STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10120 - Rev C
DESCRIPTION
STATEK's miniature CX-3-SM AT-cut crystals in leadless
ceramic packages are designed for surface mounting on
printed circuit boards or hybrid circuits. These crystals are low
profile and have a very small land pattern. Maximum process
temperature should not exceed 260
O
C.
FEATURES
Designed for surface mount applications using infrared,
vapor phase, wave solder or epoxy mount techniques.
Low profile (1.5mm) hermetically sealed ceramic
package
Excellent aging characteristics
Available with glass or ceramic lid
High shock and vibration resistance
Custom designs available
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
Industrial, Computer & Communications
General purpose clock oscillator
PCMCIA (FAX, Modem and LAN)
Smart card
PDA and notebook computers
Military & Aerospace
Airborne hybrid computer
Military high speed modem
MCM
CX-3-SM CRYSTAL
9.6 MHz to 160 MHz
Low Profile Miniature At-Cut Surface Mount Crystal
Fundamental Mode: 9.6 MHz - 70 MHz
Third Overtone Mode: 70 MHz - 160 MHz
TYP.
MAX.
DIM
INCHES
mm
INCHES
mm
A
.265
6.73
.280
7.11
B
.103
2.62
.114
2.90
C
-
-
see below
D
.050
1.27
.060
1.52
E
.052
1.32
.062
1.57
DIM "C"
GLASS LID
CERAMIC LID
MAX
INCHES
mm
INCHES
mm
SM1
.058
1.47
.069
1.75
SM2
.060
1.52
.071
1.80
SM3
.063
1.60
.074
1.88
A
B
D
D
D
TOP
BOTTOM
C
E
PACKAGE DIMENSIONS
C
0
C
1
R
1
2
1
L
1
EQUIVALENT CIRCUIT
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
actual size
side view
TM
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10120 - Rev C
TERMINATIONS
Designation
Termination
SM1
Gold Plated
SM2
Nickel, Solder Plated
SM3
Nickel, Solder Plated and Solder Dipped
PACKAGING
CX-3-SM - Tray Pack (Standard)
-16mm tape, 7" or 13" reels (Optional)
Per EIA 481 (see data sheet 10109)
SPECIFICATIONS
Specifications are typical at 25oC unless otherwise noted.
Specifications are subject to change without notice.
10 MHz
32MHz
155.52 MHz
Motional Resistance R
1
( )
60
20
50
Motional Capacitance C
1
(fF)
2.8
7.8
0.5
Quality Factor Q (k)
95
36
41
Shunt Capacitance Co (pF) 1.4
2.4
3.2
Calibration Tolerance*
A 0.01% ( 100ppm)
B 0.1%
C 1.0%
Load Capacitance
20 pF
(Unless specified by customer)
Drive Level
500 W MAX.
Frequency-Temperature
-10
O
C to +70
O
C from 10ppm
Stability**
-40
O
C to +85
O
C from 20ppm
-55
O
C to +125
O
C from 30ppm
Aging, first year
5ppm MAX.
Shock, survival***
3,000g peak, 0.3 msec., 1/2 sine
Vibration, survival
20g rms, 10-2,000 Hz random
Operating Temperature
-10
O
C to +70
O
C Commercial
-40
O
C to +85
O
C Industrial
-55
O
C to +125
O
C Military
Storage Temperature
-55
O
C to +125
O
C
Max Process Temperature
260
O
C for 20 sec.
Note: The characteristics of the frequency temperature stability follow that of AT
cut thickness-shear mode.
* Tighter tolerances available as low as 5 ppm
** Does not include calibration tolerance
*** Higher shock version available
+
_
+
_
+
_
+
_
+
_
+
_
+
_
+
_
SUGGESTED LAND PATTERN
.070[1.78]
.215[5.46]
.120[3.05]
INCHES[mm]
HOW TO ORDER CX-3-SM CRYSTALS
CX-3
SM1
32 MHz
(
25ppm
/
25ppm
/
50ppm
/
I
)
"S" if special or
O.T.=3
RD
O.T. Mode
C=Ceramic Lid
SM1
Frequency
Calibration
Frequency
Total Frequency Temp. Range:
custom design.
Blank=Fundamental Blank=Glass Lid SM2
Tolerance*
Stability over
Tolerance
C = Commercial
Blank if Std.
Mode
SM3
@25
O
C
Temp. Range
I = Industrial
(A)
M = Military
(B)
S = Specify
(C)
*Other calibration fill in ppm.
AMPLIFIER
BUFFER
C
G
C
D
R
A
CX-1
Contact factory for
design guidelines
OSC
Freq (f )
O
R
f
C
S
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
CX-3
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