Peripheral ICs
· EVR: MB88347 (Fujitsu Limited.)
· EEPROM: AK6420 (Asahi Kasei Microsystems

Co., Ltd.)

Description

The micro unit CCD is a CCD color camera unit

with built-in CCD image sensor, drive system IC,
sample-and-hold IC, signal processor IC and lens
system.

Features
· Ultra-compact size:

MCX18N00A

18.3mm

8.4mm

MCX18N00B

18.3mm

9.6mm

· Y/C analog output
· Employs a Type 1/5,

180,000-pixel color CCD image sensor

· Equipped with a fixed focus lens:

MCX18N00A

F2.8/f = 2.9mm

MCX18N00B

F2.8/f = 4.0mm

Applications
· TV conference cameras
· Image input cameras

Absolute Maximum Ratings
· Supply voltage

+18

1, DV

2, AV

+7.0

1, AV

2, AV

+7.0

4, AV

+7.0

+14.0

17.5

· Input voltage

0.5 to DV

+ 0.5

· Operating temperature

Topr

0 to +40

°C

· Storage temperature

Tstg

30 to +80

°C

Recommended Operating Conditions
· Supply voltage

14.25 to 15.75

1, DV

2, AV

3.0 to 3.6

1, AV

2, AV

4.75 to 5.25

4, AV

4.5 to 5.5

4.5 to 5.25

8.5 to 7.5

· Input voltage

DCIN

1.0 to 4.5

· Operating temperature

Topr

0 to +40

°C

Block Diagram

MCX18N00A/MCX18N00B

E97432B9X

Micro Unit CCD

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

64 pin QFN (Ceramic)

Lens

Y/C

CCD
Image
Sensor

S/H

Digital
Signal
Process

Timing
Generator

MCX18N00A/MCX18N00B

Pin Configuration

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

I
N

I
R

CASI

CSROM

RESETTG

DGND

OSCI

OSCO

XCS

CASCK

CASO

CSEVR

DGND

VGC

IOC

IOY

VGY

IREFY

VREFY

VBY

DGND

SHOUT

SHIN

AGND

SIFSEL

MCX18N00A/MCX18N00B

Pin Description

Pin
No.

Symbol

I/O

Description

DGND

SHOUT

SHIN

AGND

SIFSEL

AGND

TEST

SUBIN

AGCCONT

OFFSET

DCIN

DCOUT

SUBOUT

DGND

CSEVR

CASO

CASCK

XCS

OSCO

OSCI

DGND

Digital GND

Sample-and-hold output. Connect directly to Pin 5.

Sample-and-hold input.

Analog GND

Serial communication mode selection: Microcomputer (low)/RS232C (high).

+3.3V power supply for signal processing system.

Analog GND

+15V power supply for CCD image sensor drive.

Analog GND

+5V power supply for A/D converter.

+5V power supply for sample-and-hold.

Test pin. Connect to V

CCD image sensor SUB voltage input.

AGC control.

OFFSET control.

+5V power supply for sample-and-hold pulse.

+5V power supply for RG pulse.

+5V power supply for H pulse.

DC amplifier input.

DC amplifier output.

SUB pulse output.

8V power supply for CCD image sensor drive.

Digital GND

EVR chip select.

Serial communication data output for peripheral ICs (EVR, EEPROM).

Serial communication clock output for peripheral ICs (EVR, EEPROM).

Switched by the SIFSEL setting.
Chip select during microcomputer mode.
Baud rate setting (4800bps (low)/9600bps (high)) during RS232C mode.

+3.3V power supply for timing generator.

27MHz clock input.

27MHz oscillator output.

27MHz oscillator input.

Digital GND

MCX18N00A/MCX18N00B

RESETTG

CSROM

CASI

SCK

XCLR

4FSCI

4FSCO

AGND

PCOMP

DGND

CCDOUT

VBC

VREFC

IREFC

VGC

IOC

IOY

VGY

IREFY

VREFY

VBY

Reset pin (active low) with pull-up resistor for timing generator.

EEPROM chip select.

Serial communication data input for peripheral ICs (EVR, EEPROM).

