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EMIF02-MIC02F1
September 2003 - Ed: 4A
IEC61000-4-2
Level 4
on input pins
15kV
(air discharge)
8 kV
(contact discharge)
Level 1
on output pins
2kV
(air discharge)
2kV
(contact discharge)
MIL STD 883E - Method 3015-6 Class 3
COMPLIES WITH THE FOLLOWING STANDARDS:
Flip Chip package
B
1
2
3
A
I1
O1
GND
GND
I2
O2
PIN CONFIGURATION (ball side)
s
EMI symmetrical (I/O) low-pass filter
s
High efficiency in EMI filtering
s
Very low PCB space consuming: 1.07mm x 1.57mm
s
Very thin package: 0.65 mm
s
High efficiency in ESD suppression
s
High reliability offered by monolithic integration
s
High reducing of parasitic elements through integration
& wafer level packaging.
BENEFITS
2 LINES EMI FILTER
AND ESD PROTECTION
IPAD
TM
Where EMI filtering in ESD sensitive equipment is
required :
s
Mobile phones and communication systems
s
Computers, printers and MCU Boards
MAIN PRODUCT CHARACTERISTICS:
The EMIF02-MIC02 is a highly integrated devices
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The EMIF02
flip chip packaging means the package size is equal to the
die size.
This filter includes an ESD protection circuitry which
prevents the device from destruction when subjected to
ESD surges up 15kV.
DESCRIPTION
TM : IPAD is a trademark of STMicroelectronics.
Input
Output
GND
GND
GND
Low-pass Filter
Ri/o = 470
Cline = 16pF
BASIC CELL CONFIGURATION
EMIF02-MIC02F1
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Symbol
Parameter and test conditions
Value
Unit
T
j
Maximum junction temperature
125
C
T
op
Operating temperature range
-40 to + 85
C
T
stg
Storage temperature range
-55 to 150
C
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
V
BR
Breakdown voltage
I
RM
Leakage current @ V
RM
V
RM
Stand-off voltage
V
CL
Clamping voltage
R
d
Dynamic impedance
I
PP
Peak pulse current
R
I/O
Series resistance between Input & Output
C
line
Input capacitance per line
ELECTRICAL CHARACTERISTICS (T
amb
= 25 C)
I
V
I
PP
V
CL
V
BR
V
RM
I
R
I
RM
I
RM
I
R
I
PP
V
RM
V
BR
V
CL
Symbol
Test conditions
Min.
Typ.
Max.
Unit
V
BR
I
R
= 1 mA
14
16
V
I
RM
V
RM
= 12V per line
500
nA
R
I/O
423
470
517
C
line
@ 0V
16
pF
1.0M
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
- 50.00
- 45.00
- 40.00
- 35.00
- 30.00
- 25.00
- 20.00
- 15.00
- 10.00
dB
f/Hz
dB
Measurement
Simulation
Fig. 1: S21(dB) attenuation measurement and
Aplac simulation.
1.0M
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
dB
f/Hz
-
-
-
-
-
-
I2/O1
Fig. 2: Analog crosstalk measurements.
EMIF02-MIC02F1
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Fig. 3: Digital crosstalk measurement.
Fig. 4: ESD response to IEC61000-4-2 (+15kV air
discharge) on one input V(in) and on one output
(Vout).
Fig. 5: ESD response to IEC61000-4-2 (-15kV air
discharge) on one input V(in) and on one output
(Vout).
0
2
4
6
8
10
12
14
16
18
20
0
1
2
3
4
5
6
7
8
9
10
11
12
V (V)
R
F=1MHz
V
osc
=30mV
RMS
T
j
=25C
C(pF)
Fig. 6: Line capacitance versus applied voltage.
EMIF02-MIC02F1
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Aplac model.
Model D01-ext
BV = 7
CJO = Cz_ext
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_ext
VJ = 0.6
TT = 50n
aplacvar Ls 400pH
aplacvar Rs 100m
aplacvar R_470R 482.6
aplacvar Cz_ext 8.73pF
aplacvar Rs_ext 850m
aplacvar Cz_int 2.9pF
aplacvar Rs_int 850m
aplacvar Cz_gnd 215.61pF
aplacvar Rs_gnd 470m
aplacvar Rgnd 10m
aplacvar Lgnd 48pH
aplacvar Cgnd 0.15pF
aplacvar Cox 3.05pF
aplacvar Rsubump 200m
Model D01-int
BV = 7
CJO = Cz_int
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_int
VJ = 0.6
TT = 50n
Model D01-gnd
BV = 7
CJO = Cz_gnd
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_gnd
VJ = 0.6
TT = 50n
Aplac parameters.
MODEL = D01-gnd
Rsubump
Rsubump
Cox
Cox
Rsubump
Cox
Rsubump
Cox
gnd
MODEL = D01-ext
MODEL = D01-int
MODEL = D01-ext
MODEL = D01-int
R_470R
R_470R
I2
I1
O1
O2
gnd
50pH
50m
Lgnd
Rgnd
Cgnd
50pH
50m
Lgnd
Rgnd
Cgnd
EMIF02-MIC02F1 model
Ground return
EMIF yy
F x
-
xxx zz
EMI Filter
Number of lines
x: resistance value (Ohms) z: capacitance value / 10(pF)
or
Application (3 letters) and Version (2 digits)
Flip Chip
1: Pitch = 500m
Bump = 315m
2: Leadfree Pitch = 500m
Bump = 315m
ORDER CODE
EMIF02-MIC02F1
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1.07mm 50m
1.57mm 50m
500m 50
315m 50
500m 50
650m 65
PACKAGE MECHANICAL DATA
FLIP CHIP
365
365
240
40
220
x
y
x
w
x
w
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
All dimensions in m
MARKING
Copper pad Diameter :
250m recommended , 300m max
Solder stencil opening : 330m
Solder mask opening recommendation :
340m min for 300m copper pad diameter
FOOT PRINT RECOMMENDATIONS
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