1/5
BAT20J
April 2004 - Ed: 1
HIGH EFFICIENCY SWITCHING AND
ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE
Low conduction losses
Very low reverse current
Negligible switching losses
Low capacitance diode
Low forward and reverse recovery times
Extremely fast switching
Surface mount device
FEATURES AND BENEFITS
The BAT20J is using 23V schottky barrier diode
encapsulated on a SOD-323 package. This is spe-
cially suited for switching mode in mobile phone
and PDA power management applications or LED
driver circuits (step up converters).
DESCRIPTION
SOD-323
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
23
V
I
F(RMS)
Repetitive peak forward current
2
A
I
F(AV)
Average forward current
= 0.38
1
A
I
FSM
Surge non repetitive forward current (t
p
=10ms sinusoidal)
5
A
T
stg
Maximum storage temperature range
- 65 to +150
C
Tj
Maximum operating junction temperature *
150
C
TL
Maximum temperature for soldering during *
260
C
ABSOLUTE RATINGS (limiting values)
* :
dPtot
dTj
Rth j
a
<
-
1
(
)
thermal runaway condition for a diode on its own heatsink
I
F(AV)
1 A
V
RRM
23 V
I
R
25C(max) @ 15V
12 A
Tj (max)
150 C
MAIN PRODUCT CHARACTERISTICS
Part Number
Marking
BAT20JFILM
20
Order code
A
K
BAT20J
2/4
Symbol
Parameter
Value
Unit
R
th (j-a)
Junction to Ambient (*)
600
C/W
(*) Mounted on epoxy board without copper heat sink.
THERMAL RESISTANCE
Symbol
Parameters
Tests conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
(see note 1)
Tj = 25C
V
R
= 5 V
V
R
= 8 V
V
R
= 15 V
0.65
0.88
3.00
2
3
12
A
I
R
*
Reverse leakage current
Tj = 85C
V
R
= 5 V
V
R
= 8 V
V
R
= 15 V
55
70
120
120
150
250
V
F
**
Forward voltage drop
Tj = 25C
I
F
= 10 mA
I
F
= 100 mA
I
F
= 1 A
0.28
0.35
0.54
0.31
0.40
0.62
V
*
Pulse test tp = 380 s,
< 2%
** Pulse test tp = 5 ms,
< 2%
Note 1: I
R
at 23 V and Tj = 25C is equal to 60 A typ.
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameters
Tests conditions
Min.
Typ.
Max.
Unit
C
d
Diode capacitance
V
R
= 5 V
F = 1 MHz
20
30
pF
To evaluate the maximum conduction losses, use the following equations :
P = 0.32 x I
F(AV)
+ 0.23 x I
F
2
(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
BAT20J
3/5
I (A)
P
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
25
50
75
100
125
150
T
(C)
amb
T
=tp/T
tp
Printed circuit board FR4
S
=2.25mm
CU
2
Fig. 1: Peak forward current versus ambient
temperature (
= 0.11).
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0
25
50
75
100
125
150
I
(A)
F(AV)
T
=tp/T
tp
T
(C)
amb
Printed circuit board FR4
S
=2.25mm
CU
2
Fig. 2: Average forward current versus ambient
temperature (
= 0.5).
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Z
/R
th(j-a)
th(j-a)
t (s)
p
Single pulse
S
=2.25mm
CU
2
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration .
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0
25
50
75
100
125
150
I (T
R
j
R
j
) /
=25C
I (T
)
T (C)
j
V =5V
R
Fig. 5: Relative variation of reverse leakage
currrent versus junction temperature (typical
values).
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0
2
4
6
8
10
12
14
16
18
20
22
24
I (A)
R
V (V)
R
T =25C
j
T =85C
j
T =150C
j
Fig. 4: Reverse leakage currrent versus reverse
voltage applied (typical values).
1
10
100
1
10
100
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25C
OSC
RMS
j
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
BAT20J
4/5
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
I
(A)
FM
T =25C
j
T =85C
j
T =150C
j
V
(V)
FM
Fig. 7-1: Forward voltage drop versus forward
current (typical values, high level).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
I
(A)
FM
T =85C
(typical values)
j
T =25C
(maximum values)
j
T =150C
(typical values)
j
T =25C
(typical values)
j
V
(V)
FM
Fig. 7-2: Forward voltage drop versus forward
current (low level).
0
50
100
150
200
250
300
350
400
450
500
550
600
0
5
10
15
20
25
30
35
40
45
50
R
(C/W)
th(j-a)
S
(mm
Cu
)
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (epoxy
printed circuit board FR4, e
CU
=35m, typical
values).
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
0
50
100
150
200
250
300
350
400
R
(C/W)
th(j-a)
P(mW
)
S
=2.25mm
CU
2
T
=25C
amb
Fig. 9: Thermal resistance junction to ambient
versus power dissipation (epoxy printed circuit
board FR4, e
CU
=35m, typical values).
BAT20J
5/5
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not au-
thorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners.
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PACKAGE MECHANICAL DATA
SOD-323
H
b
D
E
A1
A
L
Q1
c
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
1.13
0.045
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.35
0.044
0.053
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
BAT20JFILM
20
SOD-323
0.005g
3000
Tape & reel
Epoxy meets UL94,V0
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