Serial communication data output.

Serial communication data input.

Serial communication clock input.

Initialization pin (active low). EEPROM re-read.

+3.3V power supply for 4fsc oscillator.

4fsc oscillator input.

4fsc oscillator output.

Analog GND

Phase comparison output for PLL lock.

Vertical sync output.

Horizontal sync output.

Digital GND

CCD image sensor buffer output.

D/A converter peripheral circuit connection pins for chroma signal.

+5V power supply for D/A converter.

Chroma signal output.

Luminance signal output.

D/A converter peripheral circuit connection pins for luminance signal.

Pin
No.

Symbol

I/O

Description

MCX18N00A/MCX18N00B

Item

Electrical Characteristics

DC Characteristics

Symbol

Unit

Min.

Typ.

Max.

Pins

Conditions

Input voltage 1

Input voltage 2

Input voltage 3

Input voltage 4

Input voltage 5

T+

DCIN

SUB

DCIN

SUBIN

4FSCI

A/D input amplitude = 2Vp-p

D/A output amplitude = 2Vp-p

1 = 3.3V

2 = 3.3V

1 = 5.0V

2 = 5.0V

3 = 5.0V

4 = 5.0V

5 = 5.0V

6 = 3.3V

= 5.0V

= 15.0V

= 8.0V

3.0

4.75

4.5

3.0

4.5

14.25

8.5

0.8

0.7

1.0

Display
value 0.1

0.7

3.3

5.00

5.0

3.3

5.0

15.00

8.0

7.2

3.1

1.0

4.9

1.0

6.9

1.4

Display
value

3.6

5.25

5.5

3.6

5.25

15.75

7.5

0.2

0.3

4.5

Display
value + 0.1

0.3

Operating
current

Supply voltage

MCX18N00A/MCX18N00B

SUBOUT

4FSCO

OSC

4FSC

OSC

SIFSEL

TEST

4FSCI

Item

Symbol

Unit

Min.

Typ.

Max.

Pins

Conditions

Output voltage 1

Output voltage 2

Output voltage 3

Output voltage 4

Output voltage 5

Hysteresis 1

Hysteresis 2

Threshold value 1

Threshold value 2

Threshold value 3

Feedback resistance 1

Feedback resistance 2

Input amplitude

Pull-up resistance

DC amplifier gain

Input leak current 1

Input leak current 2

RFE1

RFE2

RPU

1 = 1.2mA

1 = 2.4mA

2 = 2.4mA

2 = 4.8mA

3 = 8mA

4 = 4mA

4 = 5.4mA

5 = 3mA

OSCI = DV

1 or GND

4FSCI = AV

4 or GND

50MHz sine wave

VIN = DV

VIN = GND or DV

Vp-p

µA

2 0.8

1/2

0.25

4/2

500k

250k

0.5

50k

0.5

0.6

1.35

1/2

4/2

100k

4.4

0.4

1/2

+ 0.25

4/2

2.5M

150k

RESETTG

CSEVR, CSROM, SO, PCOMP, VD, HD

CASO, CASCK

OSCO

XCS, SI, SCK, XCLR, CASI

OSCI, CK

SIFSEL

MCX18N00A/MCX18N00B

Note) VSUB display value

The VSUB display value is displayed by a code on the rear surface of the MUC.

Symbol

Actual voltage (V) 5.00

5.25

5.50

5.75

6.00

6.25

6.50

6.75

7.00

7.25

7.50

7.75

8.00

8.25

Symbol

Actual voltage (V) 8.50

8.75

9.00

9.25

9.50

9.75

10.00

10.25

10.50

10.75

11.00

11.25

11.50

11.75

Symbol

Actual voltage (V) 12.00

12.25

12.50

12.75

Minimum low interval

SCK input pulse width (high interval)

SCK input pulse width (low interval)

XCS input setup time, activated by the falling edge
of SCK

XCS input hold time, activated by the rising edge of
SCK

SI input setup time, activated by the rising edge of
SCK

SI input hold time, activated by the rising edge of
SCK

SO output transition time (Hi-Z

Data active),

activated by the falling edge of XCS

SO transition time (Data active

Hi-Z),

activated by the rising edge of XCS

SO output delay time, activated by the falling edge
of SCK

CLR

RST

SCK

XCS

500

430

640

140

200

240

Serial
communication

XCLR

RESETTG

Classification

Item

Symbol

Min.

