2001 Silicon Storage Technology, Inc.
S71160-05-000
5/01
505
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
SSF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
Preliminary Specifications
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
FEATURES:
Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
Single Voltage Read and Write Operations
5.0V-only for SST29SF512/010/020/040
2.7-3.6V for SST29VF512/010/020/040
Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
Low Power Consumption:
Active Current: 10 mA (typical)
Standby Current:
30 A (typical) for SST29SF512/010/020/040
1 A (typical) for SST29VF512/010/020/040
Sector-Erase Capability
Uniform 128 Byte sectors
Fast Read Access Time:
55 ns
70 ns
Latched Address and Data
Fast Erase and Byte-Program:
Sector-Erase Time: 18 ms (typical)
Chip-Erase Time: 70 ms (typical)
Byte-Program Time: 14 s (typical)
Chip Rewrite Time:
1 second
(typical) for SST29SF/VF512
2 seconds (typical) for SST29SF/VF010
4 seconds (typical) for SST29SF/VF020
8 seconds (typical) for SST29SF/VF040
Automatic Write Timing
Internal V
PP
Generation
End-of-Write Detection
Toggle Bit
Data# Polling
TTL I/O Compatibility for SST29SFxxx
CMOS I/O Compatibility for SST29VFxxx
JEDEC Standard
Flash EEPROM Pinouts and command sets
Packages Available
32-pin PLCC
32-pin TSOP (8mm x 14mm)
32-pin PDIP
PRODUCT DESCRIPTION
The SST29SF512/010/020/040 and SST29VF512/010/
020/040 are 64K x8 / 128K x8 / 256K x8 / 512K x8 CMOS
Small-Sector Flash (SSF) manufactured with SST's propri-
etary, high performance CMOS SuperFlash technology.
The split-gate cell design and thick oxide tunneling injector
attain better reliability and manufacturability compared with
alternate approaches. The SST29SFxxx devices write
(Program or Erase) with a 4.5-5.5V power supply. The
SST29VFxxx devices write (Program or Erase) with a 2.7-
3.6V power supply. These devices conform to JEDEC stan-
dard pinouts for x8 memories.
Featuring high performance Byte-Program, the
SST29SFxxx and SST29VFxxx devices provide a maxi-
mum Byte-Program time of 20 sec. To protect against
inadvertent write, they have on-chip hardware and Soft-
ware Data Protection schemes. Designed, manufactured,
and tested for a wide spectrum of applications, these
devices are offered with a guaranteed endurance of at least
10,000 cycles. Data retention is rated at greater than 100
years.
The SST29SFxxx and SST29VFxxx devices are suited for
applications that require convenient and economical updat-
ing of program, configuration, or data memory. For all sys-
tem applications, they significantly improve performance
and reliability, while lowering power consumption. They
inherently use less energy during Erase and Program than
alternative flash technologies. The total energy consumed
is a function of the applied voltage, current, and time of
application. Since for any given voltage range, the Super-
Flash technology uses less current to program and has a
shorter erase time, the total energy consumed during any
Erase or Program operation is less than alternative flash
technologies. They also improve flexibility while lowering
the cost for program, data, and configuration storage appli-
cations.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet high density, surface mount requirements, the
SST29SFxxx and SST29VFxxx devices are offered in 32-
pin PLCC and 32-pin TSOP packages. A 600 mil, 32-pin
PDIP is also offered for SST29SFxxx devices. See Figures
1, 2, and 3 for pinouts.
SST29SF/VF512 / 010 / 020 / 0405.0 & 2.7V 512Kb / 1Mb / 2Mb / 4Mb (x8) Byte-Program, Small Erase Sector flash memories
2
Preliminary Specifications
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
2001 Silicon Storage Technology, Inc.
S71160-05-000
5/01
505
Device Operation
Commands are used to initiate the memory operation func-
tions of the device. Commands are written to the device
using standard microprocessor write sequences. A com-
mand is written by asserting WE# low while keeping CE#
low. The address bus is latched on the falling edge of WE#
or CE#, whichever occurs last. The data bus is latched on
the rising edge of WE# or CE#, whichever occurs first.
Read
The Read operation of the SST29SFxxx and SST29VFxxx
devices are controlled by CE# and OE#, both have to be
low for the system to obtain data from the outputs. CE# is
used for device selection. When CE# is high, the chip is
deselected and only standby power is consumed. OE# is
the output control and is used to gate data from the output
pins. The data bus is in high impedance state when either
CE# or OE# is high. Refer to the Read cycle timing dia-
gram for further details (Figure 4).
Byte-Program Operation
The SST29SFxxx and SST29VFxxx devices are pro-
grammed on a byte-by-byte basis. The Program operation
consists of three steps. The first step is the three-byte-load
sequence for Software Data Protection. The second step is
to load byte address and byte data. During the Byte-Pro-
gram operation, the addresses are latched on the falling
edge of either CE# or WE#, whichever occurs last. The
data is latched on the rising edge of either CE# or WE#,
whichever occurs first. The third step is the internal Pro-
gram operation which is initiated after the rising edge of the
fourth WE# or CE#, whichever occurs first. The Program
operation, once initiated, will be completed, within 20 s.
