PCN DSG-COM/03/145
PCN LEADFREE PLATING FOR SO8
PACKAGE IN MUAR first lines
2003/02/7
PRODUCT/PROCESS
CHANGE NOTIFICATION
PCN
DSG-COM/03/145
Product Family /Commercial Product
STANDARD LINEAR products in SO8 package
Type Of Change
Package assembly process change
Reason For Change
Environmental directive
Description of the change
To remove lead from plating by using
preplating nickel palladium gold leadframe
NiPdAu. This change will not affect
ELECTRICAL & MECHANICAL
parameters. Samples available:
LM393DT/LM358DT. Other samples: on
request. PLEASE BOOK YOUR SAMPLE ORDER IN
NON-STANDARD WITH THE FOLLOWING COMMENT "AS
PER LEADFREE PCN DSG-COM/03/145".
Forecasted date of change
07-May-2003
Forecasted date of samples for customer
07-Feb-2003
Forecasted date for STMicroelectronics change 07-Feb-2003
qualification report availability
Marking to identify changed product
"E" letter on the package close to ST LOGO
Description of qualification program
See Attached Qualification Plan
Product Line(s) and/or Part Number(s)
See Attached List
Manufacturing Location(s)
Estimated Date of first shipment
07-May-2003
Division Product Manager
Jean Claude KAIRE
Date: Jan.29 ,03
Division Q.A. Manager
Francoise PACCARD
Date: Jan.29 ,03
Qualification Plan Denied
Name:
Qualification Plan Approved
Title:
Customer Acknowledgement of Receipt
PCN DSG-COM/03/145
Please sign and return to STMicroelectronics Sales Office
Company:
Change Denied
Date:
Change Approved
Signature:
Remark
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2003/02/7
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Process Change/ Transfer
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Reference documents:
SOP 2.5.9
Process critical and key parameters
0076604 Process Qualification and release to production
0078588 Reliability requirements for product qualification
0046008 Process control plan for Front End
0060531 FMEA procedure
0061050 Back end qualification procedure
0091984 Construction analysis
0037709 Package construction analysis
7006451 Management of manufacturing source change
0033689 Process flow chart
PROCESS CHANGE / TRANSFER
QUALIFICATION REPORT
PCN reference: DSG-COM/03/145
Qualification Report n: QASO8N91
Qualification Type: Material change
Process: Leadfree plating
New glue Hitachi 4900
Date of issue: 22th January 2003
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Process Change/ Transfer
Qualification report n QASO8N91
Content
1 PROCESS MAIN SPECIFICATION CHANGE
1.1 Process change description
1.2 Process main specification change
1.3 Possible effects of change on Parametric, Electrical, Quality or Reliability
2 QUALIFICATION PLAN
2.1 Test vehicle description
2.2 Process qualification requirements
2.3 E WS qualification requirements
2.4 Final Test qualification requirements
2.5 Bench Test requirements
2.6 Reliability qualification requirements
3 QUALIFICATION RESULTS
3.1 Process qualification results
3.2 EWS qualification results
3.3 Final Test qualification results
3.4 Bench Test qualification results
3.5 Reliability qualification results
4 PROCESS CHANGE QUALIFICATION CERTIFICATE
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Process Change/ Transfer
Qualification report n QASO8N91
1.
PROCESS MAIN SPECIFI CATION CHANGE
1.1
Process change description.
1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi
4900)
1.1.2
Reason for Change: To be compliant with Environmental directives.
1.1.3
Affected process: SO8 assembled in ST Muar
1.1.4
Affected products: All standard linear devices assembled in SO8
1.1.5 Implementation date: April 2003
1.2 DETAILLED DESCRIPTION OF CHANGE
New Process
Current Process
Assembly site
ST Muar (Malaysia)
ST Muar (Malaysia)
Assembly flow + Control Plan
7124337
7071671
Frame (material)
Copper +
NiPdAu preplating
Copper
Die attach material
Hitachi 4900ST
Ablebond 8390
Wire material
Wire diameter
Gold
1 MIL
Gold
1 MIL
Mold compound
MP8000 CH4
MP8000 CH4
Wire bond method
Thermosonic
Thermosonic
Lead finishing
NiPdAu (preplated)
Tin plating (SnPb85/15)
LEAD-FREE components are defined by STMicroelectronics as ECOPACK components.
The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used
the lead finishing of components.
The identification of ECOPACK products will be achieved through specific labelling on component boxes.
Whenever possible, the letter "E" will be added in the marking pattern beside the ST logo on the package
body.
1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR
RELIABILITY DATA
No effect on solderability:
ECOPACK components are solderable with both current SnPb and AgSnCu lead -
free PCB assembly processes.
Reliability improvement:
In addition to the change of connection coating, a change in materials (glue) occurs
in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using,
in particular, the IPC/JEDEC JSTD020B standard as reference.
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