Typ.

Max. Unit

XCS

SCK

DATA

SCK

XCS

AC Characteristics

MCX18N00A/MCX18N00B

Image Sensor Characteristics Measurement Method

Measurement conditions

(1) In the following measurements, each supply voltage is at the typical values.

(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical

black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal

output of the measurement system.

Definition of Standard Imaging Conditions

1) Standard imaging condition

: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen

source) as a subject. (Pattern for evaluation is not applicable.) Use a ND2 filter and image at F5.6 or

equivalent. The luminous intensity to the sensor receiving surface at this point is defined as the standard

sensitivity testing luminous intensity.

2) Standard imaging condition

: Image a light source with a uniformity of brightness within 2% at all angles

(color temperature of 3200K).

1. Sensitivity

Set to standard imaging condition

. After selecting the electronic shutter mode with a shutter speed of

1/250s, measure the Y signal (Ys) at the center of the screen and substitute the values into the following

formula.

S = Ys

[mV]

2. Saturation signal

Set to standard imaging condition

. After adjusting the luminous intensity to 10 times the intensity applying

with an average value of Y signal output, 200mV, measure the minimum value of the Y signal.

3. Smear

Set to standard imaging condition

. With using ND2 filter and the lens diaphragm at F5.6 or equivalent,

adjust the luminous intensity to 500 times the intensity applying with an average value of Y signal output,

200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at

the respective H blankings, measure the maximum value YSm [mV] of the Y signal output, and substitute

the values into the following formula.

4. Dark signal

Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature of 60°C

and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

5. Dark signal shading

After measuring 4, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal

output, and substitute the values into the following formula.

Ydt = Ydmax Ydmin [mV]

Sm =

100 [%] (1/10V method conversion value)

200

YSm

500

250

MCX18N00A/MCX18N00B

Communication Code Table

0 to 7

0 to 3

4 to 7

0 to 3

4 to 7

0 to 7

0 to 3

6 to 7

0 to 7

YDLY

RMATY

RMATC

BMATY

BMATC

YGAIN

RBQUAD

CONGAIN

CONHUE

RYGAIN

BYGAIN

RYHUE

BYHUE

SHOFST

Setup level

Luminance signal delay adjustment

Matrix coefficient

Luminance signal gain

Linear matrix quadrant control

Linear matrix gain

Linear matrix hue

Linear matrix coefficient

Sample-and-hold output offset

Adjustment value

4F, 51, 53, 55

50, 52, 54, 56

57, 59, 5B, 5D

58, 5A, 5C, 5E

Cate-
gory

Byte

Bit

Symbol

Description

EEPROM
Address (H)

Recommended
value (H)

Initial
value (H)

MCX18N00A/MCX18N00B

0 to 7

3 to 7

0 to 7

0 to 2

4 to 6

4 to 7

0 to 7

VREFY

VREFC

VSUB

AGCCONT

SHTSPDM

SHTHL

SHTON

SHTSPDL

WBR

WBG

WBB

AWB

AEADJUST

MCR

SPRS

VREFY adjustment

VREFC adjustment

VSUB adjustment

Gain control

Shutter speed (bit 8)

Electronic shutter high speed/
low speed switching

Electronic shutter OFF/ON

Shutter speed (bit 0 to bit 7)

White balance control

AWB control

AE adjustment mode switching

AE control

Microcontroller control

Suppress control

External switch control

Adjustment value

Cate-
gory

Byte

Bit

Symbol

Description

EEPROM
Address (H)

Recommended
value (H)

Initial
value (H)