See Figures 5 and 6 for WE# and CE# controlled Program
operation timing diagrams and Figure 16 for flowcharts.
During the Program operation, the only valid reads are
Data# Polling and Toggle Bit. During the internal Program
operation, the host is free to perform additional tasks. Any
commands written during the internal Program operation
will be ignored.
Sector-Erase Operation
The Sector-Erase operation allows the system to erase the
device on a sector-by-sector basis. The SST29SFxxx and
SST29VFxxx offer Sector-Erase mode. The sector archi-
tecture is based on uniform sector size of 128 Bytes. The
Sector-Erase operation is initiated by executing a six-byte-
command sequence with Sector-Erase command (20H)
and sector address (SA) in the last bus cycle. The sector
address is latched on the falling edge of the sixth WE#
pulse, while the command (20H) is latched on the rising
edge of the sixth WE# pulse. The internal Erase operation
begins after the sixth WE# pulse. The End-of-Erase opera-
tion can be determined using either Data# Polling or Toggle
Bit methods. See Figure 9 for timing waveforms. Any com-
mands issued during the Sector-Erase operation are
ignored.
Chip-Erase Operation
The SST29SFxxx and SST29VFxxx devices provide a
Chip-Erase operation, which allows the user to erase the
entire memory array to the "1s" state. This is useful when
the entire device must be quickly erased.
The Chip-Erase operation is initiated by executing a six-
byte Software Data Protection command sequence with
Chip-Erase command (10H) with address 555H in the last
byte sequence. The internal Erase operation begins with
the rising edge of the sixth WE# or CE#, whichever occurs
first. During the internal Erase operation, the only valid read
is Toggle Bit or Data# Polling. See Table 4 for the command
sequence, Figure 10 for timing diagram, and Figure 19 for
the flowchart. Any commands written during the Chip-
Erase operation will be ignored.
Write Operation Status Detection
The SST29SFxxx and SST29VFxxx devices provide two
software means to detect the completion of a Write (Pro-
gram or Erase) cycle, in order to optimize the system
write cycle time. The software detection includes two sta-
tus bits: Data# Polling (DQ
7
) and Toggle Bit (DQ
6
). The
End-of-Write detection mode is enabled after the rising
edge of WE# which initiates the internal Program or
Erase operation.
The actual completion of the nonvolatile write is asynchro-
nous with the system; therefore, either a Data# Polling or
Toggle Bit read may be simultaneous with the completion
of the Write cycle. If this occurs, the system may possibly
get an erroneous result, i.e., valid data may appear to con-
flict with either DQ
7
or DQ
6
. In order to prevent spurious
rejection, if an erroneous result occurs, the software routine
should include a loop to read the accessed location an
additional two (2) times. If both reads are valid, then the
device has completed the Write cycle, otherwise the rejec-
tion is valid.
Preliminary Specifications
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
3
2001 Silicon Storage Technology, Inc.
S71160-05-000
5/01
505
Data# Polling (DQ
7
)
When the SST29SFxxx and SST29VFxxx devices are in
the internal Program operation, any attempt to read DQ
7
will produce the complement of the true data. Once the
Program operation is completed, DQ
7
will produce true
data. The device is then ready for the next operation. Dur-
ing internal Erase operation, any attempt to read DQ
7
will
produce a `0'. Once the internal Erase operation is com-
pleted, DQ
7
will produce a `1'. The Data# Polling is valid
after the rising edge of fourth WE# (or CE#) pulse for Pro-
gram operation. For Sector- or Chip-Erase, the Data# Poll-
ing is valid after the rising edge of sixth WE# (or CE#)
pulse. See Figure 7 for Data# Polling timing diagram and
Figure 17 for a flowchart.
Toggle Bit (DQ
6
)
During the internal Program or Erase operation, any con-
secutive attempts to read DQ
6
will produce alternating 0s
and 1s, i.e., toggling between 0 and 1. When the internal
Program or Erase operation is completed, the toggling will
stop. The device is then ready for the next operation. The
Toggle Bit is valid after the rising edge of fourth WE# (or
CE#) pulse for Program operation. For Sector or Chip-
Erase, the Toggle Bit is valid after the rising edge of sixth
WE# (or CE#) pulse. See Figure 8 for Toggle Bit timing dia-
gram and Figure 17 for a flowchart.
Data Protection
The SST29SFxxx and SST29VFxxx devices provide both
hardware and software features to protect nonvolatile data
from inadvertent writes.
Hardware Data Protection
Noise/Glitch Protection: A WE# or CE# pulse of less than 5
ns will not initiate a write cycle.
V
DD
Power Up/Down Detection: The Write operation is
inhibited when V
DD
is less than 2.5V for SST29SFxxx. The
Write operation is inhibited when V
DD
is less than 1.5V. for
SST29VFxxx.
Write Inhibit Mode: Forcing OE# low, CE# high, or WE#
high will inhibit the Write operation. This prevents inadvert-
ent writes during power-up or power-down.
