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EMIF10-LCD01F1
November 2003 - Ed: 2A
IEC61000-4-2
Level 4 input pins
15kV (air discharge)
8 kV
(contact discharge)
Level 1 output pins 2kV
(air discharge)
2kV
(contact discharge)
MIL STD 883E - Method 3015-6 Class 3
COMPLIES WITH THE FOLLOWING STANDARDS:
Flip Chip package
A
B
C
D
E
1
2
3
4
5
O10
O8
O6
O4
O2
O9
O7
O5
O3
O1
I10
I8
I6
I4
I2
I9
GND
GND
GND
I5
I1
I7
GND
GND
I3
PIN CONFIGURATION (ball side)
s
EMI symmetrical (I/O) low-pass filter
s
High efficiency in EMI filtering
s
Very low PCB space consuming:
2.64mm x 2.64mm
s
Very thin package: 0.65 mm
s
High efficiency in ESD suppression on input
pins (IEC6100-4-2 level 4)
s
High reliability offered by monolithic integration
s
High reducing of parasitic elements through in-
tegration & wafer level packaging.
BENEFITS
10 LINES EMI FILTER
AND ESD PROTECTION
IPAD
TM
Where EMI filtering in ESD sensitive equipment is
required :
s
LCD for Mobile phones
s
Computers and printers
s
Communication systems
s
MCU Boards
MAIN PRODUCT CHARACTERISTICS:
The EMIF10-LCD01F1 is a 10 lines highly
integrated devices designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interferences. The EMIF10 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
DESCRIPTION
TM : IPAD is a trademark of STMicroelectronics.
Input
GND
GND
GND
Output
Low-pass Filter
Ri/o = 100
Cline = 35pF
BASIC CELL CONFIGURATION
EMIF10-LCD01F1
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I
V
I
F
I
RM
I
R
I
PP
V
RM
V
F
V
BR
V
CL
Fig. 1: S21(dB) all lines attenuation measurement
and Aplac simulation.
Fig. 2: Analog crosstalk measurements.
Symbol
Parameter and test conditions
Value
Unit
T
j
Maximum junction temperature
125
C
T
op
Operating temperature range
-40 to + 85
C
T
stg
Storage temperature range
-55 to +150
C
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 C)
Symbol
Parameters
V
BR
Breakdown voltage
I
RM
Leakage current @ V
RM
V
RM
Stand-off voltage
V
CL
Clamping voltage
R
d
Dynamic impedance
I
PP
Peak pulse current
R
I/O
Series resistance between Input &
Output
C
line
Input capacitance per line
ELECTRICAL CHARACTERISTICS (T
amb
= 25C)
Symbol
Test conditions
Min
Typ
Max
Unit
V
BR
I
R
= 1mA
6
8
10
V
I
RM
V
RM
= 3V
500
nA
R
I/O
90
100
110
C
line
At 0V bias
35
pF
Rt / Ft
Induced rise and fall time 10-90% at 26 MHz fre-
quency signal V = 1.9 V (Rt / Ft input 1 ns, 50
impedance generator)
8
(1)
ns
(1) guaranteed by design
EMIF10-LCD01F1
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V
in
V
out
Fig. 3: ESD response to IEC61000-4-2 (+15kV air
discharge) on one input and one output.
Fig. 6: Rise
time 10-90% measurements with
1.9V signal at 26 MHz frequency (50
generator).
0
5
10
15
20
25
30
35
0.0
1.0
2.0
3.0
4.0
5.0
VLine(V)
CLine(pF)
Fig. 5: Line capacitance versus applied voltage.
Fig. 7: Fall time 10-90% measurements with 1.9V
signal at 26 MHz frequency (50
generator).
Fig. 4: ESD response to IEC61000-4-2 (-15kV air
discharge) on one input and one output.
EMIF10-LCD01F1
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EMIF10-LCD01F1 model
Ground return
Aplac model.
ZRZ structure
aplacvar Remif10low 100
aplacvar Cemif10flow 17.5pF
Bumps
aplacvar Lbump 50pH
aplacvar Rbump 20m
aplacvar Cbump 1.5pF
Bulk
aplacvar Rsub 100m
Gnd connections
aplacvar Rgnd 100m
aplacvar Lgnd 200pH
aplacvar Cgnd 0.15pF
BV = 7
CJO = Cemif10low
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = 0.015
VJ = 0.6
TT = 50n
Aplac parameters.
EMIF yy
F x
-
xxx zz
EMI Filter
Number of lines
x: resistance value (Ohms) z: capacitance value / 10(pF)
or
Application (3 letters) and Version (2 digits)
Flip Chip
1: Pitch = 500m Bump = 315m
2: Leadfree Pitch = 500m Bump = 315m
3: Leadfree Pitch = 400m Bump = 250m
4: Pitch = 500m Bump = 250m
ORDER CODE
EMIF10-LCD01F1
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250m 40
650m 65
2.64mm 50m
2.64mm 50m
315m 50
500m 50
500m 50
PACKAGE MECHANICAL DATA
FLIP CHIP
545
545
400
100
230
x
y
x
w
x
w
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
All dimensions in m
MARKING
Copper pad Diameter :
250m recommended , 300m max
Solder stencil opening : 330m
Solder mask opening recommendation :
340m min for 315m copper pad diameter
FOOT PRINT RECOMMENDATIONS
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