MCX18N00A/MCX18N00B

2 to 4

0 to 7

0 to 6

0 to 1

4 to 7

FLON

BLCOF

AWB1

AWB2

AWB3

E2WR

E2WEN

E2RSW

E2RAL1

E2RAL2

E2RAL3

E2RAL4

E2CODE

E2ADRS

E2DATA

SPCODE

SPCDAT

ADJSTH

ADJSTVL

ADJSTVM

PGON1

PGON2

PGON3

Flickerless ON/OFF

Backlight compensation ON/OFF

AWB mode selection

EEPROM write control

EEPROM write enable transmit

EEPROM read control

EEPROM read range specification

EEPROM control code

EEPROM address

EEPROM data

SPEC code

SPEC data

Horizontal position specification

Vertical position specification

Pattern generator ON/OFF

Cate-
gory

Byte

Bit

Symbol

Description

EEPROM
Address (H)

Recommended
value (H)

Initial
value (H)

MCX18N00A/MCX18N00B

Code (H)

Address
(H)

Symbol

[AE] SPD

[AE] MAX

[AE] MIN

[AE] LIM

[AE] BLC

[AE] HIST

[AWB] SPD

[AWB] FRM

[AWB] RSFT

[AWB] BSFT

[AWB] USRR

[AWB] USRB

[AWB] PRER

[AWB] PREB

Adjustment value

Description

AE response speed

AE maximum gain

AE minimum gain

AE shutter speed upper limit

Backlight compensation control

Histogram backlight compensation control

AWB response speed

AWB detection window setting

SPEC Code Table

Recommended
value (H)

Initial
value (H)

MCX18N00A/MCX18N00B

Notes on Handling

1) Static charge prevention

Micro unit CCDs are easily damaged by static discharge. Before handling be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling micro unit CCDs.

e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Please use IC socket for mounting of micro unit CCDs.

IC socket : HS6401-K YAMATO SCIENTIFIC CO.,LTD.

3) Dust and dirt protection

a) Operate in clean environments.

b) Do not either touch lens by hand or have any object come in contact with lens surfaces.

Should dirt stick to a lens surface, blow it off with an air blower.

(For dirt stuck through static electricity ionized air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the lens.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

4) Do not expose to strong light (sun rays) for long periods.

5) Exposure to high temperature or humidity will affect the characteristics.

Accordingly avoid storage or usage in such conditions.

6) Micro unit CCDs are precise optical equipment that should not be subject to mechanical shocks.

MCX18N00A/MCX18N00B

.
1

/
1

.
1

/
6

.
3

.
1

.
5

.
3

.
5

.
1

.
3

-
Q

.
3

.
2

-
Q

(
3

.
0

)

.
1

.
3

0µ

.
1

.
3

.
5

.
1

/
1

.
1

.
2

/
2

.
1

0µ

.
8

µH

.
1

-
T

(
2

/
2

)

.
1

I
C

.
3

BIN

I
O

I
R

I
C

/
B

I
N

I
F

/
2

(
3

.
5

)

µH

0µ

.
2

/
2

-
T

(
1

/
2

)

.
1

I
C

-
8

/
H

-
2

Application Circuit

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility fo

any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same

MCX18N00A/MCX18N00B

I
A

I
G

.
0

.
2

t
.

p

i
n

I
n

0.8

7.6

3.5

7.3

0 ±

8.3

7 ±

8 ±

.
3

i
n

.
5

3.2

5.5

-
1

.
5

2-1

.
2

.
3

.
6

.
2

-
R

(
0

.
2

)

.
0

.
2

-

0

.
5

i
n

(
7

i
l
)

.
2

r
a

i
c

Package Outline

Unit: mm

MCX18N00A

MCX18N00A/MCX18N00B

I
A

I
G

.
0

.
2

t
.

p

i
n

I
n

0.8

7.6

3.5

8.5

0 ±

9.5

7 ±

8 ±

.
3

i
n

.
5

3.2

5.5

-
1

.
5

2-1

.
2

.
3

.
6

.
2

-
R

(
0

.
2

)

.
0

.
2

-

0

.
5

i
n

(
7

i
l
)

.
2

r
a

i
c

Package Outline

Unit: mm

MCX18N00B

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MCX18N00B

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MCX18N00B