Software Data Protection (SDP)
The SST29SFxxx and SST29VFxxx provide the JEDEC
approved Software Data Protection scheme for all data
alteration operation, i.e., Program and Erase. Any Program
operation requires the inclusion of a series of three byte
sequence. The three byte-load sequence is used to initiate
the Program operation, providing optimal protection from
inadvertent write operations, e.g., during the system power-
up or power-down. Any Erase operation requires the inclu-
sion of six byte load sequence. These devices are shipped
with the Software Data Protection permanently enabled.
See Table 4 for the specific software command codes. Dur-
ing SDP command sequence, invalid commands will abort
the device to read mode, within T
RC
.
Product Identification
The Product Identification mode identifies the devices as
SST29SF512, SST29SF010, SST29SF020, SST29SF040
and SST29VF512, SST29VF010, SST29VF020,
SST29VF040 and manufacturer as SST. This mode may
be accessed by software operations. Users may use the
Software Product Identification operation to identify the part
(i.e., using the device ID) when using multiple manufactur-
ers in the same socket. For details, see Table 4 for software
operation, Figure 11 for the Software ID Entry and Read
timing diagram and Figure 18 for the Software ID Entry
command sequence flowchart.
Product Identification Mode Exit/Reset
In order to return to the standard Read mode, the Software
Product Identification mode must be exited. Exit is accom-
plished by issuing the Software ID Exit command
sequence, which returns the device to the Read operation.
Please note that the Software ID Exit command is ignored
during an internal Program or Erase operation. See Table 4
for software command codes, Figure 12 for timing wave-
form and Figure 18 for a flowchart.
TABLE
1: P
RODUCT
I
DENTIFICATION
Address
Data
Manufacturer's ID
0000H
BFH
Device ID
SST29SF512
0001H
20H
SST29VF512
0001H
21H
SST29SF010
0001H
22H
SST29VF010
0001H
23H
SST29SF020
0001H
24H
SST29VF020
0001H
25H
SST29SF040
0001H
13H
SST29VF040
0001H
14H
T1.1 505
4
Preliminary Specifications
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
2001 Silicon Storage Technology, Inc.
S71160-05-000
5/01
505
FIGURE 1: P
IN
A
SSIGNMENTS
FOR
32-
PIN
PLCC
Y-Decoder
I/O Buffers and Data Latches
505 ILL B1.1
Address Buffers & Latches
X-Decoder
DQ7 - DQ0
Memory
Address
OE#
CE#
WE#
SuperFlash
Memory
Control Logic
F
UNCTIONAL
B
LOCK
D
IAGRAM
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
4 3 2 1 32 31 30
A12
A15
NC
NC
V
DD
WE#
NC
A12
A15
A16
NC
V
DD
WE#
NC
A12
A15
A16
NC
V
DD
WE#
A17
A12
A15
A16
A18
V
DD
WE#
A17
32-pin PLCC
Top View
505 ILL F02a.3
14 15 16 17 18 19 20
DQ1
DQ2
V
SS
DQ3
DQ4
DQ5
DQ6
DQ1
DQ2
V
SS
DQ3
DQ4
DQ5
DQ6
DQ1
DQ2
V
SS
DQ3
DQ4
DQ5
DQ6
DQ1
DQ2
V
SS
DQ3
DQ4
DQ5
DQ6
SST29SF/VF512
SST29SF/VF010
SST29SF/VF020
SST29SF/VF040
SST29SF/VF010 SST29SF/VF020 SST29SF/VF040
SST29SF/VF512
SST29SF/VF512
SST29SF/VF010
SST29SF/VF020
SST29SF/VF040
SST29SF/VF010
SST29SF/VF020
SST29SF/VF040
SST29SF/VF512
Preliminary Specifications
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
5
2001 Silicon Storage Technology, Inc.
S71160-05-000
5/01
505
FIGURE 2: P
IN
A
SSIGNMENTS
FOR
32-
PIN
TSOP (8
MM
X
14
MM
)
FIGURE 3: P
IN
A
SSIGNMENTS
FOR
32-
PIN
PDIP
A11
A9
A8
A13
A14
NC
WE#
VDD
NC
NC
A15
A12
A7
A6
A5
A4
A11
A9
A8
A13
A14
NC
WE#
VDD
NC
A16
A15
A12
A7
A6
A5
A4
A11
A9
A8
A13
A14
A17
WE#
VDD
NC
A16
A15
A12
A7
A6
A5
A4
A11
A9
A8
A13
A14
A17
WE#
VDD
A18
A16
A15
A12
A7
A6
A5
A4
SST29SF/VF512
SST29SF/VF010
SST29SF/VF020
SST29SF/VF040
SST29SF/VF010 SST29SF/VF020 SST29SF/VF040
SST29SF/VF512
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
505 ILL F01.2
Standard Pinout
Top View
Die Up
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-pin
PDIP
Top View
505 ILL F02b.4
NC
NC
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
WE#
A17
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
WE#
A17
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
SST29SF512
SST29SF010
SST29SF020
SST29SF040
SST29SF010 SST29SF020 SST29SF040
SST29SF512
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