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STPS3150/U
April 2003 - Ed: 1A
POWER SCHOTTKY RECTIFIER
150V Power Schottky rectifier are suited for switch
Mode Power Supplies on up to 24V rails and high
frequency converters.
Packaged in SMB and Axial, this device is
intended for use in consumer & computer
applications like TV, STB, PC and DVD where low
drop forward voltage in required to reduce power
dissipation.
DESCRIPTION
s
NEGLIGIBLE SWITCHING LOSSES
s
LOW
FORWARD
VOLTAGE
DROP
FOR
HIGHER
EFFICIENCY
AND
EXTENDED
BATTERY LIFE
s
LOW THERMAL RESISTANCE
FEATURES AND BENEFITS
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
150
V
I
F(RMS)
RMS forward current
15
A
I
F(AV)
Average forward current
T
L
= 130C
= 0.5 SMB
3
A
T
L
= 140C
= 0.5 DO-201AD
I
FSM
Surge non repetitive forward current Half wave, single
phase, 50Hz
SMB
100
A
DO-201AD
150
T
stg
Storage temperature range
- 65 to + 150
C
T
j
Maximum junction temperature *
175
C
dV/dt
Critical rate of rise of reverse voltage (rated V
R
, T
j
= 25C)
10000
V/
s
ABSOLUTE RATINGS (limiting values)
I
F(AV)
3 A
V
RRM
150 V
Tj (max)
175C
V
F
(max)
0.66 V
MAIN PRODUCT CHARACTERISTICS
DO-201AD
STPS3150
* :
dPtot
dTj
Rth j
a
<
-
1
(
)
thermal runaway condition for a diode on its own heatsink
SMB
STPS3150U
STPS3150/U
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Symbol
Parameter
Value
Unit
R
th(j-l)
Junction to leads
Lead length = 10 mm
DO-1201AD
20
C/W
SMB
15
THERMAL RESISTANCES
Symbol
Parameter
Tests conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
T
j
= 25C
V
R
= 150V
0.4
2.0
A
T
j
= 125C
0.6
2.0
mA
V
F
*
Forward voltage drop
T
j
= 25C
I
F
= 3 A
0.78
0.82
V
T
j
= 125C
0.63
0.67
T
j
= 25C
I
F
= 6 A
0.85
0.89
T
j
= 125C
0.70
0.75
Pulse test : * tp = 380
s,
< 2%
To evaluate the maximum conduction losses use the following equation:
P = 0.59 x I
F(AV)
+ 0.023 x I
F
2
(RMS)
STATIC ELECTRICAL CHARACTERISTICS
P
(W)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
(A)
F(AV)
T
=tp/T
tp
= 1
= 0.5
= 0.05
= 0.1
= 0.2
Fig. 1: Conduction losses versus average current.
I
(A)
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
25
50
75
100
125
150
175
T
=tp/T
tp
T
(C)
amb
R
=75C/W
th(j-a)
R
=R
th(j-a)
th(j-I)
DO-201AD
SMB
Fig. 2: Average forward current versus ambient
temperature (
= 0.5).
I (A)
M
0
1
2
3
4
5
6
7
8
9
10
11
12
1.E-03
1.E-02
1.E-01
1.E+00
I
M
t
=0.5
t(s)
T =25C
a
T =75C
a
T =125C
a
SMB
Fig. 3-1: Non repetitive surge peak forward current
versus overload duration (maximum values)
(SMB).
I (A)
M
0
2
4
6
8
10
12
14
1.E-03
1.E-02
1.E-01
1.E+00
I
M
t
=0.5
t(s)
T =25C
a
T =75C
a
T =125C
a
DO-201AD
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values)
(DO-201AD).
STPS3150/U
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Z
/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
=tp/T
tp
t (s)
p
SMB
= 0.5
= 0.2
= 0.1
Single pulse
Fig. 4-1: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB).
Z
/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
=tp/T
tp
t (s)
p
= 0.5
= 0.2
= 0.1
Single pulse
DO-201AD
Fig. 4-2: Relative variation of thermal impedance
junction
to
ambient
versus
pulse
duration
(DO-201AD).
I (A)
R
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0
25
50
75
100
125
150
V (V)
R
T =125C
j
T =150C
j
T =100C
j
T =50C
j
T =25C
j
T =75C
j
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
C(nF)
10
100
1000
1
10
100
1000
F=1MHz
V
=30mV
T =25C
OSC
RMS
j
V (V)
R
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
I
(A)
FM
1
10
100
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
V
(V)
FM
T =25C
(maximum values)
j
T =125C
(typical values)
j
T =125C
(maximum values)
j
Fig. 7: Forward voltage drop versus forward
current.
R
(C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S(cm)
SMB
Fig. 8: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, Cu: 35m) (SMB).
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PACKAGE MECHANICAL DATA
SMB
E
C
L
E1
D
A1
A2
b
1.52
2.75
2.3
1.52
FOOT PRINT DIMENSIONS (in millimeters)
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
R (C/W)
th
0
10
20
30
40
50
60
70
80
90
5
10
15
20
25
R
th(j-I)
R
th(j-a)
L
(mm)
leads
DO-201AD
Fig. 9: Thermal resistance versus lead length
(DO-201AD).
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2003 STMicroelectronics - Printed in Italy - All rights reserved.
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Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS3150
STPS3150
DO-201AD
1.12 g
600
Ammopack
STPS3150RL
STPS3150
DO-201AD
1.12 g
1900
Tape & Reel
STPS3150U
G315
SMB
0.107 g
2500
Tape & Reel
s
Epoxy meets UL94,V0
PACKAGE MECHANICAL DATA
DO-201AD plastic
B
A
E
E
D
D
C
B
note 2
note 1
note 1
REF.
DIMENSIONS
NOTES
Millimeters
Inches
Min.
Max.
Min.
Max.
A
9.50
0.374
1 - The lead diameter
D is not controlled over zone E
2 - The minimum length which must stay straight between
the right angles after bending is 0.59"(15 mm)
B
25.40
1.000
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
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