standard

deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination
(i.e.dark conditions) calculated by the following procedure.

a) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points.
b) Each of the output level at video output periods is averaged over 200ns period to get V (n) and V (n + 1).
c) V (n + 1) is subtracted from V (n) to get ¢V.

¢V = Vn ·|V (n + 1)

d) The standard deviation of ¢V is calculated after procedure b) and c) are repeated 30 times (30 readings).

SAT

OUT

GND

CCD output

Output waveform
(effective pixels
under dark condition)

200ns

pixel (n)

200ns

pixel (n +1)

CCD output

V =

Vi |

Vi |·|

i = 1

e) Procedure b), c) and d) are repeated 10 times to get sigma value.

10 sigma values are averaged.

value calculated using the above procedure is observed

2 times larger than that measured relative to

the ground level. So we specify random noise as follows.

i = 1

ILX585K

02.07.30

Clock Timing Chart 1 2400 DPI Staggered(pixel clamp mode)

ROG

OUT

D1'

D39

D39'

D40

D40'

D74

D74'

S1'

S10679'

S10680

S10680'

D75

D78'

D79

D79'

D75'

D80

D80'

D101'

D102

D102'

D106'

Optical black (34 pixels

Dummy signal (74 pixels

Effective pixels signal

(10680 pixels

Dummy signal (32 pixels

1-line output period (10786pixels

CLP

Note)The transfer pulses (

2) must have more than 10786 cycles.

The transfer pulses (

4) must have more than 21572 cycles.

OUT

indicates V

OUT-R

, V

OUT-G

, V

OUT-B

SW mode

SWL

ILX585K

02.07.30

Clock Timing Chart 2 2400 DPI Staggered(line clamp mode)

ROG

OUT

D20

D20'

D40

D74

D74'

S1'

S10679'

S10680

S10680'

D75

D78'

D79

D79'

D75'

D80

D80'

D101'

D102

D102'

D106'

Optical black (34 pixels

Dummy signal (74 pixels

Effective pixels signal

(10680 pixels

Dummy signal (32 pixels

1-line output period (10786pixels

CLP

Note)The transfer pulses (

2) must have more than 10786 cycles.

The transfer pulses (

4) must have more than 21572 cycles.

OUT

indicates V

OUT-R

, V

OUT-G

, V

OUT-B

SW mode

SWL

ILX585K

02.07.30

Item

ROG,

1 pulse timing

ROG pulse high level period

ROG,

1 pulse timing

ROG pulse rise time

ROG pulse fall time

1 pulse rise time/

2 pulse fall time

1 pulse fall time/

2 pulse rise time

L1 pulse rise time/

2 pulse fall time

L1 pulse fall time/

2 pulse rise time

3 pulse rise time/

4 pulse fall time

3 pulse fall time/

4 pulse rise time

RS pulse rise time

RS pulse fall time

RS pulse high level period

L1,

3 pulse timing

RS,

CLP pulse timing

CLP,

L1,

3 pulse timing

CLP pulse high level period

Signal output delay time

Unit

These timing is the recommended condition under f

= 1MHz.

Clock Pulse Recommended Timing

Symbol

t10

t11

t12

t13

t14

t15

t16

t17

t18

t19

t20

Min.

Typ.

100

1
1

250

1
1

250

1
1

100

Max.

ILX585K

02.07.30

Application Circuit

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

GND

OUT -B

OUT -R

OUT -G

100

IC2

12V

47µF/
16V

0.1µF

100

OUT-B

Tr1

100

Tr1

OUT -G

2 1

IC2

IC1: 74AC04

3pcs

IC2: 74HC04
Tr1: 2SA1175

ROG

-B

ROG

-R

ROG

-G

ROG

-R

ROG

-G

100

IC1

100

ROG -

100

Tr1

OUT -R

Data rate f

= 1MHz

IC2

IC1

GND

CLP

100

CLP

IC1

IC2

L 1

GND

<IC1>

ILX585K

02.07.30

Notes of Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the

following protective measures.

a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive

shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensor.

e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.

2) Notes on Handling CCD Packages

The following points should be observed when handling and installing packages.

a) Remain within the following limits when applying static load to the package:

(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter

of the glass portion.)

(2) Shearing strength: 29N/surface

(3) Tensile strength: 29N/surface

(4) Torsional strength: 0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion.

Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the package to crack or dust to be generated.

(1) Applying repetitive bending stress to the external leads.

(2) Applying heat to the external leads for an extended period of time with soldering iron.

(3) Rapid cooling or heating.

(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.

(5) Applying the metal a crash or a rub against the plastic portion.

Note that the preceding notes should also be observed when removing a component from a board

after it has already been soldered.

d) The notch of the plastic portion is used for directional index, and that can not be used for reference

of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may

overlap with the notch of the plastic portion.

3) Soldering

a) Make sure the package temperature does not exceed 80°C.

b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering

iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool

sufficiently.

c) To dismount an imaging device, do not use a solder suction equipment. When using an electric

desoldering tool, ground the controller. For the control system, use a zero cross type.

Plastic portion

Cover glass

39N

Ceramic portion

Adhesive

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

ILX585K

02.07.30

4) Dust and dirt protection

a) Operate in clean environments.

b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.

Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static

electricity ionized air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to

scratch the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.

ILX585K

02.07.30

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

DRAWING NUMBER

Plastic, Ceramic

GOLD PLATING

5.43g

42 ALLOY

3.58

10.16

0.25

0.46

1.778

5.334

5.0 ± 0.3

7.830 ± 0.3

4.0 ±

0.5

No.1 Pixel (Green) of 2400 DPI

55.7 ± 0.3

42.72 (4µm X 10680Pixels)

10.0 ±

0.3

4.28 ±

0.5

0.3

24 pin DIP (400mil)

LS-B41(E)

( 8.59 )

1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.

2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

0° to 9°

Package Outline

Unit: mm

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