MIL-PRF-19500/376E
31 August 2000
SUPERSEDING
MIL-PRF-19500/376D
21 August 1998
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER
TYPES 2N2484, 2N2484UA, 2N2484UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for NPN, silicon, low-power transistors.
Four levels of product assurance is provided for each device type as specified in MIL-PRF-19500. Two levels of
product assurance are provided for die.
1.2 Physical dimensions. See figure 1 (similar to T0-18), figures 2 and 3 (surface mount case outlines UA and
UB), and figures 4 and 5 (die).
1.3 Maximum ratings.
P
T
V
CBO
V
EBO
V
CEO
I
C
T
J
and T
STG
R
JA
R
JC
Types
T
A
= +25
C
mW
V dc
V dc
V dc
mA dc
C
C/W
C/W
2N2484
500 (1)
60
6
60
50
-65 to +200
325
146
2N2484UA
650 (2)
60
6
60
50
-65 to +200
210
160
2N2484UB
500 (1)
60
6
60
50
-65 to +200
325
146
(1) Derate linearly at 3.08 mW/
C above T
A
= +37.5
C
(2) Derate linearly at 4.76 mW/
C above T
A
= +63.5
C.
1.4 Primary electrical characteristics.
h
fe
C
obo
|h
fe
|2
V
CE(sat)
(1)
Limits
V
CE
= 5 V dc
I
C
= 1 mA dc
f = 1 kHz
I
E
= 0
V
CB
= 5 V dc
100 kHz
f
1 MHz
I
C
= 500
A dc
V
CE
= 5 V dc
f = 30 MHz
I
C
= 1.0 mA dc
I
B
= 0.1 mA dc
Min
Max
250
900
pF
5.0
2.0
7.0
V dc
0.3
(1) Pulsed (see 4.5.1).
AMSC N/A
FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
The documentation and process
conversion measures necessary to
comply with this revision shall be
completed by 31 November 2000.
INCH-POUND
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC/VAC,
Post Office Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal
(DD Form 1426) appearing at the end of this document or by letter.
MIL-PRF-19500/376E
2
Dimensions
Symbol
Inches
Millimeters
Note
Min
Max
Min
Max
CD
.178
.195
4.52
4.95
CH
.170
.210
4.32
5.33
HD
.209
.230
5.31
5.84
LC
.100 TP
2.54 TP
6
LD
.016
.021
0.41
0.53
7,8
LL
.500
.750
12.7
0
19.05
7,8
LU
.016
.019
0.41
0.48
7,8
L1
---
.050
---
1.27
7,8
L2
.250
---
6.35
---
7,8
Q
---
.040
---
0.86
5
TL
.028
.048
0.71
1.22
3,4
TW
.036
.046
0.91
1.17
3
r
---
.010
---
0.25
10
45
TP
45
TP
6
NOTES:
1.
Dimension are in inches.
2.
Metric equivalents are given for general information only.
3.
Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).
4.
Dimension TL measured from maximum HD.
5.
Body contour optional within zone defined by HD, CD, and Q.
6.
Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall
be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition
(MMC) relative to tab at MMC.
7.
Dimension LU applies between L
1
and L
2
. Dimension LD applies between L
2
and LL
minimum. Diameter is uncontrolled in L
1
and beyond LL minimum.
8.
All three leads.
9.
The collector shall be internally connected to the case.
10.
Dimension r (radius) applies to both inside corners of tab.
11.
In accordance with ANSI Y14.5M, diameters are equivalent to
x symbology.
12.
Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 1. Physical dimensions (similar to TO-18).
MIL-PRF-19500/376E
3
Dimensions
Symbol
Inches
Millimeters
Note
Min
Max
Min
Max
A
.061
.075
1.55
1.90
3
A1
.029
.041
0.74
1.04
B1
.022
.028
0.56
0.71
B2
.075 REF
1.91 REF
B3
.006
.022
0.15
0.56
5
D
.145
.155
3.68
3.93
D1
.045
.055
1.14
1.39
D2
.0375 BSC
.952 BSC
D3
---
.155
---
3.93
E
.215
.225
5.46
5.71
E3
---
.225
---
5.71
L1
.032
.048
0.81
1.22
L2
.072
.088
1.83
2.23
L3
.003
.007
0.08
0.18
5
NOTES:
1.
Dimensions are in inches.
2.
Metric equivalents are given for general information only.
3.
Dimension "A" controls the overall package thickness. When a window lid is used, dimension "A" must
increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
4.
The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option, from that shown on
the drawing.
5.
Dimensions "B3" minimum and "L3" minimum and the appropriately castellation length define an
unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was
designed. (Castellations are required on bottom two layers, optional on top ceramic layer.) Dimension
"B3" maximum and "L3" maximum define the maximum width and depth of the castellation at any point on
its surface. Measurement of these dimensions may be made prior to solder dipping.
6.
Lead 4 = no connection.
FIGURE 2. Physical dimensions, surface mount (2N2484UA).
MIL-PRF-19500/376E
4
Dimensions
Inches
Millimeters
Notes
Ltr
Min.
Max.
Min.
Max.
A
.046
.056
0.97
1.42
A1
.017
.035
0.43
0.89
B1
.016
.024
0.41
0.61
3
D
.085
.108
2.41
2.74
D1
.071
.079
1.81
2.01
D2
.035
.039
0.89
0.99
D3
E
.115
.128
2.82
3.25
E3
L1
.022
.038
0.56
0.96
4
NOTES:
1.
Dimensions are in inches.
2.
Metric equivalents are given for general information only.
3.
Dimensions B2 and B3 are identical to B1
4.
Dimension L2 is identical to L1.
FIGURE 3. Physical dimensions, surface mount (2N2484UB).
MIL-PRF-19500/376E
5
A- version
NOTES:
1.
Die size ...............................................0.015 x 0.019 inches
0.001 inch
2.
Die thickness.......................................0.010
0.0015 inches
3.
Top metal............................................Aluminum 15,000 minimum, 18,000 nominal
4.
Back metal..........................................A. Gold 2,500 minimum, 3,000 nominal
B. Eutectic Mount No Gold
5.
Backside .............................................Collector
6.
Bonding pad........................................B = 0.003 inches, E = 0.004 inches diameter
7.
Passivation .........................................Si
3
N
4
(Silicon Nitride) 2k min, 2.2k nom.
FIGURE 4. Physical dimensions, JANHC and JANKC die, A - version.
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