ChipFind - документация

Электронный компонент: SST30VR021-500-C-KH-R3054

Скачать:  PDF   ZIP
2003 Silicon Storage Technology, Inc.
S71135-04-000
8/03
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
ComboMemory is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
Data Sheet
FEATURES:
ROM + SRAM ROM/RAM Combo
SST30VR021: 256K x8 ROM + 128K x8 SRAM
SST30VR022: 256K x8 ROM + 256K x8 SRAM
SST30VR023: 256K x8 ROM + 32K x8 SRAM
ROM/RAM combo on a monolithic chip
Equivalent ComboMemory (Flash + SRAM):
SST31LF021E for code development and
pre-production
Wide Operating Voltage Range: 2.7-3.3V
Chip Access Time
SST30VR022
70 ns
SST30VR021/022/023 500 ns
Low Power Dissipation:
Standby: 3 W (Typical)
Operating: 10 mW (Typical)
Fully Static Operation
No clock or refresh required
Three-state Outputs
Packages Available
32-lead TSOP (8mm x14mm)
PRODUCT DESCRIPTION
The SST30VR021/022/023 are ROM/RAM combo chips
consisting of 2 Mbit Read-Only Memory (ROM) organized
as 256 KByte and Static Random Access Memory (SRAM)
organized as 128, 256, and 32 KByte.
The device is fabricated using SST's advanced CMOS low
power process technology.
The SST30VR021/022/023 has an output enable input for
precise control of the data outputs. It also has two (2) sepa-
rate chip enable inputs for selection of either SRAM or
ROM and for minimizing current drain during power-down
mode.
The SST30VR021/022/023 is particularly well suited for
use in low voltage (2.7-3.3V) supplies such as pagers,
organizers and other handheld applications.
RAMCS#
OE#
ROMCS#
WE#
DQ7-DQ0
AMS-A0
Note: AMS = Most Significant Address
ROMCS#
RAM
ROM
WE#
OE#
OE#
1135 B1.1
Address Buff
er
Data Buff
er
RAMCS#
Control
Circuit
F
UNCTIONAL
B
LOCK
D
IAGRAM
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM
ROM/RAM Combo
SST30VR021 / SST30VR022 / SST30VR023
SST30VR021 / 022 / 0232Mb Mask ROM (x8) + 1Mb / 2Mb / 256Kb SRAM (x8) Combo
2
Data Sheet
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
SST30VR021 / SST30VR022 / SST30VR023
2003 Silicon Storage Technology, Inc.
S71135-04-000
8/03
FIGURE 1: P
IN
A
SSIGNMENTS
FOR
32-
LEAD
TSOP
TABLE
1: P
IN
D
ESCRIPTION
Symbol
Pin Name
A
MS
1
-A
0
1. A
MS
= Most significant address
Address Inputs
ROM: A
MS
= A
17
RAM: A
MS
= A
16
for SST30VR021
A
17
for SST30VR022
A
14
for SST30VR023
WE#
Write Enable Input
OE#
Output Enable
RAMCS#
RAM Enable Input
ROMCS#
ROM Enable Input
DQ
7
-DQ
0
Data Input/Output
V
DD
Power Supply
V
SS
Ground
T1.3 1135
A11
A9
A8
A13
A14
A17
RAMCS#
VDD
WE#
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
OE#
A10
ROMCS#
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1135 32-tsop P1.0
Standard Pinout
Top View
Die Up
Data Sheet
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
SST30VR021 / SST30VR022 / SST30VR023
3
2003 Silicon Storage Technology, Inc.
S71135-04-000
8/03
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum
Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20C to +85C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C
Voltage on Any Pin Relative to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
DD
+0.5V
Voltage on V
DD
Supply Relative to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Soldering Temperature (10 Seconds Lead Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C
O
PERATING
R
ANGE
Range
Ambient Temp
V
DD
Commercial
0C to +70C
2.7-3.3V
Extended
-20C to +85C
2.7-3.3V
AC C
ONDITIONS
OF
T
EST
Input Pulse Level
. . . . . . . . . . . . . . . . . . . . . . . . 0-V
DD
Input & Output Timing Reference Levels
. . . . . . . V
DD
/2
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C
L
= 30 pF for 70 ns
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C
L
= 100 pF for 500 ns
4
Data Sheet
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
SST30VR021 / SST30VR022 / SST30VR023
2003 Silicon Storage Technology, Inc.
S71135-04-000
8/03
TABLE
2: R
ECOMMENDED
DC O
PERATING
C
ONDITIONS
Symbol
Parameter
Min
Max
Units
V
DD
Supply Voltage
2.7
3.3
V
V
SS
Ground
0
0
V
V
IH
Input High Voltage
2.4
V
DD
+ 0.5
V
V
IL
Input Low Voltage
-0.3
0.3
V
T2.0 1135
TABLE
3: DC O
PERATING
C
HARACTERISTICS
Symbol
Parameter
V
DD
= 2.7-3.3V
Test Conditions
Min
Max
Units
I
DD1
ROM Operating Supply Current
4.0+1.1(f)
1
1. f = Frequency of operation (MHz) = 1/cycle time
mA
ROMCS#=V
IL
, RAMCS#=V
IH
,
V
IN
=V
IH
or V
IL,
I
I/O
=Opens
I
DD2
RAM Operating Supply Current
4.0+1(f)
1
mA
ROMCS#=V
IH
, RAMCS#=V
IL
, I
I/O
=Opens
I
SB
Standby V
DD
Current
10
A
ROMCS#
V
DD
-0.2V, RAMCS#
V
DD
-0.2V
V
IN
V
DD
-0.2V or V
IN
0.2V
I
LI
Input Leakage Current
-1
1
A
V
IN
=V
SS
to V
DD
I
LO
Output Leakage Current
-1
1
A
ROMCS#=RAMCS#=V
IH
or OE#=V
IH
or
WE#=V
IL
, V
I/O
=V
SS
to V
DD
V
OL
Output Low Voltage
0.4
V
I
OL
=1.0 mA
V
OH
Output High Voltage
2.2
V
I
OH
=-0.5 mA
T3.5 1135
TABLE
4: C
APACITANCE
(Ta = 25C, f=1 Mhz)
Parameter
Description
Test Condition
Maximum
C
I/O
1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
I/O Pin Capacitance
V
I/O
= 0V
8 pF
C
IN
1
Input Capacitance
V
IN
= 0V
6 pF
T4.1 1135
Data Sheet
2 Mbit ROM + 1 Mbit / 2 Mbit / 256 Kbit SRAM ROM/RAM Combo
SST30VR021 / SST30VR022 / SST30VR023
5
2003 Silicon Storage Technology, Inc.
S71135-04-000
8/03
FIGURE 2: AC I
NPUT
/O
UTPUT
R
EFERENCE
W
AVEFORMS
FIGURE 3: A T
EST
L
OAD
E
XAMPLE
1135 F08.0
REFERENCE POINTS
OUTPUT
INPUT
VIT
VIHT
VILT
VOT
AC test inputs are driven at V
IHT
(0.9 V
DD
) for a logic "1" and V
ILT
(0.1 V
DD
) for a logic "0". Measurement reference points
for inputs and outputs are V
IT
(0.5 V
DD
) and V
OT
(0.5 V
DD
). Input rise and fall times (10%
90%) are <5 ns.
Note: V
IT
- V
INPUT
Test
V
OT
- V
OUTPUT
Test
V
IHT
- V
INPUT
HIGH Test
V
ILT
- V
INPUT
LOW Test
1135 F09.0
TO TESTER
TO DUT
CL